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SCANNING THE SOLDERABILITY OF A SURFACE = DETERMINATION DE L'APTITUDE AU BRASAGE TENDRE D'UNE SURFACEBECKER G.1981; WELD. J.; ISSN 0043-2296; USA; DA. 1981; VOL. 60; NO 10; PP. 202S-206S; BIBL. 10 REF.; LOC. ISArticle

IMPROVING THE ROTARY-DIP SOLDERABILITY TEST = AMELIORATION DE L'ESSAI D'APTITUDE AU BRASAGE TENDRE (ESSAI T)KLEIN WASSINK RJ.1981; WELD. MET. FABR.; ISSN 0043-2245; GBR; DA. 1981; VOL. 49; NO 4; PP. 214-216; BIBL. 3 REF.; LOC. ISArticle

CRITERES D'EVALUATION DE LA BRASABILITE = EVALUATION OF SOLDERABILITY1981; ETAIN US.; ISSN 0014-1631; GBR; DA. 1981; NO 130; PP. 6-9; BIBL. 13 REF.; LOC. ISArticle

MECHANISIERUNG VON WEICHLOETARBEITSGAENGEN FUER EINZELLOETSTELLEN = MECHANIZATION OF SOFT-SOLDERING OPERATIONS FOR INDIVIDUAL JOINTS = AUTOMATISATION DES OPERATIONS DE BRASAGE TENDRE EXECUTEES SEPAREMENTMAYER R.1981; WEICHLOETEN UND SCHWEISSEN IN ELEKTRONIK UND FEINWERKTECHNIK. INTERNATIONALES KOLLOQUIUM/1981/MUENCHEN; DEU; DUESSELDORF: DVS; DA. 1981; PP. 39-44; ABS. ENG; LOC. ISConference Paper

METHODES D'ESSAIS - ESSAIS GENERAUX CLIMATIQUES ET MECANIQUES. GUIDE POUR LES ESSAIS T: BRASABILITE = TESTING METHODS - BASIC ENVIRONMENTAL AND MECHANICAL TESTING PROCEDURES. GUIDE FOR T TESTS: SODERABILITY1979; ; FRA; PARIS: UTE; DA. 1979; UTE-C20.430; 9 P.; LOC. ISReport

THE ROTARY-DIP METHOD. COMMENTS ON THE METHOD AND APPLICATION FOR PLATED HOLES = ESSAI DE ROTATION ET D'IMMERSION (ESSAI T). COMMENTAIRES SUR LA METHODE ET APPLICATION DANS LE CAS DE CIRCUITS IMPRIMES A TROUS METALLISESKLEIN WASSINK RJ.1979; INTERNATIONAL BRAZING SOLDERING CONFERENCE. 3/1979/LONDON; GBR; LONDON: METALS SOCIETY; DA. 1979; 9 P.; BIBL. 5 REF.; LOC. ISConference Paper

STUDIES ON SOLDERABILITY TESTING = ETUDES SUR LES ESSAIS D'APTITUDE AU BRASAGE TENDRETHWAITES CJ; SHIDA K.1980; WELDING RESEARCH IN THE 1980'S. INTERNATIONAL CONFERENCE. SESSION B/1980/OSAKA; JPN; OSAKA: JWRI; DA. 1980; PP. 101-106; BIBL. 5 REF.; LOC. ISConference Paper

Characterisation of lead free solderability of immersion Sn finish on PWBs using wetting balance technique : Characterisation for process optimisation in surface engineeringHONG, S. J; PARK, B-H; SEO, D. S et al.Surface engineering. 2008, Vol 24, Num 5, pp 337-340, issn 0267-0844, 4 p.Article

LIQUID-VAPOR INTERFACIAL TENSION: A PRIME FACTOR IN SOLDERABILITY MEASUREMENTS = LA TENSION INTERFACIALE LIQUIDE-VAPEUR, FACTEUR ESSENTIEL POUR LA MESURE DE L'APTITUDE AU BRASAGE TENDREBARRANGER J.1979; INTERNATIONAL BRAZING SOLDERING CONFERENCE. 3/1979/LONDON; GBR; LONDON: METALS SOCIETY; DA. 1979; 9 P.; LOC. ISConference Paper

Some component lead solderability issues = Quelques problèmes relatifs à l'aptitude au brasage tendre de queues de composantsWILD, R. N.1985, Num 9, pp 5-10, issn 0263-0060Article

European solderability control = Contrôle de l'aptitude au brasage tendre à l'échelle européenneBECKER, G.1983, Num 5, pp 40-44, issn 0263-0060Article

Some metallurgical aspects of SMD technology = Aspects métallurgiques de la technologie des composants montés en surfaceTHWAITES, C. J.1986, Num 10, pp 38-42, issn 0263-0060Article

