Silicon direct bonding for sensor applications : characterization of the bond qualityHARENDT, C; HÖFFLINGER, B; GRAF, H.-G et al.Sensors and actuators. A, Physical. 1991, Vol 25, Num 1-3, pp 87-92Article

Forty years of Moore's Law : ever smaller transistors and ever larger wafersDAN HUTCHESON, G.Proceedings - Electrochemical Society. 2006, pp 3-9, issn 0161-6374, isbn 1-56677-439-X, 1Vol, 7 p.Conference Paper

Defect clustering viewed through generalized Poisson distributionTYAGI, A; BAYOUMI, M. A.IEEE transactions on semiconductor manufacturing. 1992, Vol 5, Num 3, pp 196-206, issn 0894-6507Article

International conference on wafer scale integration, San Francisco CA, January 22-24, 1992Jain, Vijay K; Wyatt, Peter W.International conference on wafer scale integration. 1992, isbn 0-7803-0676-7, XI, 363 p, isbn 0-7803-0676-7Conference Proceedings

The challenge to record correct fast WLR monitoring data from productive wafers and to set reasonable limitsMARTIN, Andreas; FAZEKAS, Josef; PIETSCH, Andreas et al.IEEE international reliability physics symposium. 2004, pp 661-662, isbn 0-7803-8315-X, 1Vol, 2 p.Conference Paper

The challenge of ultra thin chip assemblyFEIL, Michael; ADLER, Cliff; HEMMETZBERGER, Dieter et al.Proceedings - Electronic Components Conference. 2004, issn 0569-5503, isbn 0-7803-8365-6, 2Vol, Vol 1, 35-40Conference Paper

Front end compatible wafer level CSP-technology for FR- and HT-applicationsBURGER, Klaus.SPIE proceedings series. 2003, pp 714-718, isbn 0-8194-5189-4, 5 p.Conference Paper

VLSI reliability challenges : from device physics to wafer scale systemsTAKEDA, E; IKUZAKI, K; KATTO, H et al.Proceedings of the IEEE. 1993, Vol 81, Num 5, pp 653-674, issn 0018-9219Article

Experimental study of NH₃-O₂ oxidation of si watersYEN-CHUAN TSENG; SHONO, K.Japanese journal of applied physics. 1991, Vol 30, Num 2A, pp L222-L223, issn 0021-4922, 2Article

Shuttle fabrication for designs with lifted I/OsLIN, Rung-Bin; WU, Meng-Chiou; TSAI, Shih-Cheng et al.Proceedings of SPIE, the International Society for Optical Engineering. 2007, pp 67305C.1-67305C.10, issn 0277-786X, isbn 978-0-8194-6887-1Conference Paper

Interrupt reduction by triggering of maintenance activities using APC machine alarm analysisBRÜGGEMANN, Michael.IEEE / SEMI advanced semiconductor manufacturing conference. 2004, pp 57-60, isbn 0-7803-8312-5, 1Vol, 4 p.Conference Paper

Thermal properties of semiconductor wafers heated locally by Nd:YAG laser beamKAWAMURA, T.NEC research & development. 1988, Num 91, pp 1-10, issn 0547-051XArticle

Inspectability of PSM masks for the 32nm node using STARlight2+HUANG, Chain-Ting; CHENG, Yung-Feng; KUO, Shih-Ming et al.Proceedings of SPIE, the International Society for Optical Engineering. 2008, Vol 7028, pp 70282P.1-70282P.8, issn 0277-786X, isbn 978-0-8194-7243-4 0-8194-7243-3, 2Conference Paper

Introduction of new techniques for matching overlay enhancementKIKUCHI, Takahisa; ISHII, Yuuki; TOKUDA, Noriaki et al.SPIE proceedings series. 2001, pp 1608-1616, isbn 0-8194-4032-9, 2VolConference Paper

Aerial image sensor for self-calibration of wafer steppersHAGIWARA, Tsuneyuki; MIZUTANI, Hideo; KONDO, Naoto et al.SPIE proceedings series. 2001, pp 1635-1643, isbn 0-8194-4032-9, 2VolConference Paper

Feed forward test methodology utilizing device identificationCABBIBO, A; CONDER, J; JACOBS, M et al.International Test Conference. 2004, pp 655-660, isbn 0-7803-8580-2, 1Vol, 6 p.Conference Paper

Analysis of wafer process duration for ab initio calculation of capacity, throughput and bottleneck equipments in a wafer fabETZEL, H; STAUDT, P; OERTEL, H et al.IEEE / SEMI advanced semiconductor manufacturing conference. 2004, pp 330-333, isbn 0-7803-8312-5, 1Vol, 4 p.Conference Paper

Trace metal contamination analysis of the bevel and edge exclusion area on starting siliconSPARKS, Chris M; BEEBE, Meredith R.Proceedings - Electrochemical Society. 2004, pp 329-333, issn 0161-6374, isbn 1-56677-418-7, 5 p.Conference Paper

Tin-silver electroplating of Pb-free wafer bumpsBEICA, Rozalia; WANG, Kai; BROWN, Neil et al.SPIE proceedings series. 2003, pp 835-840, isbn 0-8194-5189-4, 6 p.Conference Paper

Pre-imidized photoimageable polyimide as a dielectric for high density multichip modulesCECH, J. M; BURNETT, A. F; KNAPP, L et al.Polymer engineering and science. 1992, Vol 32, Num 21, pp 1646-1652, issn 0032-3888Conference Paper

Disjoint covers in replicated heterogeneous arraysMCKINLEY, P. K; HASAN, N; LIBESKIND-HADAS, R et al.SIAM journal on discrete mathematics (Print). 1991, Vol 4, Num 2, pp 281-292, issn 0895-4801Article

Introducing a scale structure to correlate quality and reliabilityROESCH, William J; HAMADA, Dorothy June M; LITTLETON, David et al.Microelectronics and reliability. 2012, Vol 52, Num 1, pp 16-22, issn 0026-2714, 7 p.Conference Paper

Resist baking conversion from wafers to mask- substratesKOBAYASHI, Hideo.Proceedings of SPIE, the International Society for Optical Engineering. 2006, issn 0277-786X, isbn 0-8194-5853-8, 2Vol, Part 1, 408-415Conference Paper

The suppression method of powder formation in ArF photoresistLEE, Geunsu; KIM, Heesung; LEE, Eungsok et al.Proceedings of SPIE, the International Society for Optical Engineering. 2006, issn 0277-786X, isbn 0-8194-6196-2, 2Vol, Part 2, 61533F.1-61533F.7Conference Paper

Light emission at 1530 nm from mixture of Er₂O₃ and P₂O₅ nanoparticles on siliconSUN, Kuo-Jui; SU, Yi-Shin; LIN, Ching-Fuh et al.IEEE conference on nanotechnology. 2004, pp 80-82, isbn 0-7803-8536-5, 1Vol, 3 p.Conference Paper