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Ketenyl radical yield of the elementary reaction of ethyne with atomic oxygen at T=209-540 KPEETERS, J; SCHAEKERS, M; VINCKIER, C et al.Journal of physical chemistry (1952). 1986, Vol 90, Num 24, pp 6552-6557, issn 0022-3654Article

Implementation of a Si-rich SiON nucleation layer for an improved selective SiGe HBT architectureVAN HUYLENBROECK, S; LOO, R; DECOUTERE, S et al.Bipolar / BiCMOS circuits and technology meeting. 2002, pp 143-146, isbn 0-7803-7561-0, 4 p.Conference Paper

Analysis of trace metals in silicon nitride films by a vapor phase decomposition- solution collection approachVEREECKE, G; SCHAEKERS, M; VERSTRAETE, K et al.SPIE proceedings series. 1999, pp 139-146, isbn 0-8194-3497-3Conference Paper

High-k dielectrics for future generation memory devices (Invited Paper)KITTL, J. A; OPSOMER, K; GOVOREANU, B et al.Microelectronic engineering. 2009, Vol 86, Num 7-9, pp 1789-1795, issn 0167-9317, 7 p.Conference Paper

Gate dielectrics for high performance and low power CMOS SoC applicationsCUBAYNES, F. N; DACHS, C. J. J; ROTHSCHILD, A et al.ESSCIRC 2002 : European solid-state circuits conferenceEuropean solid-state device research conference. 2002, pp 427-430, isbn 88-900847-8-2, 4 p.Conference Paper

Cost-effective cleaning and high-quality thin gate oxidesHEYNS, M. M; BEARDA, T; MERTENS, S et al.IBM journal of research and development. 1999, Vol 43, Num 3, pp 339-350, issn 0018-8646Article

Optimization of low temperature silicon nitride processes for improvement of device performanceSLEECKX, E; SCHAEKERS, M; SHI, X et al.Microelectronics and reliability. 2005, Vol 45, Num 5-6, pp 865-868, issn 0026-2714, 4 p.Conference Paper

Further optimization of plasma nitridation of ultra-thin oxides for 65nm node MOSFETsKRAUS, P. A; CHUA, T. C; NOURI, F et al.Proceedings - Electrochemical Society. 2004, pp 236-243, issn 0161-6374, isbn 1-56677-406-3, 8 p.Conference Paper

Effect of chemicals on metal contamination on silicon wafersANTTILA, O. J; TILLI, M. V; SCHAEKERS, M et al.Journal of the Electrochemical Society. 1992, Vol 139, Num 4, pp 1180-1185, issn 0013-4651Article

Monitoring plasma nitridation of HfSiOx by corona charge measurementsEVERAERT, J.-L; SHI, X; ROTHSCHILD, A et al.Microelectronic engineering. 2007, Vol 84, Num 9-10, pp 2251-2254, issn 0167-9317, 4 p.Conference Paper

Impact of material/process interactions on the properties of a porous CVD-O3 low-k dielectric filmTRAVALY, Y; EYCKENS, B; SCHAEKERS, M et al.Microelectronic engineering. 2002, Vol 64, Num 1-4, pp 367-374, issn 0167-9317Conference Paper

RPN oxynitride gate dielectrics for 90 nm Low Power CMOS applicationsVELOSO, A; JURCZAK, M; BADENES, G et al.ESSCIRC 2002 : European solid-state circuits conferenceEuropean solid-state device research conference. 2002, pp 159-162, isbn 88-900847-8-2, 4 p.Conference Paper

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