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FABRICATING RELIABILITY INTO FLEXIBLE PRINTED WIRING.HAYS SA.1977; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1977; VOL. 17; NO 7; PP. 111-117Article

PC BOARD LAMINATORS CUT COSTS BY DOLLAR-THOUSANDS PER YEAR WITH NEW PRESSPAD1983; ELECTRI.ONICS; ISSN 512907; USA; DA. 1983; VOL. 29; NO 6; PP. 40Article

SOLDER FUSED INTERCONNECTIONS IN MULTILAYER CIRCUITS.VOIDA G.1977; INSULAT. CIRCUITS; U.S.A.; DA. 1977; VOL. 23; NO 10; PP. 77-82; BIBL. 2 REF.Article

FLEXIBLE CIRCUITS BEND TO DESIGNERS' WILL.LYMAN J.1977; ELECTRONICS; U.S.A.; DA. 1977; VOL. 50; NO 19; PP. 97-105Article

SURVEYING TODAY'S MULTILAYER PC SUPPLIERS.MARKSTEIN HW.1978; ELECTRON. PACKAG. PRODUCT.; USA; DA. 1978; VOL. 18; NO 6; PP. 64-68; (4 P.)Article

FACTORS TO CONSIDER WHEN USING AND FABRICATING FLEXIBLE CIRCUITSLAMOUREUX RT.1979; ELECTRON. PACKAG. PRODUCT.; USA; DA. 1979; VOL. 19; NO 7; PP. 176-179Article

DESIGNING FLEXIBLE CIRCUITS: WHAT THE MANUFACTURER NEEDS TO KNOW. ISAWYER NJ; TAYLOR ML.1982; INSUL., CIRCUITS; ISSN 0020-4544; USA; DA. 1982; VOL. 28; NO 4; PP. 93-94Article

AN ALGORITHM FOR SINGLE-ROW ROUTING WITH PRESCRIBED STREET CONGESTIONSTSUKIYAMA S; KUH ES; SHIRAKAWA J et al.1980; I.E.E.E. TRANS. CIRCUITS SYST.; USA; DA. 1980; VOL. 27; NO 9; PP. 765-772; BIBL. 12 REF.Article

ADVANCES IN FLEXIBLE PCB PRODUCTION: HIGH VOLUME ROLL-TO-ROLLPROCESSING1978; CIRCUITS MANUF.; USA; DA. 1978; VOL. 18; NO 11; PP. 30-36; (4 P.)Article

DESIGNING AND FABRICATING FLEXIBLE CIRCUITRY.MCKEE JB.1976; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1976; VOL. 16; NO 7; PP. 92-96Article

EXTREMELY HIGH DENSITY MULTILAYER PRINTED WIRING BOARDS.MURAKAMI T; TAKAGI K.1976; FUJITSU SCI. TECH. J.; JAP; DA. 1976; VOL. 12; NO 2; PP. 65-106; BIBL. 3 REF.Article

GROSSFORMATIGE, FLEXIBLE GEDRUCKTE VERDRAHTUNGEN IN GERAETEN DER NACHRICHTENTECHNIK. = CIRCUITS IMPRIMES FLEXIBLES GRAND FORMAT DANS L'APPAREILLAGE DES TELECOMMUNICATIONSHADERSBECK H; STEGER S.1976; SIEMENS Z.; DTSCH.; DA. 1976; VOL. 50; NO 11; PP. 723-726Article

TECHNOLOGIE UND FERTIGUNG VON MEHRLAGIGEN LEITERPLATTEN FUER DATENVERARBEITUNGS-, REGELUNGS- UND STEUERUNGSSYSTEME. = TECHNOLOGIE ET FABRICATION DES CIRCUITS IMPRIMES MULTICOUCHES POUR LES SYSTEMES DE TRAITEMENT DES DONNEES, DE REGULATION ET DE COMMANDESZOLNOKI G.1977; F.N.M.; DTSCH.; DA. 1977; VOL. 85; NO 1; PP. 29-34Article

