PRECIPITATION AT COHERENCY LOSS IN CU-0.35 WT PCT CRKOMEM Y; REZEK J.1975; METALLURG. TRANS. A; U.S.A.; DA. 1975; VOL. 6; NO 3; PP. 549-551; BIBL. 8 REF.Article

DETERMINATION OF TRACE IMPURITIES IN HIGH-PURITY REAGENTS BY MERCURY THIN-FILM ANODIC-STRIPPING VOLTAMMETRY.ISRAEL Y; OFIR T; REZEK J et al.1978; MIKROCHIM. ACTA; AUTR.; DA. 1978; NO 1-2; PP. 151-163; ABS. ALLEM.; BIBL. 10 REF.Article

X-RAY DIFFRACTION ANALYSES OF LIQUID-PHASE SINTERED COMPOUNDS OF PD₃SN AND NI₃SNWOO OT; REZEK J; SCHLESINGER M et al.1975; MATER. SCI. ENGNG; NETHERL.; DA. 1975; VOL. 18; NO 1; PP. 163-165; BIBL. 4 REF.Article

DISSOLUTION DURING DEFORMATION OF COHERENT PRECIPITATES IN THE CU-CR AND CU-AL-CR SYSTEMSSENGUPTA PK; CHATERJEE B; REZEK J et al.1972; CANAD. METALLURG. QUART.; CANADA; DA. 1972; VOL. 11; NO 4; PP. 601-603; BIBL. 3 REF.Serial Issue

Microstructural refinement of a copper-base age-hardenable alloy through thermomechanical processing = Affinement microstructural d'un alliage à base de cuivre durcissable par vieillissement à travers des processus thermomécaniquesSENGUPTA, P. K; REZEK, J.Journal of materials science letters. 1986, Vol 5, Num 4, pp 445-449, issn 0261-8028Article

Dislocation-precipitate interactions and work hardening characteristics in age-hardened Cu-2Al-0.5Cr = Interactions dislocation-précipité et caractéristiques de durcissement par déformation dans Cu-2Al-0,5 Cr durci par vieillissementSENGUPTA, P. K; REZEK, J.Journal of materials science letters. 1985, Vol 4, Num 9, pp 1085-1088, issn 0261-8028Article

TWINS IN ELECTROLESS COPPER FILMS.WOO OT; REZEK J; SCHLESINGER M et al.1975; MATER. SCI. ENGNG; NETHERL.; DA. 1975; VOL. 17; NO 1; PP. 165-168; BIBL. 5 REF.Article

ELECTRON MICROSCOPE STUDY OF THE NUCLEATION AND GROWTH OF ELECTROLESS COBALT AND NICKELCHOW SL; HEDGECOCK NE; SCHLESINGER M et al.1972; J. ELECTROCHEM. SOC.; U.S.A.; DA. 1972; VOL. 119; NO 12; PP. 1614-1619; BIBL. 5 REF.Serial Issue

Overview of optical properties of Al₂O₃ films prepared by various techniquesHOUSKA, J; BLAZEK, J; REZEK, J et al.Thin solid films. 2012, Vol 520, Num 16, pp 5405-5408, issn 0040-6090, 4 p.Article

On surface temperatures during high power pulsed magnetron sputtering using a hot targetTESAR, J; MARTAN, J; REZEK, J et al.Surface & coatings technology. 2011, Vol 206, Num 6, pp 1155-1159, issn 0257-8972, 5 p.Article

High-rate reactive high-power impulse magnetron sputtering of Ta―O―N films with tunable composition and propertiesREZEK, J; VLCEK, J; HOUSKA, J et al.Thin solid films. 2014, Vol 566, pp 70-77, issn 0040-6090, 8 p.Article

Chromic acid anodization of titanium alloy 6Al-4V for adhesive bonding = Anodisation par l'acide chromique de l'alliage de titane 6Al-4V pour le collageREZEK, J; ANGELOVICH, M; LANDKOF, M et al.Israel Journal of Technology. 1988, Vol 24, Num 3-4, pp 549-553, issn 0021-2202Conference Paper

Process stabilization and a significant enhancement of the deposition rate in reactive high-power impulse magnetron sputtering of ZrO₂and Ta₂O₅ filmsVLCEK, J; REZEK, J; HOUSKA, J et al.Surface & coatings technology. 2013, Vol 236, pp 550-556, issn 0257-8972, 7 p.Article