kw.\*:("Pulvérisation irradiation")
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An investigation of hysteresis effects as a function of pumping speed, sputtering current, and O2/Ar ratio, in Ti-O2 reactive sputtering processesKUSANO, E.Journal of applied physics. 1991, Vol 70, Num 11, pp 7089-7096, issn 0021-8979Article
Investigations on fabrics coated with precious metals using the magnetron sputter technique with regard to their anti-microbial propertiesSCHOLZ, J; NOCKE, G; HOLLSTEIN, F et al.Surface & coatings technology. 2005, Vol 192, Num 2-3, pp 252-256, issn 0257-8972, 5 p.Article
Electronegativity effects in chemical sputteringSACHER, E; CURRIE, J. F; YELON, A et al.Surface science. 1989, Vol 220, Num 1, pp L679-L686, issn 0039-6028Article
Structural, optical and electrical characterization of ITO, ITO/Ag and ITO/Ni transparent conductive electrodesAHMAD HADI ALI; SHUHAIMI, Ahmad; HASSAN, Zainuriah et al.Applied surface science. 2014, Vol 288, pp 599-603, issn 0169-4332, 5 p.Article
An investigation of an industrial coating environment with planar probe technologyCOOKE, K. E; GOODYEAR, A; HAMPSHIRE, J et al.Surface & coatings technology. 2004, Vol 188-89, pp 750-755, issn 0257-8972, 6 p.Conference Paper
An axial dispersion model of competing ion etching and mixing of binary solidsELIAS, R. J; BARTEAU, M. A.AIChE journal. 1993, Vol 39, Num 2, pp 294-301, issn 0001-1541Article
On the dual role of the Knudsen layer and unsteady, adiabatic expansion in pulse sputtering phenomenaKELLY, R.The Journal of chemical physics. 1990, Vol 92, Num 8, pp 5047-5056, issn 0021-9606Article
The effect of atomic-scale etch pit formation on depth resolution in sputter profilingCARTER, G; NOBES, M. J; KATARDJIEV, I. V et al.Surface and interface analysis. 1990, Vol 15, Num 7, pp 447-450, issn 0142-2421Article
Investigation on fabricating continuous vivid sharkskin surface by bio-replicated rolling methodLUO YUEHAO; ZHANG DEYUAN.Applied surface science. 2013, Vol 282, pp 370-375, issn 0169-4332, 6 p.Article
SIMS sputtering rates in biogenic aragonite: implications for culture calibration studies for palaeoenvironmental reconstructionALLISON, Nicola; CHAMBERS, David; FINCH, Adrian A et al.Surface and interface analysis. 2013, Vol 45, Num 9, pp 1389-1394, issn 0142-2421, 6 p.Article
Formation of Sim+ and SimCn+ clusters by C60+ sputtering of SiLYON, Ian; HENKEL, Torsten; ROST, Detlef et al.Applied surface science. 2010, Vol 256, Num 21, pp 6480-6487, issn 0169-4332, 8 p.Article
Some characteristics in the interaction of slow highly charged Iq+ ions with a Si(111) 1 x 1-H surfaceTONA, Masahide; NAGATA, Kazuo; TAKAHASHI, Satoshi et al.Surface science. 2006, Vol 600, Num 1, pp 124-132, issn 0039-6028, 9 p.Article
Magnetic null discharge sputtering with full target erosionSUNG, Youl-Moon.Surface & coatings technology. 2005, Vol 193, Num 1-3, pp 123-128, issn 0257-8972, 6 p.Conference Paper
Ionization enhancement of zirconium atoms in inductively coupled dischargeNAKAMURA, Keiji; YOSHINAGA, Hiroaki; YUKIMURA, Ken et al.Surface & coatings technology. 2005, Vol 196, Num 1-3, pp 188-191, issn 0257-8972, 4 p.Conference Paper
An approach to estimate the sputtering yield of water in glow-discharge electrolysisMATSUSHIMA, Y; TEZUKA, A; SUMIDA, K et al.Journal of materials science letters. 2003, Vol 22, Num 18, pp 1259-1260, issn 0261-8028, 2 p.Article
Plasma sputtering of copper coatings on aluminum electrical contactsREVUN, S. A; MURAV'EVA, E. L; EGOROV, N. G et al.Russian electrical engineering. 1994, Vol 65, Num 6, pp 1-5, issn 1068-3712Article
Improved optoelectronics properties of ITO-based transparent conductive electrodes with the insertion of Ag/Ni under-layerAHMAD HADI ALI; AHMAD SHUHAIMI ABU BAKAR; HASSAN, Zainuriah et al.Applied surface science. 2014, Vol 315, pp 387-391, issn 0169-4332, 5 p.Article
Comparison of HIPIMS sputtered Ag- and Cu-surfaces leading to accelerated bacterial inactivation in the darkRTIMI, Sami; BAGHRICHE, Oualid; PULGARIN, Cesar et al.Surface & coatings technology. 2014, Vol 250, pp 14-20, issn 0257-8972, 7 p.Conference Paper
The influences of plasma ion bombarded on crystallization, electrical and mechanical properties of Zn-In-Sn-O filmsCHEN, K. J; HUNG, F. Y; CHANG, S. J et al.Applied surface science. 2011, Vol 258, Num 3, pp 1157-1163, issn 0169-4332, 7 p.Article
Phase transition and microstructure change in Ta-Zr alloy films by co-sputteringTANG, Z. Z; HSIEH, J. H; ZHANG, S. Y et al.Surface & coatings technology. 2005, Vol 198, Num 1-3, pp 110-113, issn 0257-8972, 4 p.Conference Paper
Comments on explosive mechanisms of laser sputteringKELLY, R; MIOTELLO, A.Applied surface science. 1996, Vol 96-98, pp 205-215, issn 0169-4332Conference Paper
Approaching the limits of high resolution depth profilingHOFMANN, S.Applied surface science. 1993, Vol 70-71, Num 1-4, pp 9-19, issn 0169-4332, AConference Paper
Reduction of pumping time for a sputtering system by glow discharge cleaningKAGATSUME, A; UEDA, S; AKIBA, M et al.Journal of vacuum science and technology. A. Vacuum, surfaces, and films. 1991, Vol 9, Num 4, pp 2364-2368, issn 0734-2101Article
Roll-to-roll sputter deposition on flexible glass substratesTAMAGAKI, Hiroshi; IKARI, Yoshimitu; OHBA, Naoki et al.Surface & coatings technology. 2014, Vol 241, pp 138-141, issn 0257-8972, 4 p.Conference Paper
Oxygen and CO Adsorption on Au/SiO2 Catalysts Prepared by Magnetron Sputtering: The Role of Oxygen StorageXIAOLIN ZHENG; VEITH, Gabriel M; REDEKOP, Evgeniy et al.Industrial & engineering chemistry research. 2010, Vol 49, Num 21, pp 10428-10437, issn 0888-5885, 10 p.Conference Paper