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SPECIFYING SPECIAL I.C. PACKAGES.RIEL M; CHALMON R.1975; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1975; VOL. 15; NO 5; PP. 65-68 (3P.)Article

3-LAYER IC INTERCONNECTIONS IMPROVE CHIP HERMECITY.1975; DIGIT. DESIGN; U.S.A.; DA. 1975; VOL. 5; NO 6; PP. 18-21 (3P.)Article

BREVET 2.240.165 (A1) (7427038). A 2 AOUT 1974. SCELLEMENT HERMETIQUE D'UN RESERVOIR CREUSE DANS LA ROCHEsdPatent

ENVIRONMENTAL & HERMETIC PIGGY-BACK CONNECTORS.LAWRENCE RG.1976; IN: INT. ELECTRON. PACKAG. PROD. CONF. PROC. TECH. PROGRAMME; BRIGHTON, ENGL.; 1976; SURBITON; KIVER COMMUNICATIONS; DA. 1976; PP. 113-118Conference Paper

RCA A MIS AU POINT UN PROCEDE DE PROTECTION HERMETIQUE DES PUCES DE CI.LILEN H.1975; ELECTRON. MICROELECTRON. INDUSTR.; FR.; DA. 1975; NO 206; PP. 30-31Article

WINDOWLESS SEAL FOR PHOTOMULTIPLIER TUBES.DAVIS P; GINGLE AR; KNASEL TM et al.1974; REV. SCI. INSTRUM.; U.S.A.; DA. 1974; VOL. 45; NO 7; PP. 960Article

DIP SWITCH MAKERS FOCUS ON RAISING PERFORMANCE LEVELSKANAYOSHI T.1981; JEE, J. ELECTRON. ENG.; ISSN 0385-4507; JPN; DA. 1981; VOL. 18; NO 176; PP. 85-101; 3 P.Article

A NEW FAMILY OF MICROELECTRONIC PACKAGES FOR AVIONICS.SETTLE RE JR.1978; SOLID. STATE TECHNOL.; USA; DA. 1978; VOL. 21; NO 6; PP. 54-58; BIBL. 6 REF.Article

PRESSURE EFFECTS IN SEALED LIQUID-CRYSTAL CELLS.WILLIAMS R.1974; R.C.A. REV.; U.S.A.; DA. 1974; VOL. 35; NO 3; PP. 462-467; BIBL. 2 REF.Article

ADVANCED INDIVIDUAL CONTACT SEALING FOR CONNECTORS.MCNALLY H.1976; IN: INT. ELECTRON. PACKAG. PROD. CONF. PROC. PROGRAMME; BRIGHTON, ENGL.; 1976; SURBITON; KIVER COMMUNICATIONS; DA. 1976; PP. 84-95Conference Paper

PROJECTION WELD SEALING OF MICROCIRCUIT PACKAGES.DENISON JW JR.1973; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1973; VOL. 13; NO 7; PP. 67-82 (14P.); BIBL. 6 REF.Article

LOW COST HYBRID PACKAGINGSIMS JR; CRETER PG; SOUCY JW et al.1980; CIRCUITS MANUF.; USA; DA. 1980; VOL. 20; NO 3; PP. 84-93; (6 P.); BIBL. 7 REF.Article

CALCULATIONS FOR LEAK RATES OF HERMETIC PACKAGES.DAVY JG.1975; I.E.E.E. TRANS. PARTS HYBR. PACKAG.; U.S.A.; DA. 1975; VOL. 11; NO 3; PP. 177-189; BIBL. 19 REF.Article

SEMICONDUCTOR MEASUREMENT TECHNOLOGY: ARPA/NBS WORKSHOP II. HERMETICITY TESTING FOR INTEGRATED CIRCUITS.SCHAFFT HA.1974; NATION. BUR. STAND., SPEC. PUBL.; U.S.A.; DA. 1974; NO 400-9; PP. 1-36; BIBL. 1 P.Article

