Induction Soldering Gets Maglev Vehicle on TrackHOLKO, Kenneth H.Welding journal. 2009, Vol 88, Num 4, pp 53-57, issn 0043-2296, 5 p.Article

Solder joint process control using 3-D measurementsBAKER, P. D.Electronic manufacturing. 1990, Vol 36, Num 7, pp 32-33, 2 p.Article

Standardisieren von Loetvorgaengen:Konstanz der Parameter ist anzustreben beim Loeten von Leiterplatten = Standardization of soldering proceduresZICKUHR, U; MUELLER, B.F.MM. Maschinenmarkt. 1986, Vol 92, Num 44, pp 58-60, issn 0341-5775Article

Prevention of electromigration-induced Cu pad dissolution by using a high electromigration-resistance ternary Cu-Ni-Sn layerHSIAO, Y. H; CHUANG, Y. C; LIU, C. Y et al.Scripta materialia. 2006, Vol 54, Num 4, pp 661-664, issn 1359-6462, 4 p.Article

Fluxless solderingJACOBSON, D. M; HUMPSTON, G.International materials reviews. 2006, Vol 51, Num 5, pp 313-328, issn 0950-6608, 16 p.Article

Improving the soldering of magnesium alloysWIELAGE, Bernhard; MÜCKLICH, Silke.Welding journal. 2006, Vol 85, Num 9, pp 48-51, issn 0043-2296, 4 p.Article

Mechanisms of Soldering Formation on Coated Core PinsJIE SONG; TONY DENOUDEN; QINGYOU HAN et al.Metallurgical and materials transactions. A, Physical metallurgy and materials science. 2012, Vol 43, Num 2, pp 415-421, issn 1073-5623, 7 p.Article

AWS Breaks New Ground with Soldering SpecificationVIANCO, Paul T.Welding journal. 2008, Vol 87, Num 10, pp 53-54, issn 0043-2296, 2 p.Article

Select the Right Surface Finish to Improve SolderabilityLOPEZ, Edwin P; VIANCO, Paul T.Welding journal. 2011, Vol 90, Num 9, pp 44-46, issn 0043-2296, 3 p.Article

Filler materials : the current situation and future trends with particular reference to lead-free soldering alloysZACCARIA, B.Welding international. 2001, Vol 15, Num 7, pp 545-550, issn 0950-7116Article

Analysis of ring and plug shear strengths for comparison of lead-free soldersFOLEY, J. C; GICKLER, A; LEPREVOST, F. H et al.Journal of electronic materials. 2000, Vol 29, Num 10, pp 1258-1263, issn 0361-5235Conference Paper

Characterisation of lead free solderability of immersion Sn finish on PWBs using wetting balance technique : Characterisation for process optimisation in surface engineeringHONG, S. J; PARK, B-H; SEO, D. S et al.Surface engineering. 2008, Vol 24, Num 5, pp 337-340, issn 0267-0844, 4 p.Article

Brazing and Soldering Engineering Course Introduced at OSULUCAS, Matthew.Welding journal. 2008, Vol 87, Num 12, pp 34-35, issn 0043-2296, 2 p.Article

Improving temperature uniformity in infrared reflow soldering of PCB'sAVRAMESCU, S.Electronic manufacturing. 1989, Vol 35, Num 2, pp 24-26, 3 p.Article

Exploring Different Brazing and Soldering MethodsARNOLD, Jerry; MILLER, Earl; MITCHELL, Greg et al.Welding journal. 2009, Vol 88, Num 4, pp 50-51, issn 0043-2296, 2 p.Article

Applying localized heat for brazing and solderingDUCKHAM, Alan.Welding journal. 2006, Vol 85, Num 9, pp 44-46, issn 0043-2296, 3 p.Article

Solderability of capacitor lead wires = Aptitude au brasage tendre de conducteurs de condensateursGEIGER, A. L.1986, Num 11, pp 56-61, issn 0263-0060Article

Evaluation of lead free soldering development by means of a holistic considerationTÜRPE, M.Advanced engineering materials (Print). 2006, Vol 8, Num 3, issn 1438-1656, 138, 161-164 [5 p.]Conference Paper

On the non-occurrence of tin pest in tin-silver-indium soldersSEMENOVA, Olga; FLANDORFER, Hans; IPSER, Herbert et al.Scripta materialia. 2005, Vol 52, Num 2, pp 89-92, issn 1359-6462, 4 p.Article

Reduced oxide soldering activation (ROSA) : Enabling technology for soldering of Flip chip assembliesHILLMAN, D.SPIE proceedings series. 1997, pp 586-591, isbn 0-930815-50-5Conference Paper

Improving soldering to meet critical WS 6536 specificationsSCHEID, D; KOCH, H.Electri.onics. 1987, Vol 33, Num 13, pp 19-20, issn 0745-4309Article

Hand Soldering BasicsVIANCO, Paul T.Welding journal. 2011, Vol 90, Num 9, pp 47-48, issn 0043-2296, 2 p.Article

Ultrasonic-Assisted Soldering of 5056 Aluminum Alloy Using Quasi-Melting Zn-Sn AlloyNAGAOKA, Toru; MORISADA, Yoshiaki; FUKUSUMI, Masao et al.Metallurgical and materials transactions. B, Process metallurgy and materials processing science. 2010, Vol 41, Num 4, pp 864-871, issn 1073-5615, 8 p.Article

Challenges in attaining lead-free soldersBASKIN, Philip.Welding journal. 2007, Vol 86, Num 3, pp 58-61, issn 0043-2296, 4 p.Article

Active soldering of ITO to copperCHANG, S. Y; LU, M. H; TSAO, L. C et al.Welding journal. 2006, Vol 85, Num 4, issn 0043-2296, 81s-83sArticle