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ARGON ENTRAPMENT IN METAL FILMS BY DC TRIODE SPUTTERING.LEE WWY; OBLAS D.1975; J. APPL. PHYS.; U.S.A.; DA. 1975; VOL. 46; NO 4; PP. 1728-1732; BIBL. 16 REF.Article

OBSERVATION OF TWIN FAULTS IN SPUTTER-DEPOSITED HIGH-PURITY NICKELWANG R; DAHLGREN SD.1975; J. MATER. SCI.; G.B.; DA. 1975; VOL. 10; NO 8; PP. 1456-1458; BIBL. 4 REF.Article

EFFECTS OF DEPOSITION TEMPERATURE AND SUBSTRATE BIAS ON ORIENTATION AND HARDNESS OF THICK SPUTTER DEPOSITED BERYLLIUM FOILSPATTEN JW; MCCLANAHAN ED.1973; J. LESS-COMMON METALS; NETHERL.; DA. 1973; VOL. 30; NO 3; PP. 351-359; BIBL. 8 REF.Serial Issue

APPLICATIONS OF SPUTTERING-PAST, PRESENT AND FUTURE.WEINIG S.1974; IN: SCI. TECHNOL. SURF. COATING. NATO ADV. STUDY INST.; LONDON; 1972; LONDON; ACAD. PRESS; DA. 1974; PP. 386-392Conference Paper

BREVET 2.139.841 (B) (7214368). A 18 AVRIL 1972. PROCEDE DE DEPOT DE COUCHES MAGNETISABLES SUR UN SUBSTRAT PAR PULVERISATION CATHODIQUEsdPatent

CHARACTERIZATION OF SILVER COATINGS DEPOSITED FROM A HOLLOW CATHODE SOURCEAMH G; MCLEOD PS; WILLIAMS DG et al.1974; J. VACUUM SCI. TECHNOL.; U.S.A.; DA. 1974; VOL. 11; NO 4; PP. 663-665; BIBL. 11 REF.; (CONF. STRUCT. PROP. RELATIONSHIPS THICK FILMS BULK COATINGS. PROC.; SAN FRANCISCO; 1974)Conference Paper

THE BASIC PRINCIPLES OF SPUTTER DEPOSITION.HOLLAND L.1974; IN: SCI. TECHNOL. SURF. COATING. NATO ADV. STUDY INST.; LONDON; 1972; LONDON; ACAD. PRESS; DA. 1974; PP. 369-385; BIBL. 1 P.Conference Paper

LOIS DE VARIATION EN FONCTION DE LA TEMPERATURE DE LA COMPOSANTE IONIQUE DE LA PULVERISATION CATHODIQUE DES METAUX REFRACTAIRES DANS UNE ATMOSPHERE D'OXYGENEADYLOV AA; VEKSLER VI; REZNIK AM et al.1975; IZVEST. AKAD. NAUK NZ. S.S.R., FIZ.-MAT. NAUK; S.S.S.R.; DA. 1975; VOL. 19; NO 2; PP. 81-83; BIBL. 5 REF.Article

INVESTIGATION OF HOLLOW CATHODE EFFECTS ON THE STRUCTURE OF BULK FILMSSTOWELL WR; CHAMBERS D.1974; J. VACUUM SCI. TECHNOL.; U.S.A.; DA. 1974; VOL. 11; NO 4; PP. 653-656; BIBL. 5 REF.; (CONF. STRUCT. PROP. RELATIONSHIPS THICK FILMS BULK COATINGS. PROC.; SAN FRANCISCO; 1974)Conference Paper

BREVET 2.260.451 (A1) (7504327). A 12 FEVRIER 1975. PROCEDE D'ELABORATIONS D'UNE CONFIGURATION DE COUCHE SUR UN SUBSTRATsdPatent

SPUTTER DEPOSITION OF THIN FILMS: THEORY AND EXPERIMENT = DEPOT DE COUCHES MINCES PAR PULVERISATION CATHODIQUE: THEORIE ET EXPERIENCEDOWNER D.1975; SURFG J.; G.B.; DA. 1975; VOL. 6; NO NO 3; PP. 1-5; BIBL. 20 REF.Article

ELECTRON EFFECTS IN SPUTTERING AND COSPUTTERING.CHAMPMAN BN; DOWNER D; GUIMARAES LJM et al.1974; J. APPL. PHYS.; U.S..A.; DA. 1974; VOL. 45; NO 5; PP. 2115-2120; BIBL. 14 REF.Article

