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Study of a dipping method for flip-chip flux coatingZHANG WEI; LI JUNHUI; HAN LEI et al.Microelectronics and reliability. 2014, Vol 54, Num 11, pp 2479-2486, issn 0026-2714, 8 p.Article

Predicting the strength of underfill/polyimide interfacesPEARSON, Raymond A; OLDAK, Robert.International symposium on advanced packaging materials. 2004, pp 264-266, isbn 0-7803-8436-9, 1Vol, 3 p.Conference Paper

Thermal interaction of an array of flip chip componentsJOINER, Bennett; DE OCA, Tony Montes.Annual IEEE semiconductor thermal measurement and management symposium. 2004, pp 286-291, isbn 0-7803-8363-X, 1Vol, 6 p.Conference Paper

Stencil printing technology for 100μm flip chip bumpingMANESSIS, Dionysios; PATZELT, Rainer; OSTMANN, Andreas et al.SPIE proceedings series. 2003, pp 241-246, isbn 0-8194-5189-4, 6 p.Conference Paper

Thermal performance of a high end flip-chip organic packageCALMIDI, V. V; SATHE, S. B.SPIE proceedings series. 2003, pp 511-516, isbn 0-8194-5189-4, 6 p.Conference Paper

Bondability Study of Chip-on-Film (COF) Inner Lead Bonding (ILB) Using Conventional Gang BonderCHEN, Ching-I; NI, Ching-Yu; CHANG, Chi-Min et al.IEEE transactions on electronics packaging manufacturing. 2008, Vol 31, Num 4, pp 285-290, issn 1521-334X, 6 p.Article

Quality and reliability of 100 μm pitch flip chip ICs on flexible substrates with adhesive interconnectionsDE VRIES, J; VAN DELFT, J; SLOB, C et al.SPIE proceedings series. 2003, pp 81-86, isbn 0-8194-5189-4, 6 p.Conference Paper

Collective flip-chip technology for infrared focal plane arraysTISSOT, Jean-Luc; MARION, Francois.Sensors and materials. 2000, Vol 12, Num 7, pp 389-396, issn 0914-4935Article

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Effect of underfill on electromigration lifetime in flip chip jointsYAMANAKA, Kimihiro; OOYOSHI, Takafumi; NEJIME, Takayuki et al.Journal of alloys and compounds. 2009, Vol 481, Num 1-2, pp 659-663, issn 0925-8388, 5 p.Article

Reliability of ACA bonded flip chip joints on LCP and PI substratesFRISK, Laura; CUMINI, Anne.Soldering & surface mount technology. 2006, Vol 18, Num 4, pp 12-20, issn 0954-0911, 9 p.Article

Failure modes of flip chip solder joints under high electric current stressingHUA YE; BASARAN, Cemal; HOPKINS, Douglas C et al.SPIE proceedings series. 2003, pp 801-806, isbn 0-8194-5189-4, 6 p.Conference Paper

Modeling of a non-Newtonian flow between parallel plates in a flip chip encapsulationYOUNG, Wen-Bin.Microelectronics and reliability. 2010, Vol 50, Num 7, pp 995-999, issn 0026-2714, 5 p.Article

Nitride-Based Flip-Chip ITO LEDsCHANG, S. J; CHANG, C. S; SU, Y. K et al.IEEE transactions on advanced packaging. 2005, Vol 28, Num 2, pp 273-277, issn 1521-3323, 5 p.Article

Efficient transfer of a VA-SWNT film by a flip-over techniqueMYUNG JONG KIM; NICHOLAS, Nolan; KITTRELL, Carter et al.Journal of the American Chemical Society. 2006, Vol 128, Num 29, pp 9312-9313, issn 0002-7863, 2 p.Article

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Epoxy flux for lead-free solderingWUSHENG YIN; LEE, Ning-Cheng.SPIE proceedings series. 2003, pp 731-738, isbn 0-8194-5189-4, 8 p.Conference Paper

High current induced failure of ACAs flip chip jointKWON, Woon-Seong; PAIK, Kyung-Wook.Proceedings - Electronic Components Conference. 2002, pp 1130-1134, issn 0569-5503, isbn 0-7803-7430-4, 5 p.Conference Paper

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Electroplated solder joints for flip-chip applicationsYUNG, E. K; TURLIK, I.IEEE transactions on components, hybrids, and manufacturing technology. 1991, Vol 14, Num 3, pp 549-559, issn 0148-6411Conference Paper

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Chip warpage model for reliability prediction of delamination failuresSE YOUNG YANG; KWON, Woon-Seong; LEE, Soon-Bok et al.Microelectronics and reliability. 2012, Vol 52, Num 4, pp 718-724, issn 0026-2714, 7 p.Article