au.\*:("PROSZYNSKI A")
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Diffusional creep induced stress relaxation in thin Cu films on siliconCHOCYK, D; PROSZYNSKI, A; GLADYSZEWSKI, G et al.Microelectronic engineering. 2008, Vol 85, Num 10, pp 2179-2182, issn 0167-9317, 4 p.Conference Paper
