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Characterization of IMC layer and its effect on thermomechanical fatigue life of Sn―3.8Ag―0.7Cu solder jointsCHE, F. X; PANG, John H. L.Journal of alloys and compounds. 2012, Vol 541, pp 6-13, issn 0925-8388, 8 p.Article

Nanoindentation on SnAgCu lead-free solder joints and analysisLUHUA XU; PANG, John H. L.Journal of electronic materials. 2006, Vol 35, Num 12, pp 2107-2115, issn 0361-5235, 9 p.Article

Impact of Thermal Cycling on Sn-Ag-Cu Solder Joints and Board-Level Drop ReliabilityLUHUA XU; PANG, John H. L; FAXING CHE et al.Journal of electronic materials. 2008, Vol 37, Num 6, pp 880-886, issn 0361-5235, 7 p.Article

Vibration reliability test and finite element analysis for flip chip solder jointsCHE, F. X; PANG, John H. L.Microelectronics and reliability. 2009, Vol 49, Num 7, pp 754-760, issn 0026-2714, 7 p.Article

Digital image correlation for solder joint fatigue reliability in microelectronics packagesSUN YAOFENG; PANG, John H. L.Microelectronics and reliability. 2008, Vol 48, Num 2, pp 310-318, issn 0026-2714, 9 p.Article

Experimental and numerical investigations of near-crack-tip deformation in a solder alloyYAOFENG SUN; PANG, John H. L.Acta materialia. 2008, Vol 56, Num 3, pp 537-548, issn 1359-6454, 12 p.Article

Study of optimal subset size in digital image correlation of speckle pattern imagesSUN YAOFENG; PANG, John H. L.Optics and lasers in engineering. 2007, Vol 45, Num 9, pp 967-974, issn 0143-8166, 8 p.Article

In-situ electromigration study on Sn-Ag-Cu solder joint by digital image speckle analysisLUHUA XU; PANG, John H. L.Journal of electronic materials. 2006, Vol 35, Num 11, pp 1993-1999, issn 0361-5235, 7 p.Conference Paper

Flip chip on board solder joint reliability analysis using 2-D and 3-D FEA modelsPANG, John H. L; CHONG, D. Y. R.IEEE transactions on advanced packaging. 2001, Vol 24, Num 4, pp 499-506, issn 1521-3323Article

Evaluation on Influencing Factors of Board-Level Drop Reliability for Chip Scale Packages (Fine-Pitch Ball Grid Array)CHONG, Desmond Y. R; CHE, F. X; PANG, John H. L et al.IEEE transactions on advanced packaging. 2008, Vol 31, Num 1, pp 66-75, issn 1521-3323, 10 p.Article

Low cycle fatigue study of lead free 99.3Sn-0.7Cu solder alloyPANG, John H. L; XIONG, B. S; LOW, T. H et al.International journal of fatigue. 2004, Vol 26, Num 8, pp 865-872, issn 0142-1123, 8 p.Article

Low cycle fatigue models for lead-free soldersPANG, John H. L; XIONG, B. S; LOW, T. H et al.Thin solid films. 2004, Vol 462-63, pp 408-412, issn 0040-6090, 5 p.Conference Paper

Lead-free 96.5Sn-3.5Ag flip chip solder joint reliability analysisPANG, John H. L; YEO, Alfred; LOW, T. H et al.InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems. 2004, isbn 0-7803-8357-5, Vol2, 160-164Conference Paper

Mechanical characterization in failure strength of silicon diceCHONG, Desmond Y. R; LEE, W. E; LIM, B. K et al.InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems. 2004, isbn 0-7803-8357-5, Vol2, 203-210Conference Paper

Mechanical and microstructural characterization of high aspect ratio through-wafer electroplated copper interconnectsDIXIT, Pradeep; LUHUA XU; JIANMIN MIAO et al.Journal of micromechanics and microengineering (Print). 2007, Vol 17, Num 9, pp 1749-1757, issn 0960-1317, 9 p.Article

Modeling thermo-mechanical reliability of bumpless flip chip packageCHE, F. X; LOW, T. H; PANG, John H. L et al.Proceedings - Electronic Components Conference. 2004, issn 0569-5503, isbn 0-7803-8365-6, 2Vol, Vol 1, 421-426Conference Paper

Thermal cycling aging effects on Sn-Ag-Cu solder joint microstructure, IMC and strengthPANG, John H. L; LOW, T. H; XIONG, B. S et al.Thin solid films. 2004, Vol 462-63, pp 370-375, issn 0040-6090, 6 p.Conference Paper

Lead-free 95.5Sn-3.8Ag-0.7Cu solder joint reliability analysis for micro-BGA assemblyPANG, John H. L; LOW, Patrick T. H; XIONG, B. S et al.InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems. 2004, isbn 0-7803-8357-5, Vol2, 131-136Conference Paper

Vibration fatigue analysis for FCOB solder jointsPANG, John H. L; CHE, F. X; LOW, T. H et al.Proceedings - Electronic Components Conference. 2004, issn 0569-5503, isbn 0-7803-8365-6, 2Vol, Vol 1, 1055-1061Conference Paper

Drop impact reliability testing for lead-free and lead-based soldered IC packagesCHONG, Desmond Y. R; CHE, F. X; PANG, John H. L et al.Microelectronics and reliability. 2006, Vol 46, Num 7, pp 1160-1171, issn 0026-2714, 12 p.Article

Electromigration effect on intermetallic growth and Young's modulus in SAC solder jointLUHUA XU; PANG, John H. L; FEI REN et al.Journal of electronic materials. 2006, Vol 35, Num 12, pp 2116-2125, issn 0361-5235, 10 p.Article

Nano-indentation characterization of Ni-Cu-Sn IMC layer subject to isothermal agingLUHUA XU; PANG, John H. L.Thin solid films. 2006, Vol 504, Num 1-2, pp 362-366, issn 0040-6090, 5 p.Conference Paper

Mechanical deflection system (MDS) test and methodology for PBGA solder joint reliabilityPANG, John H. L; KAR HWEE ANG; SHI, Xunquig Q et al.IEEE transactions on advanced packaging. 2001, Vol 24, Num 4, pp 507-514, issn 1521-3323Article

Fabrication and characterization of fine pitch on-chip copper interconnects for advanced wafer level packaging by a high aspect ratio through AZ9260 resist electroplatingDIXIT, Pradeep; CHEE WEE TAN; LUHUA XU et al.Journal of micromechanics and microengineering (Print). 2007, Vol 17, Num 5, pp 1078-1086, issn 0960-1317, 9 p.Article

Intermetallic growth studies on Sn-Ag-Cu lead-free solder jointsPANG, John H. L; LUHUA XU; SHI, X. Q et al.Journal of electronic materials. 2004, Vol 33, Num 10, pp 1219-1226, issn 0361-5235, 8 p.Conference Paper

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