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Results 1 to 25 of 3269

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Dependence of the dissolution characteristics of As2S3 as a photoresist on the condensation rate and evaporation temperatureMEDNIKAROV, B.Journal of vacuum science and technology. B. Microelectronics processing and phenomena. 1989, Vol 7, Num 3, pp 561-564, issn 0734-211X, 4 p.Article

Observation of internal structure of a positive photoresist image using cross-sectional exposure methodUETANI, Y; HANABATA, M; FURUTA, A et al.Journal of vacuum science and technology. B. Microelectronics processing and phenomena. 1989, Vol 7, Num 3, pp 569-571, issn 0734-211X, 3 p.Article

High-power laser interference lithography process on photoresist : Effect of laser fluence and polarisationELLMAN, M; RODRIGUEZ, A; PEREZ, N et al.Applied surface science. 2009, Vol 255, Num 10, pp 5537-5541, issn 0169-4332, 5 p.Conference Paper

Submicrometer lithography using lensless high-efficiency holographic systemsCHEN, R. T; SADOVNIK, L; AYE, T. M et al.Optics letters. 1990, Vol 15, Num 15, pp 869-871, issn 0146-9592, 3 p.Article

Masking effect of photoactive compounds with various ballast molecules in novolak-naphthoquinonediazide positive photoresistsKISHIMURA, S; YAMAGUCHI, A; YAMADA, Y et al.Polymer engineering and science. 1992, Vol 32, Num 20, pp 1550-1555, issn 0032-3888Conference Paper

Deep etching of glass wafers using sputtered molybdenum masksCEYSSENS, Frederik; PUERS, Robert.Journal of micromechanics and microengineering (Print). 2009, Vol 19, Num 6, issn 0960-1317, 067001.1-067001.6Article

Influence of lens aberrations on high resolution imaging on low reflectivity substratesMARTIN, B; ARTHUR, G; WALLACE, C et al.SPIE proceedings series. 1998, pp 372-383, isbn 0-8194-2777-2Conference Paper

Novolak design concept for high performance positive photoresistsHANABATA, M; OI, F; FURUTA, A et al.Polymer engineering and science. 1992, Vol 32, Num 20, pp 1494-1499, issn 0032-3888Conference Paper

Development of a microfabricated device for low-voltage electropermeabilization of adherent cellsHAKAMADA, Kazumi; SHINTAKU, Hirofumi; NAGATA, Takeshi et al.Journal of bioscience and bioengineering. 2013, Vol 115, Num 3, pp 314-319, issn 1389-1723, 6 p.Article

Photoresist microparabolas for beam steeringROTICH, S. K; SMITH, J. G; EVANS, A. G. R et al.SPIE proceedings series. 1998, pp 349-356, isbn 0-8194-2726-8Conference Paper

Polymers for 157 nm photoresist applications : A progress reportPATTERSON, Kyle; YAMACHIKA, Mikio; CONLEY, Willard et al.SPIE proceedings series. 2000, pp 365-374, isbn 0-8194-3617-8Conference Paper

Acid formation from various sulfonates in a chemical amplification positive resistUENO, T; SCHLEGEL, L; HAYASHI, N et al.Polymer engineering and science. 1992, Vol 32, Num 20, pp 1511-1515, issn 0032-3888Conference Paper

Resolution characterization of a novel silicone-based positive photoresistTANAKA, A; BAN, H; IMAMURA, S et al.Journal of vacuum science and technology. B. Microelectronics processing and phenomena. 1989, Vol 7, Num 3, pp 572-575, issn 0734-211X, 4 p.Article

Contrast enhancement of positive photoresist due to indenecarboxylic acidPAMPALONE, T. R; DI PIAZZA, J. J.Journal of the Electrochemical Society. 1988, Vol 135, Num 10, pp 2644-2646, issn 0013-4651Article

Prospects for using existing resists for evaluating 157-nm imaging systemsFEDYNYSHYN, Theodore H; KUNZ, Roderick R; DORAN, Scott P et al.SPIE proceedings series. 2000, pp 335-346, isbn 0-8194-3617-8Conference Paper

Characterization of diazonaphthoquinone-novolac resin-type positive photoresist for g-line and i-line exposure using water-soluble contrast enhancement materialsENDO, M; SASAGO, M; UENO, A et al.Journal of vacuum science and technology. B. Microelectronics processing and phenomena. 1989, Vol 7, Num 3, pp 565-568, issn 0734-211X, 4 p.Article

REMOVAL OF PHOTORESIST FILM RESIDUES FROM WAFER SURFACESPETERS DA; DECKERT CA.1979; J. ELECTROCHEM. SOC.; USA; DA. 1979; VOL. 126; NO 5; PP. 883-886; BIBL. 7 REF.Article

Advances in resist materials and processing technology XXVII (22-24 February 2010, San Jose, California, United States)Allen, Robert D; Somervell, Mark Howell.Proceedings of SPIE, the International Society for Optical Engineering. 2010, Vol 7639, issn 0277-786X, isbn 978-0-8194-8053-8 0-8194-8053-3, 2 vol, 2, isbn 978-0-8194-8053-8 0-8194-8053-3Conference Proceedings

Optimisation of maximum diffraction efficiency of photoresist gratingsSALMINEN, O; SORMUNEN, K; KEINONEN, T et al.Optik (Stuttgart). 1993, Vol 95, Num 2, pp 49-52, issn 0030-4026Article

Recording complex holograms on photoresist by using an ion-implantation methodWONG, K. W; YIP, W. C; CHENG, L. M et al.Applied optics. 1993, Vol 32, Num 26, pp 4955-4959, issn 0003-6935Article

Millimeter-wave measurements of the complex dielectric constant of an advanced thick film UV photoresistCOLLINS, C. E; MILES, R. E; POLLARD, R. D et al.Journal of electronic materials. 1998, Vol 27, Num 6, pp L40-L42, issn 0361-5235Conference Paper

Fabrication of all-polymer micro-DMFCs using UV-sensitive photoresistCHA, Hye-Yeon; CHOI, Hoo-Gon; NAM, Jae-Do et al.Electrochimica acta. 2004, Vol 50, Num 2-3, pp 795-799, issn 0013-4686, 5 p.Conference Paper

A study for polarized illumination effects in photo resistJUNJIANG LEI; MIN BAI; SHIELY, Jim et al.Proceedings of SPIE, the International Society for Optical Engineering. 2006, issn 0277-786X, isbn 0-8194-5853-8, 2Vol, Part 2, 800-807Conference Paper

Process characterization of an aqueous developable photosensitive polyimide on a broadband stepperFLACK, Warren W; KULAS, Scott; FRANKLIN, Craig et al.SPIE proceedings series. 2000, pp 452-463, isbn 0-8194-3617-8Conference Paper

Fast etch anti-reflective coating for sub-0.35μm i-line microlithography applicationsWILLIAMS, P; XIE SHAO; LAMB, J et al.SPIE proceedings series. 1998, pp 518-525, isbn 0-8194-2777-2Conference Paper

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