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FABRICATING RELIABILITY INTO FLEXIBLE PRINTED WIRING.HAYS SA.1977; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1977; VOL. 17; NO 7; PP. 111-117Article

OPTIMUM PROCEDURES FOR FABRICATING RIGID-FLEXIBLE MULTILAYER BOARDS.CURRIER RF.1978; INSULAT. CIRCUITS; U.S.A.; DA. 1978; VOL. 24; NO 5; PP. 29-31Article

BEARBEITUNG VON MULTILAYER- UND FLEXSCHALTUNGEN = MISE EN OEUVRE DES CIRCUITS IMPRIMES MULTICOUCHES ET DES CIRCUITS IMPRIMES SOUPLESGRAPENTIN HJ; WOLFF J.1979; GALVANOTECHNIK; DEU; DA. 1979; VOL. 70; NO 10; PP. 958-960; ABS. ENG/FREArticle

PC BOARD LAMINATORS CUT COSTS BY DOLLAR-THOUSANDS PER YEAR WITH NEW PRESSPAD1983; ELECTRI.ONICS; ISSN 512907; USA; DA. 1983; VOL. 29; NO 6; PP. 40Article

SOLDER FUSED INTERCONNECTIONS IN MULTILAYER CIRCUITS.VOIDA G.1977; INSULAT. CIRCUITS; U.S.A.; DA. 1977; VOL. 23; NO 10; PP. 77-82; BIBL. 2 REF.Article

FLEXIBLE CIRCUITS BEND TO DESIGNERS' WILL.LYMAN J.1977; ELECTRONICS; U.S.A.; DA. 1977; VOL. 50; NO 19; PP. 97-105Article

DESIGNING FLEXIBLE CIRCUITS: WHAT THE MANUFACTURER NEEDS TO KNOW-PART TWOSAWYER NJ; TAYLOR ML.1982; INSUL., CIRCUITS; ISSN 0020-4544; USA; DA. 1982; VOL. 28; NO 6; PP. 49-52; BIBL. 5 REF.Article

SURVEYING TODAY'S MULTILAYER PC SUPPLIERS.MARKSTEIN HW.1978; ELECTRON. PACKAG. PRODUCT.; USA; DA. 1978; VOL. 18; NO 6; PP. 64-68; (4 P.)Article

FACTORS TO CONSIDER WHEN USING AND FABRICATING FLEXIBLE CIRCUITSLAMOUREUX RT.1979; ELECTRON. PACKAG. PRODUCT.; USA; DA. 1979; VOL. 19; NO 7; PP. 176-179Article

DESIGNING FLEXIBLE CIRCUITS: WHAT THE MANUFACTURER NEEDS TO KNOW. ISAWYER NJ; TAYLOR ML.1982; INSUL., CIRCUITS; ISSN 0020-4544; USA; DA. 1982; VOL. 28; NO 4; PP. 93-94Article

AN ALGORITHM FOR SINGLE-ROW ROUTING WITH PRESCRIBED STREET CONGESTIONSTSUKIYAMA S; KUH ES; SHIRAKAWA J et al.1980; I.E.E.E. TRANS. CIRCUITS SYST.; USA; DA. 1980; VOL. 27; NO 9; PP. 765-772; BIBL. 12 REF.Article

ADVANCES IN FLEXIBLE PCB PRODUCTION: HIGH VOLUME ROLL-TO-ROLLPROCESSING1978; CIRCUITS MANUF.; USA; DA. 1978; VOL. 18; NO 11; PP. 30-36; (4 P.)Article

DESIGNING AND FABRICATING FLEXIBLE CIRCUITRY.MCKEE JB.1976; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1976; VOL. 16; NO 7; PP. 92-96Article

EXTREMELY HIGH DENSITY MULTILAYER PRINTED WIRING BOARDS.MURAKAMI T; TAKAGI K.1976; FUJITSU SCI. TECH. J.; JAP; DA. 1976; VOL. 12; NO 2; PP. 65-106; BIBL. 3 REF.Article

