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The influence of dislocations on the criterion of crack growth on the cohesion interface between deformable materialsGOLDSTEIN, R. V; SARYCHEV, M. E.Mechanics of solids. 2006, Vol 41, Num 1, pp 95-103, issn 0025-6544, 9 p.Article

Modeling electromigration and the void nucleation in thin-film interconnects of integrated circuitsGOLDSTEIN, R. V; SARYCHEV, M. E; SHIRABAIKIN, D. B et al.International journal of fracture. 2001, Vol 109, Num 1, pp 91-121, issn 0376-9429Article

A new, general model for mechanical stress evolution during electromigrationSARYCHEV, M. E; ZHITNIKOV, Yu. V; BORUCKI, L et al.Thin solid films. 2000, Vol 365, Num 2, pp 211-218, issn 0040-6090Article

Mécanisme de gravure des couches polymères dans un plasma de basse températureVALIEV, K. A; MAKHVILADZE, T. M; SARYCHEV, M. E et al.Žurnal tehničeskoj fiziki. 1986, Vol 56, Num 7, pp 1329-1335, issn 0044-4642Article

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