HERSTELLUNG DURCHKONTAKTIERTER LEITERPLATTEN FUER DEN ENTWICKLUNGSBEDARF. II. = FABRICATION DES CIRCUITS IMPRIMES A INTERCONNEXIONS POUR LES BESOINS DU DEVELOPPEMENTSCHUTT J.1978; FEINGERAETETECHNIK; DEU; DA. 1978; VOL. 27; NO 1; PP. 25-27; ABS. ENG/FRE/GER/RUSArticle

HERSTELLUNG DURCHKONTAKTIERTER LEITERPLATTEN FUER DEN ENTWICKLUNGSBEDARF. = FABRICATION DE CIRCUITS IMPRIMES A TROUS METALLISES POUR REPONDRE A L'ACCROISSEMENT DE LA DEMANDESCHUTT J.1977; FEINGERAETETECHNIK; DTSCH.; DA. 1977; VOL. 26; NO 12; PP. 541-544; ABS. ANGL. FR.; BIBL. 5 REF.Article

UNSOLDERING P.C.B.S. WITHOUT DAMAGESCARLETT JA.1980; ELECTRON. + POWER; ISSN 0013-5127; GBR; DA. 1980; VOL. 26; NO 9; PP. 715-718; BIBL. 4 REF.Article

PLATED THROUGH HOLE STRENGTH AS RELATED TO ANNULAR RINGSFROUSER JR; KALMUS CE.1979; INSULAT. CIRCUITS; USA; DA. 1979; VOL. 25; NO 8; PP. 46-47Article

PLATING.1978; CIRCUITS MANUF.; U.S.A.; DA. 1978; VOL. 18; NO 1; PP. 6-17 (8P.)Article

HOLE WALL PULLAWAY: A STUDYRAU TA.1978; PLATING IN THE ELECTRONICS INDUSTRY SYMPOSIUM. 7/1979/SAN FRANCISCO CA; USA; WINTER PARK: AMERICAN ELECTROPLATERS' SOCIETY; DA. 1978; PP. 1-3Conference Paper

THE DEVELOPMENT OF ADDITIVE PROCESSING TECHNIQUES TO RESOLVE END USER AND IN PLANT PROBLEMS.HIBBS TJ.1976; IN: INT. ELECTRON. PACKAG. PROD. CONF. PROC. TECH. PROGRAMME; BRIGHTON, ENGL.; 1976; SURBITON; KIVER COMMUNICATIONS; DA. 1976; PP. 4-10Conference Paper

REDUCING WATER AND CHEMICAL CONSUMPTION IN PC ELECTROPLATINGBEYER GH.1982; INSUL., CIRCUITS; ISSN 0020-4544; USA; DA. 1982; VOL. 28; NO 3; PP. 29-31Article

VAPOR PHASE REFLOW SOLDERING OF BACKPLANES AND MOTHER BOARDS WITH WIRE-WRAPPED PINS AND CONNECTORS1981; INSUL., CIRCUITS; ISSN 0020-4544; USA; DA. 1981; VOL. 27; NO 1; PP. 48-49Article

THIN COPPER TECHNOLOGY FOR PLATED THROUGH HOLE MANUFACTUREKING TE.1979; INSULAT. CIRCUITS; USA; DA. 1979; VOL. 25; NO 6; PP. 39-40Article

RELIABILITY OF COPPER-PLATED-THROUGH-HOLE PRINTED WIRING BOARD.KOBUNA H; SATO T; NOGUSHI S et al.1976; N.E.C. RES. DEVELOP.; JAP.; DA. 1976; NO 41; PP. 38-49; BIBL. 12 REF.Article

MEASURING PCB PLATING THICKNESSBUSH G.1980; CIRCUITS MANUF.; USA; DA. 1980; VOL. 20; NO 3; PP. 76-82; (4 P.)Article

IMPURITIES IN SOLDER: HOW THEY INFLUENCE SOLDERABILITY AND STRENGTH OF PCB PLATED THROUGH-HOLESBECKER G.1982; INSUL., CIRCUITS; ISSN 0020-4544; USA; DA. 1982; VOL. 28; NO 3; PP. 49-52Article

