Interconnection and packaging of solid-state circuitsPEDDER, D. J.IEEE journal of solid-state circuits. 1989, Vol 24, Num 3, pp 698-703, issn 0018-9200, 6 p.Article

Techniques for soldering surface mounted devices to printed circuit boards = Technique de brasage tendre de composants sur des cartes de circuits imprimésBRIERLEY, C. J; CONSIDINE, L; PEDDER, D. J et al.1984, Num 7, pp 25-30, issn 0263-0060Article

Microwave characterization of microstrip lines and spiral inductors in MCM-D technologyARNOLD, R. G; PEDDER, D. J.IEEE transactions on components, hybrids, and manufacturing technology. 1992, Vol 15, Num 6, pp 1038-1045, issn 0148-6411Article

Theoretical study of the limitation of frequency excursion in hysteresis-mode boost-converter input stages in high power-factor AC-fed power suppliesPEDDER, D. A. G; BROWN, A. D.IEE proceedings. Circuits, devices and systems. 2001, Vol 148, Num 4, pp 205-210, issn 1350-2409Article

A contactless electrical energy transmission systemPEDDER, D. A. G; BROWN, A. D; SKINNER, J. A et al.IEEE transactions on industrial electronics (1982). 1999, Vol 46, Num 1, pp 23-30, issn 0278-0046Article

Flip chip-bonded GaAs MMICs compatible with foundry manufactureWARNER, D. J; PICKERING, K. L; PEDDER, D. J et al.IEE proceedings. Part H. Microwaves, antennas and propagation. 1991, Vol 138, Num 1, pp 74-78, issn 0950-107X, 5 p.Article