Active opening force and passive contact force electrostatic switches for soft metal contact materialsOBERHAMMER, Joachim; STEMME, Göran.Journal of microelectromechanical systems. 2006, Vol 15, Num 5, pp 1235-1242, issn 1057-7157, 8 p.Article

Power Handling Analysis of High-Power W-Band All-Silicon MEMS Phase ShiftersSOMJIT, Nutapong; STEMME, Göran; OBERHAMMER, Joachim et al.I.E.E.E. transactions on electron devices. 2011, Vol 58, Num 5, pp 1548-1555, issn 0018-9383, 8 p.Article

Deep-Reactive-Ion-Etched Wafer-Scale-Transferred All-Silicon Dielectric-Block Millimeter-Wave MEMS Phase ShiftersSOMJIT, Nutapong; STEMME, Göran; OBERHAMMER, Joachim et al.Journal of microelectromechanical systems. 2010, Vol 19, Num 1, pp 120-128, issn 1057-7157, 9 p.Article

Novel microneedle patches for active insulin delivery are efficient in maintaining glycaemic control : An initial comparison with subcutaneous administration : Transdermal delivery of proteinsNORDQUIST, Lina; ROXHED, Niclas; GRISS, Patrick et al.Pharmaceutical research. 2007, Vol 24, Num 7, pp 1381-1388, issn 0724-8741, 8 p.Article

Time-efficient quasi-static algorithm for simulation of complex single-sided clamped electrostatic actuatorsOBERHAMMER, Joachim; LIU, A.-Q; STEMME, Göran et al.Journal of microelectromechanical systems. 2007, Vol 16, Num 2, pp 373-382, issn 1057-7157, 10 p.Article

Pyrosequencing in a microfluidic flow-through deviceRUSSOM, Aman; TOOKE, Nigel; ANDERSSON, Helene et al.Analytical chemistry (Washington, DC). 2005, Vol 77, Num 23, pp 7505-7511, issn 0003-2700, 7 p.Article

Novel, side opened out-of-plane microneedles for microfluidic transdermal interfacingGRISS, Patrick; STEMME, Göran.Proceedings, IEEE micro electro mechanical systems. 2002, pp 467-470, issn 1084-6999, isbn 0-7803-7185-2, 4 p.Conference Paper

Binary-Coded 4.25-bit W-Band Monocrystalline―Silicon MEMS Multistage Dielectric-Block Phase ShiftersSOMJIT, Nutapong; STEMME, Göran; OBERHAMMER, Joachim et al.IEEE transactions on microwave theory and techniques. 2009, Vol 57, Num 11, pp 2834-2840, issn 0018-9480, 7 p.Article

A micropneumatic-to-vibration energy converter conceptVAN DER WIJNGAART, Wouter; BERRIER, Audrey; STEMME, Göran et al.Sensors and actuators. A, Physical. 2002, Vol 100, Num 1, pp 77-83, issn 0924-4247, 7 p.Article

Micromachined barbed spikes for mechanical chip attachmentGRISS, Patrick; ENOKSSON, Peter; STEMME, Göran et al.Sensors and actuators. A, Physical. 2002, Vol 95, Num 2-3, pp 94-99, issn 0924-4247Conference Paper

Low-temperature full wafer adhesive bondingNIKLAUS, Frank; ENOKSSON, Peter; KÄLVESTEN, Edvard et al.Journal of micromechanics and microengineering (Print). 2001, Vol 11, Num 2, pp 100-107, issn 0960-1317Article

A lift force sensor with integrated hot-chips for wide range flow measurementsSVEDIN, Niklas; KÄLVESTEN, Edvard; STEMME, Göran et al.Sensors and actuators. A, Physical. 2003, Vol 109, Num 1-2, pp 120-130, issn 0924-4247, 11 p.Article

