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HOW TO WAVE SOLDER DISCRETE CHIP COMPONENTSWOODGATE R.1983; ELECTRI.ONICS; ISSN 512907; USA; DA. 1983; VOL. 29; NO 6; PP. 21-22Article

SOLDER MASKING SOLDER-PLATED CIRCUITS.WHEELER J.1977; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1977; VOL. 17; NO 6; PP. 107-110Article

HIGH QUALITY MASS SOLDERING FOR HIGH DENSITY PCB'SGENGLER RH.1981; INSUL., CIRCUITS; ISSN 0020-4544; USA; DA. 1981; VOL. 27; NO 11; PP. 50-54Article

IMPROVING QUALITY AND INCREASING QUANTITY OF WAVESOLDERED PRINTED WIRING ASSEMBLIES THROUGH PROPER MAINTENANCEO'ROURKE HT.1980; INSULAT. CIRCUITS; USA; DA. 1980; VOL. 26; NO 4; PP. 21-23Article

UNDERSTANDING THE SOLDER WAVE AND ITS EFFECTS ON SOLDER JOINTS.MANKO HH.1978; INSULAT. CIRCUITS; U.S.A.; DA. 1978; VOL. 24; NO 1; PP. 45-49; BIBL. 13 REF.Article

HORIZONTAL VS. INCLINED CONVEYOR WAVESOLDERING WHICH APPROACH REDUCES SOLDER BRIDGES MORE EFFECTIVELY.BERNARD CD.1977; CIRCUITS MANUF.; U.S.A.; DA. 1977; VOL. 17; NO 9; PP. 53-55Article

WAVE SOLDERING JOINT QUALITY TROUBLE SHOOTING GUIDE.CASS B.1977; INSULAT. CIRCUITS; U.S.A.; DA. 1977; VOL. 23; NO 13; PP. 23-25; BIBL. 5 REF.Article

SOLDERING WITH ACTIVE ORGANIC-ACID FLUX.SMITH RL; HEWETT RD.1975; ELECTRON PACKAG. PRODUCT.; U.S.A.; DA. 1975; VOL. 15; NO 11; PP. 57-61 (4P.)Article

TROUBLESHOOTING THE WAVESOLDERING SYSTEM: PROBLEMS WITH WAVESOLDERING EQUIPMENT RESULT FROM IMPROPER OPERATIONTURNER RL.1978; CIRCUITS MANUF.; USA; DA. 1978; VOL. 18; NO 11; PP. 24-28; (3 P.)Article

FLUX AND SOLDER CONTROLS FOR HIGH SPEED PRINTED CIRCUIT BOARD SOLDERING.BERNIER D.1975; INSULAT. CIRCUITS; U.S.A.; DA. 1975; VOL. 21; NO 8; PP. 16-17Article

COMMON CAUSES OF WAVESOLDERING DEFECTSBERNARD CD.1979; ELECTRON. PACKAG. PRODUCT.; USA; DA. 1979; VOL. 19; NO 4; PP. 175-180; (4 P.)Article

FACTORS AFFECTING THE COST OF SOLDERINGLANGAN JP.1979; ELECTRON. PACKAG. PRODUCT.; USA; DA. 1979; VOL. 19; NO 1; PP. 207-214; (5 P.); BIBL. 7 REF.Article

GUIDE TO WAVE SOLDERING EQUIPMENT.1977; INSULAT. CIRCUITS; U.S.A.; DA. 1977; VOL. 23; NO 2; PP. 38-46Article

SOLDERING OF LEADLESS COMPONENTSRAHN A; WOODGATE RW.1983; ELECTRI.ONICS; ISSN 512907; USA; DA. 1983; VOL. 29; NO 1; PP. 13-14; BIBL. 6 REF.Article

IMMERSION WAVE SOLDERING PROCESSGETTEN JR; SENGER RC.1982; IBM J. RES. DEVELOP.; ISSN 0018-8646; USA; DA. 1982; VOL. 26; NO 3; PP. 379-382; BIBL. 8 REF.Article

SYSTEMIZING IDENTIFICATION OF EQUIPMENT REQUIREMENTS SELECTION FOR SOLDER/DEFLUX SYSTEMKOLMAN FL.1983; ELECTRI.ONICS; ISSN 512907; USA; DA. 1983; VOL. 29; NO 7; PP. 49-52Article

THE APPLICABILITY OF APPROXIMATE AND EXACT TRANSIENT HEAT TRANSFER ANALYSES TO HEATING PROCESSES USED TO SOLDER MULTILAYER CIRCUIT BOARDS.MOLLENDORF JC.1975; I.E.E.E. TRANS. PARTS HYBRID. PACKAG.; U.S.A.; DA. 1975; VOL. 11; NO 2; PP. 96-104; BIBL. 7 REF.Article

ONE MANUFACTURER'S SELECTION OF WAVE SOLDERING AND CLEANING EQUIPMENTBARRETT G.1982; INSULATION. CIRCUITS; ISSN 0020-4544; USA; DA. 1982; VOL. 28; NO 13; PP. 93-96Article

MOISTURE, FIXTURING, AND CLEANING, KEY INGREDIENTS FOR SUCCESSFULLY WAVE SOLDERING FLEXIBLE CIRCUITS.BOYNTON KG.1977; INSULAT. CIRCUITS; U.S.A.; DA. 1977; VOL. 23; NO 9; PP. 43-46Article

MASS SOLDERING OF HIGH-DENSITY CIRCUIT PACKSGENGLER RH.1979; WEST. ELECTR. ENGR; USA; DA. 1979; VOL. 23; NO 4; PP. 38-42Article

WALVESOLDERING OF BACKPANELS WITH LONG WRAP POSTSELLIOTT DA; DOWN WH.1979; ELECTRON. PACKAG. PRODUCT.; USA; DA. 1979; NO 104; PP. 147-154; 5Article

AN ALTERNATIVE TO THERMAL PROFILING IN WASESOLDERING.BERNARD CD.1977; CIRCUITS MANUF.; U.S.A.; DA. 1977; VOL. 17; NO 2; PP. 34Article

WAVESOLDERING OF MOTOR ARMATURES INCREASES PRODUCTIVITY AND QUALITY1980; INSULAT. CIRCUITS; USA; DA. 1980; VOL. 26; NO 4; PP. 35-36Article

ELIMINATING SMOKE PROBLEMS DURING WAVE SOLDERING1979; INSUL. CIRCUITS; USA; DA. 1979; VOL. 25; NO 5; PP. 25-26Article

REMOVING SOLDER BRIDGES FROM PRINTED CIRCUIT BOARDSCOMERFORD MF.1981; INSUL., CIRCUITS; ISSN 0020-4544; USA; DA. 1981; VOL. 27; NO 4; PP. 31-34; BIBL. 5 REF.Article

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