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Results 1 to 25 of 3692

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How to remove pin gate arrays from PCB'sMACDONALD, T. M.Electronic manufacturing. 1989, Vol 35, Num 2, pp 14-16, 3 p.Article

How to succeed with automatic inspection equipmentRIELEY, R. V.Electronic manufacturing. 1990, Vol 36, Num 7, pp 28-30, 3 p.Article

Focus on circuit board rework and repairBAUSELL, J.Electronic manufacturing. 1989, Vol 35, Num 2, pp 11-13, 3 p.Article

Solder joint process control using 3-D measurementsBAKER, P. D.Electronic manufacturing. 1990, Vol 36, Num 7, pp 32-33, 2 p.Article

Single- and multilayer molded circuits using image decals in the molding processWOOD, F; TEMPLIN, J.Electronic manufacturing. 1990, Vol 36, Num 7, pp 24-27, 4 p.Article

FLEXIBLE CIRCUITS BEND TO DESIGNERS' WILL.LYMAN J.1977; ELECTRONICS; U.S.A.; DA. 1977; VOL. 50; NO 19; PP. 97-105Article

PC BOARD LAMINATORS CUT COSTS BY DOLLAR-THOUSANDS PER YEAR WITH NEW PRESSPAD1983; ELECTRI.ONICS; ISSN 512907; USA; DA. 1983; VOL. 29; NO 6; PP. 40Article

SOLDER FUSED INTERCONNECTIONS IN MULTILAYER CIRCUITS.VOIDA G.1977; INSULAT. CIRCUITS; U.S.A.; DA. 1977; VOL. 23; NO 10; PP. 77-82; BIBL. 2 REF.Article

OPTIMUM PROCEDURES FOR FABRICATING RIGID-FLEXIBLE MULTILAYER BOARDS.CURRIER RF.1978; INSULAT. CIRCUITS; U.S.A.; DA. 1978; VOL. 24; NO 5; PP. 29-31Article

FABRICATING RELIABILITY INTO FLEXIBLE PRINTED WIRING.HAYS SA.1977; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1977; VOL. 17; NO 7; PP. 111-117Article

BEARBEITUNG VON MULTILAYER- UND FLEXSCHALTUNGEN = MISE EN OEUVRE DES CIRCUITS IMPRIMES MULTICOUCHES ET DES CIRCUITS IMPRIMES SOUPLESGRAPENTIN HJ; WOLFF J.1979; GALVANOTECHNIK; DEU; DA. 1979; VOL. 70; NO 10; PP. 958-960; ABS. ENG/FREArticle

Design, fabrication and performance evaluation of a miniature air breathing direct formic acid fuel cell based on printed circuit board technologyPING HONG; SHIJUN LIAO; JIANHUANG ZENG et al.Journal of power sources (Print). 2010, Vol 195, Num 21, pp 7332-7337, issn 0378-7753, 6 p.Article

Infrared curing of conformal coatings: optimizing the processMAYER, S.Electronic manufacturing. 1990, Vol 36, Num 9, pp 18-20, 3 p.Article

Conformal coatings for PCB's: what's the cost?MILLER, R. E.Electronic manufacturing. 1990, Vol 36, Num 9, pp 13-16, 4 p.Article

In-line solvent vs. closed-loop aqueous cleaning: comparing the costsFISCHER, M. S; SZYMANOWSKI, R.Electronic manufacturing. 1990, Vol 36, Num 9, pp 23-26, 4 p.Article

Flow Induced Deflection and Stress on Flexible Printed Circuit Board in Fan-Cooled Electronic Systems: FSI ApproachCHIAT LEONG, Wei; ABDULLAH, M. Z; ABDUL MUJEEBU, M et al.IEEE transactions on components, packaging, and manufacturing technology (2011. Print). 2012, Vol 2, Num 3-4, pp 617-624, issn 2156-3950, 8 p.Article

Study on the Fluid―Structure Interaction of Flexible Printed Circuit Board Electronics in the Flow EnvironmentWEI CHIAT LEONG; MOHD ZULKIFLY ABDULLAH; CHU YEE KHOR et al.IEEE transactions on components, packaging, and manufacturing technology (2011. Print). 2012, Vol 2, Num 7-8, pp 1335-1345, issn 2156-3950, 11 p.Article

A reduction technique for layers in multilayer printed wiring boards. Using additional vias between grid pointsGHAMESHLU, M; YOSHIDA, N.Transactions of the Institute of Electronics and Communication Engineers of Japan. Section E. 1988, Vol 71, Num 9, pp 887-894, issn 0387-236XArticle

Electrical design of signal lines for multilayer printed circuit boardsCHANG, C. S.IBM journal of research and development. 1988, Vol 32, Num 5, pp 647-657, issn 0018-8646Article

Increase of Common-Mode Radiation due to Guard Trace Voltage and Determination of Effective Via-LocationMATSUSHIMA, Tohlu; WATANABE, Tetsushi; TOYOTA, Yoshitaka et al.IEICE transactions on communications. 2009, Vol 92, Num 6, pp 1929-1936, issn 0916-8516, 8 p.Conference Paper

Reliability, thermal analysis and optimization wirability design of multi-layer PCB boardsTIAN, Xijin; PALUSINSKI, Olgierd A.Proceedings. Annual Reliability and Maintainability Symposium. 2002, pp 392-398, issn 0149-144X, isbn 0-7803-7348-0, 7 p.Conference Paper

LE CIRCUIT IMPRIME EN EVOLUTION1980; COMPOS. MEC., ELECTR. ELECTRON.; ISSN 0339-1558; FRA; DA. 1980; NO 119; PP. 41-44; 3 P.Article

A heuristic for multiple-feeder PCB manufacturingVOLGENANT, A; DE WAAL, A.The Journal of the Operational Research Society. 2006, Vol 57, Num 9, pp 1134-1141, issn 0160-5682, 8 p.Article

Schnelle Multilayer für höchste Anforderungen : Warum ECL- und GaAs-Applikationen neue Leiterplatten-Technologien erfordern = Fast multilayer for ECL/GaAs-applicationsTHÜRINGER, R; BUCK, T.F & M. Feinwerktechnik, Mikrotechnik, Messtechnik. 1996, Vol 104, Num 11-12, pp 849-852, issn 0944-1018Article

High density multilayer printed circuit board for HITAC M-880TAKAHASHI, A; OOKI, N; NAGAI, A et al.IEEE transactions on components, hybrids, and manufacturing technology. 1992, Vol 15, Num 4, pp 418-425, issn 0148-6411Conference Paper

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