Spin-on-glass (SOG) process-induced tungsten residue in a semiconductor manufacturing procedurePING HSUN CHEN; CHEN, Tate; HAN CHANT SHIH et al.Microelectronics journal. 2004, Vol 35, Num 12, pp 985-987, issn 0959-8324, 3 p.Article

A chemical kinetics model for a mixed-abrasive chemical mechanical polishingPING HSUN CHEN; BING WEI HUANG; HAN CHANG SHIH et al.Thin solid films. 2005, Vol 483, Num 1-2, pp 239-244, issn 0040-6090, 6 p.Article

A chemical kinetics model to explain the abrasive size effect on chemical mechanical polishingPING HSUN CHEN; BING WEI HUANG; SHIH, Han-C et al.Thin solid films. 2005, Vol 476, Num 1, pp 130-136, issn 0040-6090, 7 p.Article

Application of the Taguchi's design of experiments to optimize a bromine chemistry-based etching recipe for deep silicon trenchesPING HSUN CHEN; YAU, Colin; KUANG YUNG WU et al.Microelectronic engineering. 2005, Vol 77, Num 2, pp 110-115, issn 0167-9317, 6 p.Article

An engineering approach to predict the polishing rate in CMP with rotational equipmentPING HSUN CHEN; SHIN, Han-C; BING WEI HUANG et al.Journal of the Electrochemical Society. 2004, Vol 151, Num 10, pp G649-G651, issn 0013-4651Article