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Results 1 to 25 of 9542

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An investigation of hysteresis effects as a function of pumping speed, sputtering current, and O2/Ar ratio, in Ti-O2 reactive sputtering processesKUSANO, E.Journal of applied physics. 1991, Vol 70, Num 11, pp 7089-7096, issn 0021-8979Article

Investigations on fabrics coated with precious metals using the magnetron sputter technique with regard to their anti-microbial propertiesSCHOLZ, J; NOCKE, G; HOLLSTEIN, F et al.Surface & coatings technology. 2005, Vol 192, Num 2-3, pp 252-256, issn 0257-8972, 5 p.Article

Electronegativity effects in chemical sputteringSACHER, E; CURRIE, J. F; YELON, A et al.Surface science. 1989, Vol 220, Num 1, pp L679-L686, issn 0039-6028Article

Structural, optical and electrical characterization of ITO, ITO/Ag and ITO/Ni transparent conductive electrodesAHMAD HADI ALI; SHUHAIMI, Ahmad; HASSAN, Zainuriah et al.Applied surface science. 2014, Vol 288, pp 599-603, issn 0169-4332, 5 p.Article

An investigation of an industrial coating environment with planar probe technologyCOOKE, K. E; GOODYEAR, A; HAMPSHIRE, J et al.Surface & coatings technology. 2004, Vol 188-89, pp 750-755, issn 0257-8972, 6 p.Conference Paper

An axial dispersion model of competing ion etching and mixing of binary solidsELIAS, R. J; BARTEAU, M. A.AIChE journal. 1993, Vol 39, Num 2, pp 294-301, issn 0001-1541Article

On the dual role of the Knudsen layer and unsteady, adiabatic expansion in pulse sputtering phenomenaKELLY, R.The Journal of chemical physics. 1990, Vol 92, Num 8, pp 5047-5056, issn 0021-9606Article

The effect of atomic-scale etch pit formation on depth resolution in sputter profilingCARTER, G; NOBES, M. J; KATARDJIEV, I. V et al.Surface and interface analysis. 1990, Vol 15, Num 7, pp 447-450, issn 0142-2421Article

Investigation on fabricating continuous vivid sharkskin surface by bio-replicated rolling methodLUO YUEHAO; ZHANG DEYUAN.Applied surface science. 2013, Vol 282, pp 370-375, issn 0169-4332, 6 p.Article

SIMS sputtering rates in biogenic aragonite: implications for culture calibration studies for palaeoenvironmental reconstructionALLISON, Nicola; CHAMBERS, David; FINCH, Adrian A et al.Surface and interface analysis. 2013, Vol 45, Num 9, pp 1389-1394, issn 0142-2421, 6 p.Article

Formation of Sim+ and SimCn+ clusters by C60+ sputtering of SiLYON, Ian; HENKEL, Torsten; ROST, Detlef et al.Applied surface science. 2010, Vol 256, Num 21, pp 6480-6487, issn 0169-4332, 8 p.Article

Some characteristics in the interaction of slow highly charged Iq+ ions with a Si(111) 1 x 1-H surfaceTONA, Masahide; NAGATA, Kazuo; TAKAHASHI, Satoshi et al.Surface science. 2006, Vol 600, Num 1, pp 124-132, issn 0039-6028, 9 p.Article

Magnetic null discharge sputtering with full target erosionSUNG, Youl-Moon.Surface & coatings technology. 2005, Vol 193, Num 1-3, pp 123-128, issn 0257-8972, 6 p.Conference Paper

Ionization enhancement of zirconium atoms in inductively coupled dischargeNAKAMURA, Keiji; YOSHINAGA, Hiroaki; YUKIMURA, Ken et al.Surface & coatings technology. 2005, Vol 196, Num 1-3, pp 188-191, issn 0257-8972, 4 p.Conference Paper

An approach to estimate the sputtering yield of water in glow-discharge electrolysisMATSUSHIMA, Y; TEZUKA, A; SUMIDA, K et al.Journal of materials science letters. 2003, Vol 22, Num 18, pp 1259-1260, issn 0261-8028, 2 p.Article

Plasma sputtering of copper coatings on aluminum electrical contactsREVUN, S. A; MURAV'EVA, E. L; EGOROV, N. G et al.Russian electrical engineering. 1994, Vol 65, Num 6, pp 1-5, issn 1068-3712Article

GaN-core/SiOx-sheath nanowiresHYOUN WOO KIM; JONG WOO LEE; HYO SUNG KIM et al.Surface & coatings technology. 2008, Vol 203, Num 5-7, pp 666-669, issn 0257-8972, 4 p.Conference Paper

Growth of nitrogenated fullerene-like carbon on Ni islands by ion beam sputteringPAREDEZ, P; MAIA DA COSTA, M. E. H; ZAGONEL, L. F et al.Carbon (New York, NY). 2007, Vol 45, Num 13, pp 2678-2684, issn 0008-6223, 7 p.Article

Nonlinear feedback control of surface roughness using a stochastic PDE : Design and application to a sputtering processYIMING LOU; CHRISTOFIDES, Panagiotis D.Industrial & engineering chemistry research. 2006, Vol 45, Num 21, pp 7177-7189, issn 0888-5885, 13 p.Article

A study on the reactive sputtering process with plasma chemistryCHUAN LI; HSIEH, J. H; HUANG, W. M et al.Surface & coatings technology. 2005, Vol 198, Num 1-3, pp 372-378, issn 0257-8972, 7 p.Conference Paper

The analysis of sputtering products from plasma source used for materials testingAKISHIN, A. I; CHERNIK, V. N; KULIKAUSKAS, V. S et al.Fizika i himiâ obrabotki materialov. 1996, Num 2, pp 9-13, issn 0015-3214Article

Ag- and Cu-doped multifunctional bioactive nanostructured TiCaPCON filmsSHTANSKY, D. V; BATENINA, I. V; KIRYUKHANTSEV-KORNEEV, Ph. V et al.Applied surface science. 2013, Vol 285, pp 331-343, issn 0169-4332, 13 p., bArticle

Comparative study of the influence of two distinct sulfurization ramping rates on the properties of Cu2ZnSnS4 thin filmsJIE GE; YUNHUA WU; CHUANJUN ZHANG et al.Applied surface science. 2012, Vol 258, Num 19, pp 7250-7254, issn 0169-4332, 5 p.Article

Some novel applications of sputtering technique for diffusion studies in solidsGUPTA, Devendra.Zeitschrift für Metallkunde. 2004, Vol 95, Num 10, pp 928-938, issn 0044-3093, 11 p.Article

Spatial distribution of atoms in a dc glow dischargeHOPPSTOCK, K; HARRISON, W. W.Analytical chemistry (Washington, DC). 1995, Vol 67, Num 18, pp 3167-3171, issn 0003-2700Article

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