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Optimizing wafer polishing through phenomenological modelingRUNNELS, S. R; OLAVSON, T.Journal of the Electrochemical Society. 1995, Vol 142, Num 6, pp 2032-2036, issn 0013-4651Article

Simulation of fluid-structure interaction using patched-overset gridsFREITAS, C. J; RUNNELS, S. R.Journal of fluids and structures. 1999, Vol 13, Num 2, pp 191-207, issn 0889-9746Article

Validation of a large area three-dimensional erosion simulator for chemical mechanical polishingRUNNELS, S. R; MICELI, F; KIM, I et al.Journal of the Electrochemical Society. 1999, Vol 146, Num 12, pp 4619-4625, issn 0013-4651Article

A modeling tool for chemical-mechanical polishing design and evaluationRUNNELS, S. R; KIM, I; SCHLEUTER, J et al.IEEE transactions on semiconductor manufacturing. 1998, Vol 11, Num 3, pp 501-510, issn 0894-6507Article

Method for measuring feature-scale planarization in copper chemical mechanical polishing processingLAURSEN, T; RUNNELS, S. R; BASAK, S et al.Journal of the Electrochemical Society. 2003, Vol 150, Num 4, pp G279-G283, issn 0013-4651Article

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