RESISTANCES: POTENTIOMETRESBAROUH E.1982; TECHNIQUES DE L'INGENIEUR, ELECTRONIQUE; FRA; PARIS: TECHNIQUES DE L'INGENIEUR; DA. 1982; NO 98; E520; 3 P.Book Chapter

THE FUTURE OF THIN AND THICK FILM METAL RESISTORS.CROSSLEY A.1977; NEW ELECTRON.; G.B.; DA. 1977; VOL. 10; NO 10; PP. 82-89 (4P.)Article

WHY THE DESIGN NOD GOES TO RESISTORS MADE AS THIN-FILM MONO LITHIC NETWORKSBRUCK DB; POLLENS AL.1978; ELECTRONICS; USA; DA. 1978; VOL. 51; NO 16; PP. 99-104Article

THICK-FILM RESISTOR NETWORKS: THEIR MATERIALS, TRIMMING AND PRODUCTION PROCESSSOGABE K.1982; JEE, J. ELECTRON. ENG.; ISSN 0385-4507; JPN; DA. 1982; VOL. 19; NO 188; PP. 88-91Article

RESISTORS. CARBON AND METAL FILMS TOPPING CARBON COMPS1979; EVAL. ENGNG; USA; DA. 1979; VOL. 18; NO 5; PP. 46-47Article

FUSE RESISTOR CONSISTING OF A METALLIC THIN FILM AND A POLYMERIZED ORGANIC FILM ON A SUBSTRATE.HORIGUCHI K; OZAWA PJ.1977; I.E.E.E. TRANS. PARTS HYBR. PACKAG.; U.S.A.; DA. 1977; VOL. 13; NO 4; PP. 368-371; BIBL. 1 REF.Article

TEMPERATURE COEFFICIENT OF RESISTANCE COMPENSATION METHOD FOR THIN FILM PRECISE RESISTORSGORECKA DRZAZGA A; MUSZYNSKA D; PROCIOW E et al.1982; THIN SOLID FILMS; ISSN 0040-6090; CHE; DA. 1982; VOL. 94; NO 2; PP. 111-114; BIBL. 5 REF.Article

POTS, TRIMERS, AND RESISTORS.1977; EVAL. ENGNG; U.S.A.; DA. 1977-09; PP. 10-16 (6P.)Article

ELECTRICAL TRANSPORT IN THICK FILM RESISTORSHILL RM.1979; EUROPEAN HYBRID MICROELECTRONICS CONFERENCE. 2/1978/GHENT; NLD; PIJNACKER: DUTCH EFFICIENCY BUREAU; DA. 1979; PP. 95-104; BIBL. 9 REF.Conference Paper

WIRE WOUND RESISTORS THE STATE OF THE ART.BROWN P.1978; NEW ELECTRON.; GBR; DA. 1978; VOL. 11; NO 15; PP. 24-25Article

RESISTOR NETWORK TRENDS.DOWLING NB.1977; EVAL. ENGNG; U.S.A.; DA. 1977-09; PP. 18Article

NOVEL PROCESS FOR FABRICATING NICHROME-ALUMINIUM FILM RESISTOR NETWORKSSINGH A.1980; I.E.E.E. TRANS. COMPON. HYBR. MANUFG TECHNOL.; USA; DA. 1980; VOL. 3; NO 3; PP. 453; BIBL. 5 REF.Article

PIEZORESISTIVE EFFECTS IN THICK-FILM RESISTORSCANALI C; MALAVASI D; MORTEN B et al.1980; J. APPL. PHYS.; ISSN 0021-8979; USA; DA. 1980; VOL. 51; NO 6; PP. 3282-3288; BIBL. 16 REF.Article

CARBON FILM RESISTORS ADAPT TO NEW PRODUCT REQUIREMENTSHONDA Y.1979; J. ELECTRON. ENGNG; JPN; DA. 1979; VOL. 16; NO 148; PP. 24-26Article

RESISTOR NETWORKS INCREASE AUTOMATION EFFICIENCYNAGASAWA S.1979; J. ELECTRON. ENGNG; JPN; DA. 1979; VOL. 16; NO 148; PP. 22-23Article

WIREWOUND RESISTORS HANDLE MORE POWER IN SMALLER PACKAGESISODA S.1979; J. ELECTRON. ENGNG; JPN; DA. 1979; VOL. 16; NO 148; PP. 43-45Article

PRODUCTION OF RESISTORS BY ARC PLASMA SPRAYING.SMYTH RT; ANDERSON JC.1975; ELECTROCOMPON. SCI. TECHNOL.; G.B.; DA. 1975; VOL. 2; NO 2; PP. 135-145; BIBL. 7 REF.Article

THE CHEMISTRY AND STABILITY OF RUTHENIUM-BASED RESISTORSPIERCE JW; KUTY DW; LARRY JR et al.1982; SOLID STATE TECHNOLOGY; ISSN 0038-111X; USA; DA. 1982; VOL. 25; NO 10; PP. 85-93; BIBL. 7 REF.Article

NEW CARBON FILM RESISTORS FEATURE ENHANCED CHARACTERISTICSKATO M; KANBARA S.1980; J. ELECTRON. ENGNG; JPN; DA. 1980; VOL. 17; NO 160; PP. 36-37Article

STRAIN SENSITIVITY IN THICK-FILM RESISTORSCANALI C; MALAVASI D; MORTEN B et al.1980; I.E.E.E. TRANS. COMPON. HYBR. MANUFG TECHNOL.; USA; DA. 1980; VOL. 3; NO 3; PP. 421-423; BIBL. 15 REF.Article

STRAIN SENSITIVITY OF THICK-FILM RESISTORSSHAH JS.1980; I.E.E.E. TRANS. COMPON. HYBR. MANUFG TECHNOL.; USA; DA. 1980; VOL. 3; NO 4; PP. 554-564; BIBL. 13 REF.Article

TRACKING PERFORMANCE OF FILM RESISTORS: DEFINITIONS AND THEORYVAN NIE AG.1980; MICROELECTRON. RELIAB.; ISSN 0026-2714; GBR; DA. 1980; VOL. 20; NO 4; PP. 505-508; BIBL. 10 REF.Article

BORON-IMPLANTED SILICON RESISTORS.KU SM.1977; SOLID-STATE ELECTRON.; G.B.; DA. 1977; VOL. 20; NO 10; PP. 803-812; BIBL. 16 REF.Article

ON THE INTERPRETATION OF NOISE IN THICK-FILM RESISTORS.RINGO JA; STEVENS EH; GILBERT DA et al.1976; I.E.E.E. TRANS. PARTS HYBR. PACKAG.; U.S.A.; DA. 1976; VOL. 12; NO 4; PP. 378-380; BIBL. 15 REF.Article

ELECTRICAL CONDUCTION IN THICK FILM PASTE RESISTORSSMITH DPH; ANDERSON JC.1980; THIN SOLID FILMS; ISSN 0040-6090; CHE; DA. 1980; VOL. 71; NO 1; PP. 79-89; BIBL. 16 REF.Article