METALLIZED HERMETIC PLASTIC PACKAGESMARTINO RR.1973; ELECTRON. COMPON.; G.B.; DA. 1973; VOL. 14; NO 11; PP. 516Serial Issue

NEW HEAT SINKING TECHNIQUES FOR HERMETIC DIPS. = NOUVELLES TECHNIQUES DE PLAQUES DE REFROIDISSEMENT POUR LES DISPOSITIFS DIP HERMETIQUESEMERALD PE.1973; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1973; VOL. 13; NO 11; PP. 70-78 (6P.)Article

METHOD FOR THE CALIBRATION AND ANALYSIS OF MOISTURE IN HERMETICALLY SEALED SEMICONDUCTOR PACKAGES BY GAS MASS SPECTROMETRYGRILLETTO C; VOWINKEL F.1980; SOLID STATE TECHNOL.; USA; DA. 1980; VOL. 23; NO 6; PP. 71-73Article

PROBLEME DER HERMETISIERUNG VON SCHALTKREISEN DER MIKROELEKTRONIK = LES PROBLEMES D'HERMETISATION DU CIRCUIT EN MICROELECTRONIQUEDUBOWITZKAJA IM.1979; NACHR.-TECH. ELEKTRON.; DDR; DA. 1979; VOL. 29; NO 4; PP. 154-156Article

IMPROVED VACUUM SEALS FOR MAGNESIUM FLUORIDE WINDOWSFREEMAN GHC; MOORE PJ.1978; J. PHYS. E; GBR; DA. 1978; VOL. 11; NO 10; PP. 980-981; BIBL. 1 REF.Article

USING CHIP CARRIERS FOR HIGH DENSITY PACKAGING.BAUER JA.1977; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1977; VOL. 17; NO 10; PP. 85-91 (4P.)Article

DICHTIGKEITSPRUEFUNG VON BAUELEMENTEN-DARGESTELLT AM BEISPIEL HERMETISCH ABGESCHLOSSENER RELAIS. = ESSAIS D'ETANCHEITE DES COMPOSANTS REPRESENTES PAR UN EXEMPLE DE RELAIS SCELLE HERMETIQUEMENTKRAMNY W.1976; MESSEN U. PRUEFEN; DTSCH.; DA. 1976; NO 11; PP. 652-656 (3P.); BIBL. 5 REF.Article

HELIUM LEAK MEASUREMENTS AS A PREDICTOR OF HERMETIC PACKAGE LIFE IN SURGICALLY-IMPLANTED MICROELECTRONIC DEVICESDONALDSON PEK.1979; EUROPEAN HYBRID MICROELECTRONICS CONFERENCE. 2/1978/GHENT; NLD; PIJNACKER: DUTCH EFFICIENCY BUREAU; DA. 1979; PP. 479-484Conference Paper

GLASS FIBER HERMETIC SEALS USING A CO2 LASER.KYLE TR.1975; APPL. OPT.; U.S.A.; DA. 1975; VOL. 14; NO 6; PP. 1342-1344; BIBL. 10 REF.Article

QUESTIONS DE TECHNOLOGIE ET DE CONTROLE DES CELLULES A CRISTAUX LIQUIDESKARASEVA IA; LEBEDEV VI; SOKOLOVA TP et al.1975; OPT.-MEKH. PROMYSHL.; S.S.S.R.; DA. 1975; VOL. 42; NO 10; PP. 47-52; BIBL. 27 REF.Article

PLANAR DOUBLE-HETEROSTRUCTURE GAALAS LED'S PACKAGED FOR FIBER OPTICSSPEER RS; HAWKINS BM.1980; I.E.E.E. TRANS. COMPON. HYBR. MANUFG TECHNOL.; USA; DA. 1980; VOL. 3; NO 4; PP. 480-484; BIBL. 10 REF.Article

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