Electrochemically Assisted Maskless Selective Removal of Metal Layers for Three-Dimensional Micromachined SOI RF MEMS Transmission Lines and DevicesSTERNER, Mikael; ROXHED, Niclas; STEMME, Göran et al.Journal of microelectromechanical systems. 2011, Vol 20, Num 4, pp 899-908, issn 1057-7157, 10 p.Article

Arrays of monocrystalline silicon micromirrors fabricated using CMOS compatible transfer bondingNIKLAUS, Frank; HAASL, Sjoerd; STEMME, Göran et al.Journal of microelectromechanical systems. 2003, Vol 12, Num 4, pp 465-469, issn 1057-7157, 5 p.Article

A method to maintain wafer alignment precision during adhesive wafer bondingNIKLAUS, Frank; ENOKSSON, Peter; KÄLVESTEN, Edvard et al.Sensors and actuators. A, Physical. 2003, Vol 107, Num 3, pp 273-278, issn 0924-4247, 6 p.Article

A static turbine flow meter with a micromachined silicon torque sensorSVEDIN, Niklas; STEMME, Erik; STEMME, Göran et al.Journal of microelectromechanical systems. 2003, Vol 12, Num 6, pp 937-946, issn 1057-7157, 10 p.Article

Liquid handling using expandable microspheresGRISS, Patrick; ANDERSSON, Helene; STEMME, Göran et al.Proceedings, IEEE micro electro mechanical systems. 2002, pp 117-120, issn 1084-6999, isbn 0-7803-7185-2, 4 p.Conference Paper

Row/Column Addressing Scheme for Large Electrostatic Actuator MEMS Switch Arrays and Optimization of the Operational Reliability by Statistical AnalysisBRAUN, Stefan; OBERHAMMER, Joachim; STEMME, Goran et al.Journal of microelectromechanical systems. 2008, Vol 17, Num 5, pp 1104-1113, issn 1057-7157, 10 p.Article

S-shaped film actuator for low-voltage high-isolation MEMS metal contact switchesOBERHAMMER, Joachim; STEMME, Goran.IEEE International Conference on Micro Electro Mechanical Systems. 2004, pp 637-640, isbn 0-7803-8265-X, 1Vol, 4 p.Conference Paper

A surface-micromachined resonant-beam pressure-sensing structureMELVAS, Patrik; KÄLVESTEN, Edvard; STEMME, Goran et al.Journal of microelectromechanical systems. 2001, Vol 10, Num 4, pp 498-502, issn 1057-7157Article

Small footprint wafer-level vacuum packaging using compressible gold sealing ringsANTELIUS, Mikael; STEMME, Goran; NIKLAUS, Frank et al.Journal of micromechanics and microengineering (Print). 2011, Vol 21, Num 8, issn 0960-1317, 085011.1-085011.6Article

Development of micromachined hollow tips for protein analysis based on nanoelectrospray ionization mass spectrometryGRISS, Patrick; MELIN, Jessica; SJÖDAHL, Johan et al.Journal of micromechanics and microengineering (Print). 2002, Vol 12, Num 5, pp 682-687, issn 0960-1317Article

Low-temperature wafer-level transfer bondingNIKLAUS, Frank; ENOKSSON, Peter; GRISS, Patrick et al.Journal of microelectromechanical systems. 2001, Vol 10, Num 4, pp 525-531, issn 1057-7157Article

Wafer-level process for single-use buckling-film microliter-range pumpsSAMEL, Björn; CHRETIEN, Julien; YUE, Ruifeng et al.Journal of microelectromechanical systems. 2007, Vol 16, Num 4, pp 795-801, issn 1057-7157, 7 p.Article

Highly sensitive triaxial silicon accelerometer with integrated PZT thin film detectorsKUNZ, Korbinian; ENOKSSON, Peter; STEMME, Göran et al.Sensors and actuators. A, Physical. 2001, Vol 92, Num 1-3, pp 156-160, issn 0924-4247Conference Paper