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DEEP UV PHOTORESISTS. I. MELDRUM'S DIAZO SENSITIZERGRANT BD; CLECAK NJ; TWIEG RJ et al.1981; IEEE TRANSACTIONS ON ELECTRON DEVICES; ISSN 0018-9383; USA; DA. 1981; VOL. 28; NO 11; PP. 1300-1305; BIBL. 19 REF.Article

REMOVAL OF PHOTORESIST FILM RESIDUES FROM WAFER SURFACESPETERS DA; DECKERT CA.1979; J. ELECTROCHEM. SOC.; USA; DA. 1979; VOL. 126; NO 5; PP. 883-886; BIBL. 7 REF.Article

CHARACTERIZATION OF POSITIVE RESIST DEVELOPMENTO'TOOLE MM; GRANDE WJ.1981; ELECTRON DEVICE LETT.; ISSN 0193-8576; USA; DA. 1981; VOL. 2; NO 12; PP. 311-313; BIBL. 8 REF.Article

MECHANICAL CLEANING OF PC BOARDSPELTON C.1979; ELECTRON. PACKAG. PRODUCT.; USA; DA. 1979; VOL. 19; NO 7; PP. 29-30Article

ADVANCED 1X PROJECTION PHOTOLITHOGRAPHYHAKEY M; STRAUB W.1982; J. ELECTRON. MATER.; ISSN 0361-5235; USA; DA. 1982; VOL. 11; NO 4; PP. 813-830; BIBL. 7 REF.Article

AZIDE-PHENOLIC RESIN PHOTORESISTS FOR DEEP UV LITHOGRAPHYIWAYANAGI T; KOHASHI T; NONOGAKI S et al.1981; IEEE TRANSACTIONS ON ELECTRON DEVICES; ISSN 0018-9383; USA; DA. 1981; VOL. 28; NO 11; PP. 1306-1310; BIBL. 18 REF.Article

RESIDUES FROM WET PROCESSING OF POSITIVE RESISTSKAPLAN LH; BERGIN BK.1980; J. ELECTROCHEM. SOC.; ISSN 0013-4651; USA; DA. 1980; VOL. 127; NO 2; PP. 386-395; BIBL. 10 REF.Article

PHOTOSENSIBILITE DES PHOTORESISTS NEGATIFSTREUSHNIKOV VM; FROLOVA NV; OLEJNIK AV et al.1979; ZH. NAUCH. PRIKL. FOTOGR. KINEMATOGR.; SUN; DA. 1979; VOL. 24; NO 5; PP. 388-396; BIBL. 41 REF.Article

EXPOSURE CONTROL FOR DRY FILM PHOTORESISTSWOPSCHALL RH.1978; ELECTRON. PACKAG. PRODUCT.; USA; DA. 1978; VOL. 18; NO 10; PP. 90-97; (6 P.); BIBL. 3 REF.Article

INCREASING THE FUNCTIONAL SPEED OF POSITIVE PHOTORESISTELLIOTT DJ; DENIS C.1977; COLLOQUE INTERNATIONAL SUR LA MICROLITHOGRAPHIE, MICROELECTRONIQUE, OPTIQUE; FRA; DA. 1977; DGRST-7771946; PP. 229-237; ABS. FREConference Paper

RELIABLE FABRICATION OF PWBS WITH DRY FILM PHOTORESISTSWOPSCHALL RH.1983; ELECTRI.ONICS; ISSN 512907; USA; DA. 1983; VOL. 29; NO 4; PP. 33-37Article

PHOTOETCHING RESEARCH AT THE CRANFIELD INSTITUTE OF TECHNOLOGY: A REVIEWSTEVENS GWW.1982; J. APPL. PHOTOGR. ENG.; ISSN 0098-7298; USA; DA. 1982; VOL. 8; NO 2; PP. 90-100; BIBL. 26 REF.Article

THE IMPACT OF PHOTORESIST ON IMAGE SIZEROTTMAN HR.1982; J. APPL. PHOTOGR. ENG.; ISSN 0098-7298; USA; DA. 1982; VOL. 8; NO 2; PP. 101-104; BIBL. 1 REF.Article

