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ZU PROBLEMEN DES INNENBOART-TRENNSCHLEIFENS. = PROBLEMES POSES PAR LE DECOUPAGE EN TRANCHES DES PASTILLESHOFMANN HME; SCHULZ HOF.1976; KRISTALL U. TECH.; DTSCH.; DA. 1976; VOL. 11; NO 7; PP. 783-787; ABS. ANGL.; BIBL. 4 REF.Article

NEWLY-DESIGNED POLISHING MACHINEUNE A; UENO Y.1980; BULL. JAP. SOC. PRECIS. ENGNG.; JPN; DA. 1980; VOL. 14; NO 1; PP. 43-44Article

SEMICONDUCTOR WAFERS: LOOKING PAST FOUR-INCH.MARKSTEIN HW.1976; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1976; VOL. 16; NO 4 PART. 1; PP. 21-26 (4P.)Article

MIX-AND-MATCH OF 10: 1 WAFER STEPPERS WITH DIE-BY-DIE ALIGNMENT TO 1:1 PROXIMITY AND PROJECTION SYSTEMSSTOVER HL; DAVID NE; LEWIS TH et al.1982; SOLID STATE TECHNOLOGY; ISSN 0038-111X; USA; DA. 1982; VOL. 25; NO 10; PP. 124-132; BIBL. 5 REF.Article

OPTICAL TEST STRUCTURES FOR PROCESS CONTROL MONITORS, USING WAFER STEPPER METROLOGYDAVID NE; STOVER HL.1982; SOLID STATE TECHNOLOGY; ISSN 0038-111X; USA; DA. 1982; VOL. 25; NO 6; PP. 131-141; BIBL. 9 REF.Article

CONTROLE D'ETAT DE SURFACE: LE LASER REMPLACE L'OEIL1981; MES., REGUL., AUTOM.; ISSN 0026-0193; FRA; DA. 1981; VOL. 46; NO 8-9; PP. 65-67Article

CHARACTERIZATION OF SI SURFACE BY ELLIPSOMETRYOHIRA F; ITAKURA M.1979; BULL. JAP. SOC. PRECIS. ENGNG; JPN; DA. 1979; VOL. 13; NO 3; PP. 152-154Article

LA MACHINE DE REPORT "TAB".1977; ELECTRON. APPL. INDUSTR.; FR.; DA. 1977; NO 235; PP. 39-42Article

UTILISATION DE MOYENS UHF POUR LE CONTROLE DE LA NON-UNIFORMITE DES PARAMETRES DES PLAQUES SEMICONDUCTRICES. CONTROLE DE LA SPHERICITE DES SUPPORTS FORTEMENT DOPESGORDIENKO YU E; STAROSTENKO VV; KRUPA VP et al.1975; RADIOTEKHNIKA, U.S.S.R.; S.S.S.R.; DA. 1975; NO 33; PP. 151-157; BIBL. 6 REF.Article

EMPLOI DES SEMICONDUCTEURS EN PASTILLES NUES DANS LA MICROELECTRONIQUE HYBRIDE.DECES G.1974; ELECTRON. MICROELECTRON. INDUSTR.; FR.; DA. 1974; NO 195; PP. 61-63Article

TESTING OF PROPERTIES FOR SOLDERED LEADLESS CHIP CARRIER ASSEMBLIESSHELTON TM.1981; IEEE TRANS. COMPON. HYBRIDS MANUF. TECHNOL.; ISSN 0148-6411; USA; DA. 1981; VOL. 4; NO 2; PP. 200-205Article

VERFORMUNGSFREIES ABKUEHLEN VON SILIZIUMSCHEIBEN = REFROIDISSEMENT SANS DEFORMATION DE PASTILLES DE SILICIUMFISCHER A.1981; EXPERIMENTELLE TECHNIK DER PHYSIK; ISSN 0014-4924; DDR; DA. 1981; VOL. 29; NO 1; PP. 95-102; ABS. RUS/ENG; BIBL. 3 REF.Article