SOLDERABILITY - ITS MEANING, TESTING AND APPLICATION IN THE ELECTRONICS INDUSTRY = LE CONCEPT DE BRASABILITE, LES ESSAIS ET LEUR APPLICATION EN ELECTRONIQUETHWAITES CJ.1981; WEICHLOETEN UND SCHWEISSEN IN ELEKTRONIK UND FEINWERKTECHNIK. INTERNATIONALES KOLLOQUIUM/1981/MUENCHEN; DEU; DUESSELDORF: DVS; DA. 1981; PP. 120-124; BIBL. 12 REF.; LOC. ISConference Paper

QUALITAET UNBESTUECKTER LEITERPLATTEN - VORAUSSETZUNG FUER EIN GUTES LOETERGEBNIS = QUALITY OF UNMOUNTED PRINTED CIRCUIT BOARDS AS A BASIS OF GOOD SOLDERING RESULTS = QUALITE DES CARTES DE CIRCUITS IMPRIMES: CARACTERISTIQUES REQUISES EN VUE DU BRASAGEGAMALSKI J.1981; WEICHLOETEN UND SCHWEISSEN IN ELEKTRONIK UND FEINWERKTECHNIK. INTERNATIONALES KOLLOQUIUM/1981/MUENCHEN; DEU; DUESSELDORF: DVS; DA. 1981; PP. 124-127; ABS. ENG; BIBL. 14 REF.; LOC. ISConference Paper

EFFECT OF SURFACE CONTAMINATION OF COPPER, ARISING FROM WATER RINSING ON SOLDERABILITY = INFLUENCE SUR L'APTITUDE AU BRASAGE TENDRE DE LA CONTAMINATION EN SURFACE DU CUIVRE PROVENANT DE L'EAU DE RINCAGEMCCARTHY T; MACKAY CA.1979; INTERNATIONAL BRAZING SOLDERING CONFERENCE. 3/1979/LONDON; GBR; LONDON: METALS SOCIETY; DA. 1979; 9 P.; BIBL. 3 REF.; LOC. ISConference Paper

NF C 20-630: METHODES D'ESSAIS APPLICABLES AUX COMPOSANTS - ESSAIS GENERAUX CLIMATIQUES ET MECANIQUES - BRASABILITE = TESTING METHODS FOR COMPONENTS - BASIC ENVIRONMENTAL TESTING PROCEDURES - SOLDERABILITY1979; ; FRA; PARIS: AFNOR; DA. 1979; NF-C20.630; 27 P.; LOC. ISReport

Solderability of capacitor lead wires = Aptitude au brasage tendre de conducteurs de condensateursGEIGER, A. L.1986, Num 11, pp 56-61, issn 0263-0060Article

Computer-aided quantitative determination of the solderability = Evaluation quantitative à l'aide d'un ordinateur de l'aptitude au brasage tendreSCHMITT-THOMAS, K. G; ZAHEL, H. M; KNOTT, U. C et al.Quality and reliability in welding. International conference. 1984, pp A.10.1-A.10.5Conference Paper

Eignung von unbedrahteten Bauelementen für die Oberflächenmontage auf Leiterplatten = Aptitude de composants électroniques sans fils au montage en surface sur les substrats = Study of the solderability of surface mounted devicesRÖDIG, H.Weichlöten in Forschung und Praxis 1986. Hochschulkolloquium. 1986, pp 114-126Conference Paper

A flux for soldering with zinc soldersSHCHERBEDINSKAYA, A.V; KLEVTSOVA, E.V; FEDOROV, V.N et al.Welding Production. 1985, Vol 32, Num 5, pp 28-29, issn 0043-230XArticle

Effects of PCB Substrate Surface Finish and Flux on Solderability of Lead-Free SAC305 AlloySIEWIOREK, A; KUDYBA, A; SOBCZAK, N et al.Journal of materials engineering and performance. 2013, Vol 22, Num 8, pp 2247-2252, issn 1059-9495, 6 p.Article

Le fer et la soudure dans une seule main = A compact soldering ironCOLOMBIER, A.Industries et techniques (1960). 1984, Num 529, issn 0150-6617, 71Article

Coupling effect in Pt/Sn/Cu sandwich solder joint structuresWANG, S. J; LIU, C. Y.Acta materialia. 2007, Vol 55, Num 10, pp 3327-3335, issn 1359-6454, 9 p.Article

Prevention of electromigration-induced Cu pad dissolution by using a high electromigration-resistance ternary Cu-Ni-Sn layerHSIAO, Y. H; CHUANG, Y. C; LIU, C. Y et al.Scripta materialia. 2006, Vol 54, Num 4, pp 661-664, issn 1359-6462, 4 p.Article

INTERMETALLIC COMPOUND GROWTH AND SOLDERABILITY = CROISSANCE D'UN COMPOSE INTERMETALLIQUE ET APTITUDE AU BRASAGE TENDREDAVIS PE; WARWICK ME; KAY PJ et al.1982; PLATING AND SURFACE FINISHING; ISSN 0360-3164; USA; DA. 1982; VOL. 69; NO 9; PP. 72-76; BIBL. 17 REF.Article

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