GROSSFORMATIGE, FLEXIBLE GEDRUCKTE VERDRAHTUNGEN IN GERAETEN DER NACHRICHTENTECHNIK. = CIRCUITS IMPRIMES FLEXIBLES GRAND FORMAT DANS L'APPAREILLAGE DES TELECOMMUNICATIONSHADERSBECK H; STEGER S.1976; SIEMENS Z.; DTSCH.; DA. 1976; VOL. 50; NO 11; PP. 723-726Article

SPANNUNGSBELASTBARKEIT FLEXIBLER GEDRUCKTER VERDRAHTUNGEN = LA TENUE EN TENSION DES CIRCUITS IMPRIMES SOUPLESDAUBNER A; BOENSCH F.1979; FEINGERAETETECHNIK; ISSN 0014-9683; DDR; DA. 1979; VOL. 28; NO 12; PP. 555-557; ABS. RUS; BIBL. 6 REF.Article

INTERCONNECTING LAYERS IN FLEXIBLE CIRCUITS.MORRIS GV.1977; CIRCUITS MANUF.; U.S.A.; DA. 1977; VOL. 17; NO 11; PP. 49-50Article

TABLEAUX DE BORD: DES CIRCUITS IMPRIMES FLEXIBLES1981; ELECTR. AUTOM. TECH. SPECIALIS.; FRA; DA. 1981; NO 495; PP. 9-12Article

FLEXIBLE CIRCUITY IMPROVES CRYSTAL OSCILLATOR DESIGNSTEINMETZ JH.1980; ELECTRON. PACKAY. PROD.; ISSN 0013-4945; USA; DA. 1980; VOL. 20; NO 11; PP. 123-130; 6 P.Article

IMPROVEMENTS IN POLYIMIDE MULTILAYER PROCESSINGRITCHIE LJ; DORFMAN H.1980; ELECTRON. PACKAG. PRODUCT.; USA; DA. 1980; VOL. 20; NO 6; PP. 88-98; 9 P.; BIBL. 4 REF.Article

VERFAHREN ZUR WIRTSCHAFTLICHEN FERTIGUNG VON MEHRLAGEN-LEITERPLATTEN = METHODE DE FABRICATION ECONOMIQUE DES CIRCUITS IMPRIMES EN COUCHES SUPERPOSEESKLOSE W.1980; ELEKTRONIK (MUENCH.); ISSN 0013-5658; DEU; DA. 1980; VOL. 29; NO 24; PP. 57-60Article

AN ALGORITHM FOR THE VIA ASSIGNEMENT PROBLEM IN MULTILAYER BLACKBOARD WIRINGTSUKIYAMA S; SHIRAKAWA I; ASAHARA S et al.1979; I.E.E.E. TRANS. CIRCUITS SYST.; USA; DA. 1979; VOL. 26; NO 6; PP. 369-377; BIBL. 12 REF.Article

FLEXIBLE PCS MANUFACTURING PROCESSES AND TOOLING.1977; CIRCUITS MANUF.; U.S.A.; DA. 1977; VOL. 17; NO 5; PP. 78-81Article

LOETBARKEIT VON ELEKTRONISCHEN BAUELEMENTEN, WICHTIGE VORAUSSETZUNG FUER RHIE WEITERVERARBEITUNG. = LA SOUDABILITE DES COMPOSANTS ELECTRONIQUES, CONDITION IMPORTANTE POUR LEUR TRAITEMENT ULTERIEURLOFFEL J.1977; FERNMELDETECHNIK; DTSCH.; DA. 1977; VOL. 17; NO 4; PP. 131-132; ABS. RUSSE ANGL.Article

PREVISION DE LA FIABILITE DES PLAQUES IMPRIMEES A COUCHES MULTIPLESALEKSENKO AG; EMEL'YANOV VM.1976; MIKROELEKTRONIKA; S.S.S.R.; DA. 1976; VOL. 5; NO 4; PP. 309-315; BIBL. 6 REF.Article

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