LA PULVERISATION CATHODIQUE.CATIER E.1978; TRAITEMENTS DE SURFACE; FR.; DA. 1978; NO 160; PP. 7-20Article

EFFECTS OF DEPOSITION PARAMETERS ON PROPERTIES OF RF SPUTTERED MOLYBDENUM FILMSNOWICKI RS; BUCKLEY WD; MACKINTOSH WD et al.1974; J. VACUUM SCI. TECHNOL.; U.S.A.; DA. 1974; VOL. 11; NO 4; PP. 675-679; BIBL. 14 REF.; (CONF. STRUCT. PROP. RELATIONSHIPS THICK FILMS BULK COATINGS. PROC.; SAN FRANCISCO; 1974)Conference Paper

DISPOSITIFS POUR LA PRODUCTION DE FILTRES INTERFERENTIELS DE BANDE ETROITE PAR LA METHODE DE PULVERISATION CATHODIQUELAVRISHCHEV AP.1974; OPT.-MEKH. PROMYSL.; S.S.S.R.; DA. 1974; NO 6; PP. 44-47; BIBL. 4 REF.Article

SPUTTER COATINGS. ITS PRINCIPLES AND POTENTIALTHORNTON JA.1973; S.A.E. TRANS.; U.S.A.; DA. 1973; VOL. 82; NO 3; PP. 1787-1805; BIBL. 1 P. 1/2Article

CO-SPUTTERING. ITS LIMITATIONS AND POSSIBILITIES.HANAK JJ.1975; VIDE; FR.; DA. 1975; NO 175; PP. 11-18; BIBL. 32 REF.Article

COLUMNAR GRAINS AND TWINS IN HIGH-PURITY SPUTTER-DEPOSITED COPPERDAHLGREN SD.1974; J. VACUUM SCI. TECHNOL.; U.S.A.; DA. 1974; VOL. 11; NO 4; PP. 832-836; BIBL. 13 REF.; (CONF. STRUCT. PROP. RELATIONSHIPS THICK FILMS BULK COATINGS. PROC.; SAN FRANCISCO; 1974)Conference Paper

SPUTTERING OF RHODIUM FILMSCOX REL; HERSEE SD.1972; THIN SOLID FILMS; NETHERL.; DA. 1972; VOL. 11; NO 2; PP. 323-328; BIBL. 3 REF.Serial Issue

CHANGEMENT DE STRUCTURE DES COUCHES DE TANTALE PULVERISEES AU COURS DE LA STABILISATION DES CONDITIONS DE DEPOT.CHRISTENSEN O; MARHIC C; KLEIN BJ et al.1975; THIN SOLID FILMS; NETHERL.; DA. 1975; VOL. 27; NO 1; PP. 39-47; ABS. ANGL.; BIBL. 13 REF.Article

EFFECT OF NITROGEN ON THE ELECTRICAL AND STRUCTURAL PROPERTIES OF TRIODE-SPUTTERED TANTALUMWILLMOTT DJ.1972; J. APPL. PHYS.; U.S.A.; DA. 1972; VOL. 43; NO 12; PP. 4865-4871; BIBL. 25 REF.Serial Issue

TEMPERATURE RISE DURING FILM DEPOSITION BY RF AND DC SPUTTERINGLAU SS; MILLS RH; MUTH DG et al.1972; J. VACUUM SCI. TECHNOL.; U.S.A.; DA. 1972; VOL. 9; NO 4; PP. 1196-1202; BIBL. 13 REF.Serial Issue

A NEW AC SPUTTERING TECHNIQUE FOR THE DEPOSITION OF THIN FILMSKUMAGAI HY.1972; I.E.E.E. TRANS. PARTS HYBR. PACKAG.; U.S.A.; DA. 1972; VOL. 8; NO 3; PP. 7-10; BIBL. 5 REF.Serial Issue

THE ORIGIN OF INTERNAL STRESS IN LOW-VOLTAGE SPUTTERED TUNGSTEN FILMS.SUN RC; TISONE TC; CRUZAN PD et al.1975; J. APPL. PHYS.; U.S.A.; DA. 1975; VOL. 46; NO 1; PP. 112-117; BIBL. 14 REF.Article

DEPOT DE VANADIUM PAR PULVERISATION CATHODIQUEFAULCONNIER P; POIRIER R.1972; DGRST-7172981; FR.; DA. 1972; PP. 1-21; H.T. 20; BIBL. 8 REF.; (RAPP. FINAL, ACTION CONCERTEE: C.C.M.)Report

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