Nanoscale devices for solid state refrigeration and power generationSHAKOURI, Ali.Annual IEEE semiconductor thermal measurement and management symposium. 2004, pp 1-9, isbn 0-7803-8363-X, 1Vol, 9 p.Conference Paper

Cost-Efficiency Trade-off and the Design of Thermoelectric Power GeneratorsYAZAWA, Kazuaki; SHAKOURI, Ali.Environmental science & technology. 2011, Vol 45, Num 17, pp 7548-7553, issn 0013-936X, 6 p.Article

Camera for thermal imaging of semiconductor devices based on thermoreflectanceCHRISTOFFERSON, James; SHAKOURI, Ali.Annual IEEE semiconductor thermal measurement and management symposium. 2004, pp 87-97, isbn 0-7803-8363-X, 1Vol, 11 p.Conference Paper

Nanoscale thermal transport and microrefrigerators on a chipSHAKOURI, Ali.Proceedings of the IEEE. 2006, Vol 94, Num 8, pp 1613-1638, issn 0018-9219, 26 p.Article

Low-Temperature Thermoelectric Power Factor Enhancement by Controlling Nanoparticle Size DistributionZEBARJADI, Mona; ESFARJANI, Keivan; ZHIXI BIAN et al.Nano letters (Print). 2011, Vol 11, Num 1, pp 225-230, issn 1530-6984, 6 p.Article

Report on UC Berkeley nanoengineering workshop, August 4 & 5, 2000MAJUMDAR, Arunava; HICKMAN, Jay; LIKHAREV, Konstantin et al.Microscale thermophysical engineering (Print). 2001, Vol 5, Num 2, pp 131-154, issn 1089-3954Article

InP-based passive ring-resonator-coupled lasersZHIXI BIAN; BIN LIU; SHAKOURI, Ali et al.IEEE journal of quantum electronics. 2003, Vol 39, Num 7, pp 859-865, issn 0018-9197, 7 p.Article

On chip solid state cooling for integrated circuitsSHAKOURI, Ali; YAN ZHANG.International workshop on thermal investigations of ICs and systems. 2003, pp 1-5, isbn 2-84813-020-2, 1Vol, 5 p.Conference Paper

Optimization of thermoelectric topping combined steam turbine cycles for energy economyYAZAWA, Kazuaki; YEE RUI KOH; SHAKOURI, Ali et al.Applied energy. 2013, Vol 109, pp 1-9, issn 0306-2619, 9 p.Article

Bias-dependent MOS transistor thermal resistance and non-uniform self-heating temperatureXI WANG; EZZAHRI, Younes; CHRISTOFFERSON, James et al.Journal of physics. D, Applied physics (Print). 2009, Vol 42, Num 7, issn 0022-3727, 075101.1-075101.5Article

Thermal measurements of active semiconductor micro-structures acquired through the substrate using near IR thermoreflectanceCHRISTOFFERSON, James; SHAKOURI, Ali.International workshop on thermal investigations of ICs and systems. 2003, pp 269-274, isbn 2-84813-020-2, 1Vol, 6 p.Conference Paper

On-chip thermal engineeringSHAKOURI, Ali; KANG, Sung-Mo; BAR-COHEN, Avram et al.Proceedings of the IEEE. 2006, Vol 94, Num 8, issn 0018-9219, 168 p.Serial Issue

Electron vortices in semiconductors devicesMOHSENI, Kamran; SHAKOURI, Ali; RAM, Rajeev J et al.Physics of fluids (1994). 2005, Vol 17, Num 10, pp 100602.1-100602.7, issn 1070-6631Conference Paper

Thermal battery with CO₂ compression heat pump: Techno-economic optimization of a high-efficiency Smart Grid option for buildingsBLARE, Morten B; YAZAWA, Kazuaki; SHAKOURI, Ali et al.Energy and buildings. 2012, Vol 50, pp 128-138, issn 0378-7788, 11 p.Article

Thermal modeling, analysis, and management in VLSI circuits : Principles and methodsPEDRAM, Massoud; NAZARIAN, Shahin.Proceedings of the IEEE. 2006, Vol 94, Num 8, pp 1487-1501, issn 0018-9219, 15 p.Article

Thermal interface materials : Historical perspective, status, and future directionsPRASHER, Ravi.Proceedings of the IEEE. 2006, Vol 94, Num 8, pp 1571-1586, issn 0018-9219, 16 p.Article

Scalable Cost/Performance Analysis for Thermoelectric Waste Heat Recovery SystemsYAZAWA, Kazuaki; SHAKOURI, Ali.Journal of electronic materials. 2012, Vol 41, Num 6, pp 1845-1850, issn 0361-5235, 6 p.Conference Paper

A novel vertical directional coupler switch with switching-operation-induced section and extinction-ratio-enhanced sectionCHO, Sung-Chan; JUNG, Byung-Min; KIM, Boo-Gyoun et al.Journal of lightwave technology. 2002, Vol 20, Num 9, pp 1773-1778, issn 0733-8724, 6 p.Article

On-chip thermal management with microchannel heat sinks and integrated micropumpsGARIMELLA, Suresh V; SINGHAL, Vishal; DONG LIU et al.Proceedings of the IEEE. 2006, Vol 94, Num 8, pp 1534-1548, issn 0018-9219, 15 p.Article

Overview of solid-state thermoelectric refrigerators and possible applications to on-chip thermal managementSHARP, Jeff; BIERSCHENK, Jim; LYON, Hylan B et al.Proceedings of the IEEE. 2006, Vol 94, Num 8, pp 1602-1612, issn 0018-9219, 11 p.Article

Superlattice microrefrigerators flip-chip bonded with optoelectronic devicesYAN ZHANG; GEHONG ZENG; PIPREK, Joachim et al.Annual IEEE semiconductor thermal measurement and management symposium. 2004, pp 190-197, isbn 0-7803-8363-X, 1Vol, 8 p.Conference Paper

Controlling n-Type Carrier Density from Er Doping of InGaAs with MBE Growth TemperatureBURKE, Peter G; BUEHL, Trevor E; GILLES, Pernot et al.Journal of electronic materials. 2012, Vol 41, Num 5, pp 948-953, issn 0361-5235, 6 p.Conference Paper

Thermoelectric Transport in InGaAs with High Concentration of Rare-Earth TbAs Embedded NanoparticlesSELEZNEVA, Ekaterina; CLINGER, Laura E; SHAKOURI, Ali et al.Journal of electronic materials. 2012, Vol 41, Num 6, pp 1820-1825, issn 0361-5235, 6 p.Conference Paper

Dynamic surface temperature measurements in ICsALTET, Josep; CLAEYS, Wilfrid; DILHAIRE, Stefan et al.Proceedings of the IEEE. 2006, Vol 94, Num 8, pp 1519-1533, issn 0018-9219, 15 p.Article

Thermal measurements of active semiconductor micro-structures acquired through the substrate using near IR thermoreflectanceCHRISTOFFERSON, James; SHAKOURI, Ali.Microelectronics journal. 2004, Vol 35, Num 10, pp 791-796, issn 0959-8324, 6 p.Conference Paper