A SYSTEMATIC APPROACH TO MULTILAYER DIMENSIONAL STABILITYBUTWIN FJ; CARLSON PJ.1983; ELECTRI.ONICS; ISSN 512907; USA; DA. 1983; VOL. 29; NO 3; PP. 19-21Article

GUIDELINES FOR PRINTED WIRING BOARD PHOTOTOOLING PREPARATIONSZUKALSKI EA.1982; INSUL., CIRCUITS; ISSN 0020-4544; USA; DA. 1982; VOL. 28; NO 8; PP. 37-40Article

PLASMA ETCHING OF RIGID/FLEXIBLE PC BOARDSNIEBAUER DA.1980; ELECTRON. PACKAG. PROD.; ISSN 0013-4945; USA; DA. 1980; VOL. 20; NO 9; PP. 153-158; 4 P.Article

FLEXIBLE CIRCUITS - THE TRUE COSTHOGAN TF.1979; NEW ELECTRON.; GBR; DA. 1979; VOL. 12; NO 10; PP. 78-81; (2P.)Article

SURVEYING FLEXIBLE CIRCUIT APPLICATIONSMARSTEIN HW.1979; ELECTRON. PACKAG. PRODUCT.; USA; DA. 1979; NO 104; PP. 78-84; 5; BIBL. 1 REF.Article

APPROCHE PROBABILISTE POUR LA DETERMINATION DES DIMENSIONS D'UNE PLAQUE IMPRIMEE MULTICOUCHETETEL'BAUM A YA.1979; IZVEST. VYSSH. UCHEBN. ZAVED., RADIOELEKTRON.; UKR; DA. 1979; VOL. 22; NO 3; PP. 35-40; BIBL. 1 REF.Article

OPTIMALES KONSTRUIEREN VON FLEXIBLEN GEDRUCKTEN SCHALTUNGEN IN BEZUG AUF IHRE BIEGEBEANSPRUCHUNG = FABRICATION OPTIMALE DES CIRCUITS IMPRIMES SOUPLES EN RELATION AVEC LEUR FLEXIBILITEACKERMANN D; NITSCH H.1978; F.U.M.; DEU; DA. 1978; VOL. 86; NO 7; PP. 327-335; BIBL. 4 REF.Article

ALLEGED EPOXY SMEARBJELLAND LK; SHERLIN DE; HAVENS BR et al.1978; PLATING IN THE ELECTRONICS INDUSTRY SYMPOSIUM. 7/1979/SAN FRANCISCO CA; USA; WINTER PARK: AMERICAN ELECTROPLATERS' SOCIETY; DA. 1978; PP. 1-4; H.T. 2Conference Paper

DIE HERSTELLUNG FLEXIBLER GEDRUCKTER VERDRAHTUNGEN. = LA FABRICATION DE CABLAGES IMPRIMES FLEXIBLESBRUNNER E.1976; FERNMELDETECHNICK; DTSCH.; DA. 1976; VOL. 16; NO 4; PP. 134-138; ABS. RUSSE ANGL.; BIBL. 4 REF.Article

A NEW APPROACH TO ROUTING OF TWO-LAYER PRINTED CIRCUIT BOARDMAREK SADOWSKA M; KUH ES.1981; INT. J. CIRCUIT THEORY APPL.; ISSN 0098-9886; USA; DA. 1981; VOL. 9; NO 3; PP. 331-341; BIBL. 8 REF.Article

CONSIDER ALL SYSTEM REQUIREMENTS WHEN SELECTING LAMINATE MATERIALSJESSE H.1980; INSUL., CIRCUITS; ISSN 0020-4544; USA; DA. 1980; VOL. 26; NO 11; PP. 54-56Article

HIGH-DENSITY PACKAGING WITH FLEXIBLE CIRCUITRYTIRUMS BT.1980; ELECTRON. PACKAG. PRODUCT.; USA; DA. 1980; VOL. 20; NO 5; PP. 179-182; H.T. 1Article

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