CHANGES IN WAFER PARAMETER TESTING IMPROVE SEMICONDUCTOR DEVICE YIELDS.KING G.1976; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1976; VOL. 16; NO 11; PP. 45-49Article

CONTAMINATION-FREE WAFER HANDLING AND IDENTIFICATION.JOHNSON AF JR.1976; WEST. ELECTR. ENGR; U.S.A.; DA. 1976; VOL. 20; NO 2; PP. 42-49Article

POSITIONNEMENT DES ELEMENTS SUR LA PASTILLE DU CIRCUIT INTEGRE EN VUE D'OBTENIR UNE DISTORSION DE SIGNAL MINIMALESZANTO L.1976; ELEKTROTECH. CAS.; CESKOSL.; DA. 1976; VOL. 27; NO 1; PP. 29-40; ABS. RUSSE ALLEM. ANGL.; BIBL. 2 REF.Article

CHIP CAPACITIES ARE ADJUSTABLE.MATTERA L.1975; ELECTRONICS; U.S.A.; DA. 1975; VOL. 48; NO 1; PP. 125Article

IMPURITY PROFILE IN SILICON EPITAXIAL WAFER WITH BURIED LAYERS.MITSUHASHI G.1975; N.E.C. RES. DEVELOP.; JAP.; DA. 1975; NO 36; PP. 68-74; BIBL. 4 REF.Article

A TECHNIQUE FOR EXAMINING SUBMICRON PARTICULATE MATTER ON SEMICONDUCTOR DEVICE WAFERS.BERENBAUM L.1975; J. TESTY EVAL.; U.S.A.; DA. 1975; VOL. 3; NO 5; PP. 389-391; (SYMP. STATE ART PARTICULATE CONTAM. CONTROL; WASHINGTON, DC.; 1974)Conference Paper

NEW TRENDS IN WAFER PROCESSING TECHNIQUES: AN OVERVIEW.STEEN LS.1974; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1974; VOL. 14; NO 4; PP. 35-40 (4P.)Article

ZUR FRAGE DER MECHANISCHEN FESTIGKEIT VON HALBLEITERSCHEIBEN. = SUR LA QUESTION DE LA RESISTANCE MECANIQUE DE DISQUES DE SEMICONDUCTEURSMASLOV A.1974; FEINGERAETETECHNIK; DTSCH.; DA. 1974; VOL. 23; NO 8; PP. 357-360; BIBL. 6 REF.Article

WAERMEPROBLEME BEIM MIKROKONTAKTIEREN VON HALBLEITERCHIPS = PROBLEME DU TRANSFERT DE CHALEUR LORS DE LA REALISATION DES MICROCONTACTS DES PUCES SEMICONDUCTRICESSEIDOWSKI T.1981; FEINGERAETETECHNIK; ISSN 0014-9683; DDR; DA. 1981; VOL. 30; NO 1; PP. 32-33; BIBL. 5 REF.Article

INFLUENCE OF WORK PLATE SUPPORT ON FLATNESS IN POLISHINGUNE A; UENO Y.1980; BULL. JPN. SOC. PRECIS. ENG.; ISSN 0582-4206; JPN; DA. 1980; VOL. 14; NO 4; PP. 247-248Article

CORRELATION BETWEEN PROCESS-INDUCED IN-PLANE DISTORTION AND WAFER BOWING IN SILICONYAU LD.1978; APPL. PHYS. LETTERS; USA; DA. 1978; VOL. 33; NO 8; PP. 756-758; BIBL. 9 REF.Article

CLEANING WAFERS AFTER BACK-LAPPING.1977; SOLID STATE TECHNOL.; U.S.A.; DA. 1977; VOL. 20; NO 9; PP. 60Article

RAISING YIELD AND THROUGHPUT IN FRONT-END WAFER PROCESSING.LOVELESS WL.1977; SOLID STATE TECHNOL.; U.S.A.; DA. 1977; VOL. 20; NO 9; PP. 47-50Article

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