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High-density 3-D microsystem-in-package technology and its application for integrated CCD micro-camera visual inspection systemYAMADA, Hiroshi; TOGASAKI, Takashi; SADAMOTO, Atsushi et al.Proceedings - Electrochemical Society. 2004, pp 277-291, issn 0161-6374, isbn 1-56677-417-9, 15 p.Conference Paper