Thermal optimization of a construction of a double-heterostructure GaAs/(AlGa)As diode laserKORZENIOWSKI, A; NAKWASKI, W.Journal of thermal analysis. 1990, Vol 36, Num 3, pp 1039-1047, issn 0368-4466Article

Calcul analytique exact de la resistance thermique de constriction due a des contacts elliptiques pour des valeurs de peclet variant de zero a l'infini = Analytical computation of the constriction thermal resistance due to elliptic contacts for Peclet values varying from zero to the infiniteLARAQI, Najib.Transferts thermiques lors du contact entre deux solides en mouvement relatif et leurs applications industrielles. Journée d'étude. 2000, 10 p.Conference Paper

Influence coefficient method for calculating discrete heat source temperature on finite convectively cooled substratesMUZYCHKA, Y. S.InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems. 2004, isbn 0-7803-8357-5, Vol1, 394-402Conference Paper

The longwave radiative heat transfer of the building envelopesNOWAK, H.Infrared physics. 1991, Vol 32, pp 357-363, issn 0020-0891Article

Determination of thermal contact resistances using the spectral functions of the boundary effectsTSAKANYAN, O. S.Inženerno-fizičeskij žurnal. 1990, Vol 58, Num 1, pp 135-140, issn 0021-0285, 6 p.Article

A new method to measure temperature- and power-dependent thermal resistance of HBTsMENOZZI, R; BARRETT, J; ERSLAND, P et al.ROCS workshop. 2004, pp 33-44, isbn 0-7908-0105-1, 1Vol, 12 p.Conference Paper

Evaluating thermal packaging concepts using thermal impedanceRIEMER, D. E.SPIE proceedings series. 1997, pp 437-442, isbn 0-930815-50-5Conference Paper

Tenue thermique : vers une gamme de BMC = Thermal behaviour: new BMC rangeWROTECKI, C; BAUCHET, F; OGINSKI, J.-C et al.Composites (Paris). 1992, Vol 32, Num 3, pp 411-416, issn 0754-0876Article

Glass fiberblanket SRM for thermal resistanceHUST, J. G.National Bureau of Standards Special Publication. 1985, issn 0083-1883, IX-16 p. [25 p.], 260-103Serial Issue

Increased Water Activity Reduces the Thermal Resistance of Salmonella enterica in Peanut ButterYINGSHU HE; YE LI; SALAZAR, Joelle K et al.Applied and environmental microbiology (Print). 2013, Vol 79, Num 15, pp 4763-4767, issn 0099-2240, 5 p.Article

Thermal interaction of an array of flip chip componentsJOINER, Bennett; DE OCA, Tony Montes.Annual IEEE semiconductor thermal measurement and management symposium. 2004, pp 286-291, isbn 0-7803-8363-X, 1Vol, 6 p.Conference Paper

Mica blindé = Shielded micaODILLE, Claude.1987, 17 p.Report

Normal zone propagation along superconducting films deposited on wide substratesSOKOLOVSKY, V; MEEROVICH, V.Cryogenics (Guildford). 2008, Vol 48, Num 9-10, pp 397-405, issn 0011-2275, 9 p.Article

Panneaux polyuréthanne pour toiture-terrasse = Polyurethane panels for flat roofsCahiers techniques du bâtiment. 1992, Num 140, issn 0241-6794, p. 69Article

Thermal resistance of Listeria spp. in milkBRADSHAW, J. G; PEELER, J. T; TWEDT, R. M et al.Journal of food protection. 1991, Vol 54, Num 1, pp 12-14, issn 0362-028X, 19 [4 p.]Article

Températures et résistance thermique de constriction dans les solides revêtus en contact glissant = Temperatures and thermal constriction resistance in coated solids in sliding contactLARAQI, N.Comptes rendus de l'Académie des sciences. Série II, Mécanique, physique, chimie, astronomie. 1997, Vol 324, Num 12, pp 739-746, issn 1251-8069Article

Influence of thermal contact resistance on thermal impedance of microelectronic structuresVERMEERSCH, B; DE MEY, G.Microelectronics and reliability. 2007, Vol 47, Num 8, pp 1233-1238, issn 0026-2714, 6 p.Article

Experimental study of thermal field deriving from an underground electrical power cable buried in non-homogeneous soilsVOLLARO, Roberto de Lieto; FONTANA, Lucia; VALLATI, Andrea et al.Applied thermal engineering. 2014, Vol 62, Num 2, pp 390-397, issn 1359-4311, 8 p.Article

Thermal spreading resistance characteristics of a high power light emitting diode moduleYANG, Kai-Shing; CHUNG, Chi-Hung; TU, Cheng-Wei et al.Applied thermal engineering. 2014, Vol 70, Num 1, pp 361-368, issn 1359-4311, 8 p.Article

Extraction of VBIC model parameters for InGaAsSb DHBTsCHANG, Yang-Hua; CHEN, Jian-Wen.Microelectronics and reliability. 2010, Vol 50, Num 3, pp 370-375, issn 0026-2714, 6 p.Article

Dependence of thermal resistance on ambient and actual temperaturePAASSCHENS, J. C. J; HARMSMA, S; VAN DER TOORN, R et al.Bipolar/BiCMOS Circuits and Technology Meetings. 2004, pp 96-99, isbn 0-7803-8618-3, 1Vol, 4 p.Conference Paper

Experimental investigation of thermal contact resistance in plain-fin-and-tube evaporators with collarless finsELSHERBINI, A. I; JACOBI, A. M; HRNJAK, P. S et al.International journal of refrigeration. 2003, Vol 26, Num 5, pp 527-536, issn 0140-7007, 10 p.Article

Determination of optimal filler volume fraction for thermal interface materials in electronics cooling applicationsSINGHAL, Vishal; GAHMELLA, Suresh V; SIEGMUND, Thomas et al.International heat transfer conference. 2002, pp 9-14, isbn 2-84299-308-X, 6 p.Conference Paper

Development of Thermal Barrier Coating with superior Thermal cyclic propertiesWAKABAYASHI, Tsukasa; SONOYA, Keiji; IMAMURA, Ryuzou et al.Ishikawajima-Harima Giho. 2001, Vol 41, Num 6, pp 299-302, issn 0578-7904Article

Equivalent thermal resistance of a corrugated contact boundaryWANG, C. Y.Journal of heat transfer. 2000, Vol 122, Num 2, pp 365-367, issn 0022-1481Article