THE TOPSIDE PTH SOLDER FILLETGADZINSKI E.1979; CIRCUITS MANUF.; USA; DA. 1979; VOL. 19; NO 11; PP. 68-116; (2 P.)Article

FLUXLESS FUSION OF TIN-LEAD PLATED PRINTED CIRCUIT BOARDS VIA VAPOR PHASE PROCESS1981; INSUL., CIRCUITS; ISSN 0020-4544; USA; DA. 1981; VOL. 27; NO 5; PP. 19-20Article

MEASURING COPPER THICKNESS IN PLATED THREE HOLES.RITTER J; BUSH G.1978; CIRCUITS MANUF.; U.S.A.; DA. 1978; VOL. 18; NO 5; PP. 34-35Article

NEW TEST METHOD MEASURES SOLDERABILITY OF PLATED-THROUGH HOLES.BECKER G.1976; INSULAT. CIRCUITS; U.S.A.; DA. 1976; VOL. 22; NO 13; PP. 73-78; BIBL. 3 REF.Article

QUALITAETSKONTROLLE AN DURCHMETALLISIERTEN LEITERPLATTEN. = CONTROLE DE QUALITE DES CIRCUITS IMPRIMES A TROUS METALLISESNACHTSHEIM H.1976; MESSEN U. PRUEFEN; DTSCH.; DA. 1976; NO 11; PP. 642-682 (4P.)Article

EXTREMELY HIGH DENSITY MULTILAYER PRINTED WIRING BOARDS.MURAKAMI T; TAKAGI K.1976; FUJITSU SCI. TECH. J.; JAP.; DA. 1976; VOL. 12; NO 2; PP. 65-106; BIBL. 3 REF.Article

STRUCTURAL DESIGN ANALYSIS APPLIED TO FLEXIBLE CIRCUITS.SKAGGS CW; SPERLING RA.1976; I.E.E.E. TRANS. MANUFG TECHNOL.; U.S.A.; DA. 1976; VOL. 5; NO 4; PP. 78-83; BIBL. 2 REF.Article

PROCEEDINGS: PC '81 WEST/5TH INTERNATIONAL PRINTED CIRCUITS CONFERENCE-EXHIBITION, LOS ANGELES CA, OCTOBER 26-28, 1981POGGI RA ED.1981; PC '81 WEST. INTERNATIONAL PRINTED CIRCUITS CONFERENCE-EXHIBITION. 5/1981-10-26/LOS ANGELES CA; USA; S.L.: BENWILL; DA. 1981; PAG. MULT.; 28 CMConference Proceedings

NUMERICAL ANALYSIS OF THE RESISTANCE OF INTERFERENCE-FIT PIN CONNECTIONSGUANCIAL E.1980; I.E.E.E. TRANS. COMPON. HYBR. MANUFG TECHNOL.; USA; DA. 1980; VOL. 3; NO 3; PP. 402-407; BIBL. 6 REF.Article

LOETBARKEITSMESSUNG AN DURCHPLATTIERTEN LEITERPLATTEN. = MESURE DE LA BRASABILITE DES PLAQUETTES DE CIRCUITS IMPRIMES A PLACAGE TRAVERSANTKEEFER W.1976; IN: LOETEN UND SCHWEISSEN IN ELEKTRON.; MUENCHEN; 1976; DUESSELDORF; DTSCH. VERLAG SCHWEISSTECH. (DVS) GMBH; DA. 1976; PP. 145-149; ABS. ANGL.; DVS BERICHTE 40Conference Paper

0.35 μm rule device pattern fabrication using high absorption-type novolac photoresist in single layer deep ultraviolet lithography : surface image transfer for contact hole fabricationTOMO, Y; KASUGA, T; SAITO, M et al.Journal of vacuum science & technology. B. Microelectronics and nanometer structures. Processing, measurement and phenomena. 1992, Vol 10, Num 6, pp 2576-2580, issn 1071-1023Conference Paper

What to do about pinholes in plated through hole connectionsTURNER, R. L.Electri.onics. 1985, Vol 31, Num 4, pp 53-55, issn 0745-4309Article