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Results 1 to 13 of 13

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MESURES D'ACTIVITE DANS LES ALLIAGES LIQUIDES PB-SB ET SN-SBITOH K; KOIKE K; NARITA Y et al.1980; J. MING METALLURG. INST. JAP.; JPN; DA. 1980; VOL. 96; NO 1104; PP. 97-102; ABS. ENG; BIBL. 11 REF.Article

UEBER DAS KORNGRENZENVERHALTEN UNTER ERMUEDUNGSBEDINGUNGEN IN PB-SN-SB-LEGIERUNGENYOSHIDA T; KASAHARA T; NISHIKAWA S et al.1982; J. JAP. INST. MET.; ISSN 0021-4876; JPN; DA. 1982-12; VOL. 46; NO 12; PP. 1181-1187; BIBL. 19 REF.Article

MARDNESS AND MICROSTRUCTURE OF PB-SB-SN TERNARY ALLOYS = DURETE ET MICROSTRUCTURE D'ALLIAGES TERNAIRES PB-SN-SBKAMAL M; ABD RABBO M.1980; PROC. MATH. PHYS. SOC. EGYPT; EGY; DA. 1980; NO 49; PP. 115-120; ABS. ARA; BIBL. 4 REF.Article

Gamma-ray investigations of intermetallic compounds in Sn Sb8 Cu0.5 melt-spun alloySHABAN, A. M.Radiation effects and defects in solids. 1995, Vol 133, Num 1, pp 51-61, issn 1042-0150Article

Effect of SnSb particle size on creep behaviour under power law regime of Sn-10%Sb alloyBESHAI, M. H. N; HABIB, S. K; YASSEIN, A. M et al.Crystal research and technology (1979). 1999, Vol 34, Num 1, pp 119-126, issn 0232-1300Article

THERMODYNAMICS OF TIN-BEARING BINARY SUBSTITUTIONAL SOLUTIONS = THERMODYNAMIQUE DES SOLUTIONS DE SUBSTITUTION BINAIRES CONTENANT DE L'ETAINAGRAWAL RD; MATHUR VNS; KAPOOR ML et al.1980; MET. FORUM; ISSN 0160-7952; USA; DA. 1980; VOL. 3; NO 2; PP. 121-128; BIBL. 14 REF.Article

Effect of the addition of different metal oxides in lead borosilicate glasses on the electrical characteristics of SbSn composition-based thick-film resistorsCUBELLIO, E. R; NATU, G. N; KAREKAR, R. N et al.Active and passive electronic components. 1993, Vol 16, Num 1, pp 7-18, issn 0882-7516Article

β'-SnSb single crystals obtained by the method of inclined front crystallizationBOGDANOWICZ, W; BOJARSKI, Z.Journal of crystal growth. 1995, Vol 147, Num 3-4, pp 369-381, issn 0022-0248Article

Electromigration studies of flip chip Sn95/Sb5 solder bumps on Cr/Cr-Cu/Cu under-bump metallizationSHAD, T. L; LIN, K. C; CHIH CHEN et al.Journal of electronic materials. 2003, Vol 32, Num 11, pp 1278-1283, issn 0361-5235, 6 p.Conference Paper

Old friends in a new light : SnSb revisitedNOREN, Lasse; WITHERS, Ray L; SCHMID, Siegbert et al.Journal of solid state chemistry (Print). 2006, Vol 179, Num 2, pp 404-412, issn 0022-4596, 9 p.Article

Impregnation of Sb and Sb-Sn alloy into graphite for the improvement of rubbing performanceSOGABE, T; INOUE, H.European journal of solid state and inorganic chemistry. 1995, Vol 32, Num 7-8, pp 787-798, issn 0992-4361Article

Multiaxial low cycle fatigue of five kinds of soldersYAMAMOTO, T; SAKANE, M; OHNAMI, M et al.Zairyo. 1997, Vol 46, Num 12, pp 1381-1388, issn 0514-5163Article

The effect of microstructural and geometrical features on the reliability of ultrafine flip chip microsolder jointsZHIHENG HUANG; CONWAY, Paul P; CHANGQING LIU et al.Journal of electronic materials. 2004, Vol 33, Num 10, pp 1227-1235, issn 0361-5235, 9 p.Article

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