Environmental leadership in electronics manufacturing : Lead-free and beyondSHANGGUAN, Dongkai.Electronics recycling summitIEEE international symposium on electronics and the environment (ISEE). 2004, pp 33-39, isbn 0-7803-8250-1, 1Vol, 7 p.Conference Paper

Performance of QFP lead-free solder joints under dynamic mechanical loadingARRA, Minna; DONGJI XIE; SHANGGUAN, Dongkai et al.The International journal of microcircuits and electronic packaging. 2001, Vol 24, Num 4, pp 346-365, issn 1063-1674Article

Polymer-metal nano-composite films for thermal managementCARLBERG, Björn; TENG WANG; FOHAN LIU et al.Microelectronics international. 2009, Vol 26, Num 2, pp 28-36, issn 1356-5362, 9 p.Article

0Characterization of mechanical performance of Sn/Ag/Cu solder joints with different component lead coatingsARRA, Minna; CASTELLO, Todd; SHANGGUAN, Dongkai et al.Soldering & surface mount technology. 2004, Vol 16, Num 1, pp 35-43, issn 0954-0911, 9 p.Article

Solder Joint Characteristics and Reliability of Lead-Free Area Array Packages Assembled at Various Tin-Lead Soldering Process ConditionsNGUYEN, Jennifer; GEIGER, David; ROONEY, Daniel et al.IEEE transactions on electronics packaging manufacturing. 2008, Vol 31, Num 3, pp 227-239, issn 1521-334X, 13 p.Article

Failure analysis techniques for lead-free solder jointsCASTELLO, Todd; ROONEY, Dan; SHANGGUAN, Dongkai et al.Soldering & surface mount technology. 2006, Vol 18, Num 4, pp 21-27, issn 0954-0911, 7 p.Article

Effect of reflow profile on wetting and intermetallic formation between Sn/Ag/Cu solder components and printed circuit boardsARRA, Minna; SHANGGUAN, Dongkai; RISTOLAINEN, Eero et al.Soldering & surface mount technology. 2002, Vol 14, Num 2, issn 0954-0911, 5, 7, 9, 18-25 [11 p.]Article

Study of interfacial reactions in Sn-3.5Ag-3.0Bi and Sn-8.0Zn-3.0Bi sandwich structure solder joint with Ni(P)/Cu metallization on Cu substratePENG SUN; ANDERSSON, Cristina; XICHENG WEI et al.Journal of alloys and compounds. 2007, Vol 437, Num 1-2, pp 169-179, issn 0925-8388, 11 p.Article

High temperature aging study of intermetallic compound formation of Sn-3.5Ag and Sn-4.0Ag-0.5Cu solders on electroless Ni(P) metallizationPENG SUN; ANDERSSON, Cristina; XICHENG WEI et al.Journal of alloys and compounds. 2006, Vol 425, Num 1-2, pp 191-199, issn 0925-8388, 9 p.Article

Study of immersion silver and tin printed-circuit-board surface finishes in lead-free solder applicationsARRA, Minna; SHANGGUAN, Dongkai; DONGJI XIE et al.Journal of electronic materials. 2004, Vol 33, Num 9, pp 977-990, issn 0361-5235, 14 p.Article

Lead-free solder flip chips on FR-4 substrates with different surface finishes, underfills and fluxesSJOBERG, Jonas; GEIGER, David A; SHANGGUAN, Dongkai et al.IEEE/CPMT/SEMI international electronics manufacturing technology. Symposium. 2004, pp 31-36, isbn 0-7803-8582-9, 1Vol, 6 p.Conference Paper

Evaluation of reliability and metallurgical integrity of wire bonds and lead free solder joints on flexible printed circuit board sample modulesROONEY, Daniel T; GULLO, Louis; DONGJI XIE et al.Microelectronics and reliability. 2007, Vol 47, Num 12, pp 2152-2160, issn 0026-2714, 9 p.Article

Failure Analysis of Lead-Free Solder Joints of an 1657CCGA (Ceramic Column Grid Array) PackageLAU, John; CASTELLO, Todd; SHANGGUAN, Dongkai et al.Journal of microelectronics and electronic packaging. 2007, Vol 4, Num 3, pp 112-120, issn 1551-4897, 9 p.Article

Solder balling of lead-free solder pastesARRA, Minna; SHANGGUAN, Dongkai; RISTOLAINEN, Eero et al.Journal of electronic materials. 2002, Vol 31, Num 11, pp 1130-1138, issn 0361-5235, 9 p.Conference Paper

Design for lead-free solder joint reliability of high-density packagesLAU, John; DAUKSHER, Walter; SMETANA, Joe et al.Soldering & surface mount technology. 2004, Vol 16, Num 1, pp 12-26, issn 0954-0911, 15 p.Article

Design, materials and process for lead-free assembly of high-density packagesSMETANA, Joe; HORSLEY, Rob; LAU, John et al.Soldering & surface mount technology. 2004, Vol 16, Num 1, pp 53-62, issn 0954-0911, 10 p.Article

Reliability testing and data analysis of lead-free solder joints for high-density packagesLAU, John; HOO, Nick; HORSLEY, Rob et al.Soldering & surface mount technology. 2004, Vol 16, Num 2, issn 0954-0911, 3, 5-6, 7-8, 46-68 [28 p.]Article

Process characterization of PCB assembly using 0201 packages with lead-free solderGEIGER, David; MATTSSON, Fredrik; SHANGGUAN, Dongkai et al.Soldering & surface mount technology. 2003, Vol 15, Num 2, issn 0954-0911, 4, 22-27 [7 p.]Article

A study of thermo-mechanical reliability of lead-free PTH solder jointsNGUYEN, Jennifer; GEIGER, David; ROONEY, Dan et al.Soldering & surface mount technology. 2009, Vol 21, Num 2, pp 39-47, issn 0954-0911, 9 p.Conference Paper

Coffin-manson constant determination for a Sn-8Zn-3Bi lead-free solder jointPENG SUN; ANDERSSON, Cristina; XICHENG WEI et al.Soldering & surface mount technology. 2006, Vol 18, Num 2, pp 4-11, issn 0954-0911, 8 p.Conference Paper

Failure analysis of lead-free solder joints for high-density packagesLAU, John; SHANGGUAN, Dongkai; CASTELLO, Todd et al.Soldering & surface mount technology. 2004, Vol 16, Num 2, pp 3-4, issn 0954-0911, 2 p., 6, 8, 69-76 [12 p.]Article

Thermal-fatigue life prediction equation for wafer-level chip scale package (WLCSP) lead-free solder joints on lead-free printed circuit board (PCB)LAU, John H; SHANGGUAN, Dongkai; LAU, Dennis C. Y et al.Proceedings - Electronic Components Conference. 2004, issn 0569-5503, isbn 0-7803-8365-6, 2Vol, Vol 2, 1563-1569Conference Paper

Drop impact reliability of edge-bonded lead-free chip scale packagesFARRIS, Andrew; JIANBIAO PAN; GEIGER, David A et al.Microelectronics and reliability. 2009, Vol 49, Num 7, pp 761-770, issn 0026-2714, 10 p.Article

Reliability testing and data analysis of an 1657CCGA (Ceramic Column Grid Array) package with lead-free solder paste on lead-free PCBs (Printed Circuit Boards)LAU, John; DAUKSHER, Walter; OTT, Ed et al.Proceedings - Electronic Components Conference. 2004, issn 0569-5503, isbn 0-7803-8365-6, 2Vol, Vol 1, 718-725Conference Paper