DRY FILM PERFORMANCE ON ELECTROLESS COPPERHAMILTON WI.1981; ELECTRON. PACKAG. PROD.; ISSN 0013-4945; USA; DA. 1981; VOL. 21; NO 1; PP. 232-240; 7 P.Article

PROBLEM-SOLVING PROCESSES FOR RESIST DEVELOPING, STRIPPING, AND ETCHINGMURSKI K; WIBLE PM.1981; INSUL., CIRCUITS; ISSN 0020-4544; USA; DA. 1981; VOL. 27; NO 2; PP. 121-126; BIBL. 14 REF.Article

DRY FILMS FOR PC BOARD IMAGINGMARKSTEIN HW.1979; ELECTRON. PACKAG. PRODUCT.; USA; DA. 1979; VOL. 19; NO 12; PP. 39-46; (5 P.); BIBL. 2 REF.Article

FREE-STANDING PHOTORESIST FILMS FOR MICROLITHOGRAPHYLITTLE JW; CALLCOTT TA; ARAKAWA ET et al.1980; REV. SCI. INSTRUM.; ISSN 0034-6748; USA; DA. 1980; VOL. 51; NO 11; PP. 1581-1583; BIBL. 3 REF.Article

PHOTO-CHEMICAL MILLING OF EMBOSSING ROLLS = USINAGE PHOTOCHIMIQUE DE CYLINDRES DE GRAVURESATO T; TAKAHASHI Y.1980; BULL. JPN. SOC. PRECIS. ENG.; ISSN 0582-4206; JPN; DA. 1980; VOL. 14; NO 2; PP. 115-116Article

REALISATION D'HOLOGRAMMES SUR LE PHOTORESIST POSITIF FP-383YASTREBOV AA; KOZENKOV VM; BARACHEVSKIJ VA et al.1980; ZH. NAUCHN. PRIKL. FOTOGR. KINEMATOGR.; SUN; DA. 1980; VOL. 25; NO 2; PP. 137-139; BIBL. 4 REF.Article

PHOTORESIST IN ETCHING PROCESSYOKOTA A; TAKEUCHI K.1979; KINZOKU HYOMEN GIJUTSU; ISSN 0026-0614; JPN; DA. 1979; VOL. 30; NO 10; PP. 547-556; BIBL. 21 REF.Article

AUTOMATED PROCESSING OF POSITIVE PHOTORESISTS: SPRAY DEVELOPING FOR LINE SEMICONDUCTORSMACBETH G.1979; CIRCUITS MANUF.; USA; DA. 1979; VOL. 19; NO 4; PP. 50-60; (5 P.); BIBL. 5 REF.Article

FACTORS AFFECTING FINE LINE REPRODUCTION IN DRY FILM PHOTO RESISTS. IIFULLWOOD L.1982; INSUL., CIRCUITS; ISSN 0020-4544; USA; DA. 1982; VOL. 28; NO 1; PP. 47-49; BIBL. 8 REF.Article

FACTORS AFFECTING FINE LINE REPRODUCTION IN DRY FILM PHOTORESISTS. IFULLWOOD L.1981; INSUL., CIRCUITS; ISSN 0020-4544; USA; DA. 1981; VOL. 27; NO 13; PP. 94-97; BIBL. 3 REF.Article

CONTACT PRINTING METHOD UTILIZING HEATED PHOTORESIST ADHESIVE PROPERTY FOR HOLOGRAM COPYINGNAKANO M; NISHIDA N.1979; APPL. OPT.; USA; DA. 1979; VOL. 18; NO 18; PP. 3073-3074; BIBL. 7 REF.Article

AN ELECTROSTATIC TECHNIQUE FOR PURIFYING PHOTORESISTSHIROBE K; IWAMATSU S.1979; J. ELECTROCHEM. SOC.; ISSN 0013-4651; USA; DA. 1979; VOL. 126; NO 8; PP. 1426-1428; BIBL. 4 REF.Article

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