Generation and fusion of multiple image representations in automatic corrosion detection algorithms used with shipboard tank video inspection systemsNELSON, Bruce N; SLEBODNICK, Paul; LEMIEUX, Edward J et al.SPIE proceedings series. 2002, pp 110-121, isbn 0-8194-4481-2Conference Paper

Fabrication and characterization of fine pitch on-chip copper interconnects for advanced wafer level packaging by a high aspect ratio through AZ9260 resist electroplatingDIXIT, Pradeep; CHEE WEE TAN; LUHUA XU et al.Journal of micromechanics and microengineering (Print). 2007, Vol 17, Num 5, pp 1078-1086, issn 0960-1317, 9 p.Article

Study of surface treatment processes for improvement in the wettability of silicon-based materials used in high aspect ratio through-via copper electroplatingDIXIT, Pradeep; XIAOFENG CHEN; JIANMIN MIAO et al.Applied surface science. 2007, Vol 253, Num 21, pp 8637-8646, issn 0169-4332, 10 p.Article

Microstructural investigation of through-silicon via fabrication by pulse-reverse electroplating for high density nanoelectronicsNAY LIN; JIANMIN MIAO; PREISSER, Robert et al.International journal of nanotechnology. 2014, Vol 11, Num 1-4, pp 178-189, issn 1475-7435, 12 p.Conference Paper