A case study of lead free thick film conductors with lead free solder alloysBOKALO, Peter; SHAHBAZI, Samson; SLIMS, Theresa D et al.SPIE proceedings series. 2003, pp 71-76, isbn 0-8194-5189-4, 6 p.Conference Paper

Lead-free solder bump technologies for flip-chip electronic packaging applicationsKARIM, Zaheed S; CHOW, Alice; CHEUNG, Edwin et al.SPIE proceedings series. 2002, pp 570-575, isbn 0-8194-4500-2, 2VolConference Paper

Lead-free electronic soldersSUBRAMANIAN, K. N.Journal of materials science. Materials in electronics. 2007, Vol 18, Num 1-3, issn 0957-4522, 366 p.Serial Issue

Experiments and simulations of uniaxial ratchetting deformation of Sn-3Ag-0.5Cu and Sn-37Pb solder alloysKOBAYASHI, Takuji; SASAKI, Katsuhiko.Journal of materials science. Materials in electronics. 2009, Vol 20, Num 4, pp 343-353, issn 0957-4522, 11 p.Article

The effect of lead-free solder paste on component placement accuracy and self-alignment during reflowLIUKKONEN, Timo; NUMMENPÄÄ, Pekka; TUOMINEN, Aulis et al.Soldering & surface mount technology. 2004, Vol 16, Num 1, pp 44-47, issn 0954-0911, 4 p.Article

New lead-free thick film resistorsHORMADALY, J.SPIE proceedings series. 2002, pp 543-547, isbn 0-930815-66-1, 5 p.Conference Paper

Results of comparative reliability tests on lead-free solder alloysGROSSMANN, Gunter; NICOLETTI, Giovanni; SOLER, Ursin et al.Proceedings - Electronic Components Conference. 2002, pp 1232-1237, issn 0569-5503, isbn 0-7803-7430-4, 6 p.Conference Paper

Epoxy flux for lead-free solderingWUSHENG YIN; LEE, Ning-Cheng.SPIE proceedings series. 2003, pp 731-738, isbn 0-8194-5189-4, 8 p.Conference Paper

Reliability of tin-lead balled BGAs soldered with lead-free solder pasteNURMI, Sami Tapani; RISTOLAINEN, Eero Olavi.Soldering & surface mount technology. 2002, Vol 14, Num 2, issn 0954-0911, 5, 7, 9, 35-39 [8 p.]Article

On the factors affecting the dissolution of copper in molten lead-free solders and development of a method to assess the soldering parametersDI MAIO, D; HUNT, C. P.Soldering & surface mount technology. 2009, Vol 21, Num 4, pp 24-31, issn 0954-0911, 8 p.Article

Reliability and microstructure of lead-free solder die attach interface in silicon power devicesHUFF, D; KATSIS, D; STINSON-BAGBY, K et al.IEEE international reliability physics symposium. 2004, pp 567-568, isbn 0-7803-8315-X, 1Vol, 2 p.Conference Paper

Development of high-temperature solders: ReviewGUANG ZENG; MCDONALD, Stuart; NOGITA, Kazuhiro et al.Microelectronics and reliability. 2012, Vol 52, Num 7, pp 1306-1322, issn 0026-2714, 17 p.Article

Enthalpies of mixing of liquid systems for lead-free soldering: Cu-Sb-Sn systemJENDRZEJCZYK-HANDZLIK, Dominika; RECHCHACH, Meryem; GIERLOTKA, Wojciech et al.Thermochimica acta. 2011, Vol 512, Num 1-2, pp 217-224, issn 0040-6031, 8 p.Article

Leachability of printed wire boards containing leaded and lead-free solderTOWNSEND, Timothy; MUSSON, Stephen; DUBEY, Brajesh et al.Journal of environmental management. 2008, Vol 88, Num 4, pp 926-931, issn 0301-4797, 6 p.Article

Thermodynamic assessment of the Bi-Sn-Zn SystemVIZDAL, Jiri; BRAGA, Maria Helena; KROUPA, Ales et al.Calphad. 2007, Vol 31, Num 4, pp 438-448, issn 0364-5916, 11 p.Article

Composite lead-free electronic soldersFU GUO.Journal of materials science. Materials in electronics. 2007, Vol 18, Num 1-3, pp 129-145, issn 0957-4522, 17 p.Article

Reliability of high temperature solder alternativesMCCLUSKEY, F. P; DASH, M; WANG, Z et al.Microelectronics and reliability. 2006, Vol 46, Num 9-11, pp 1910-1914, issn 0026-2714, 5 p.Conference Paper

Controllability of novel Sn_0.95Au_0.05 microbumps using interlaminated tin and gold layers for flip-chip interconnectionONODERA, Kiyomitsu; ISHII, Takao; AOYAMA, Shinji et al.IEEE microwave and wireless components letters. 2003, Vol 13, Num 7, pp 256-258, issn 1531-1309, 3 p.Article

Packaging technologies for automotive Electronics in the Lead-Free eraDANIELSSON, Hans.SPIE proceedings series. 2002, pp 518-523, isbn 0-930815-66-1, 6 p.Conference Paper

Effect of flux quantity on Sn-Pb and pb-free BGA solder shear strengthPAINAIK, Mandar; SANTOS, Daryl L; MCLENAGHAN, A. James et al.IEEE/CPMT International Electronics Manufacturing Technology Symposium. 2002, pp 229-237, issn 1089-8190, isbn 0-7803-7301-4, 9 p.Conference Paper

Addition of cobalt nanoparticles into Sn-3.8Ag-0.7Cu lead-free solder by paste mixingTAY, S. L; HASEEB, A. S. M. A; MOHD RAFIE JOHAN et al.Soldering & surface mount technology. 2011, Vol 23, Num 1, pp 10-14, issn 0954-0911, 5 p.Article

Enthalpies of mixing of liquid systems for lead free soldering: Al-Cu-Sn systemFLANDORFERA, Hans; RECHCHACH, Meryem; ELMAHFOUDI, A et al.Journal of chemical thermodynamics. 2011, Vol 43, Num 11, pp 1612-1622, issn 0021-9614, 11 p.Article

Pb-Free Synthesis: Decision Matrix as a Tool for Alloy SelectionQUINTERO, Pedro O; VALENTIN, Ricky; MA, David et al.Journal of microelectronics and electronic packaging. 2010, Vol 7, Num 1, pp 25-34, issn 1551-4897, 10 p.Article

Kirkendall voids formation in the reaction between Ni-doped SnAg lead-free solders and different Cu substrates : RECENT RESEARCH ADVANCES IN Pb-FREE SOLDERSWANG, Y. W; LIN, Y. W; KAO, C. R et al.Microelectronics and reliability. 2009, Vol 49, Num 3, pp 248-252, issn 0026-2714, 5 p.Article

Dissolution of copper on Sn-Ag-Cu system lead free solderIZUTA, Goro; TANABE, Tsuyoshi; SUGANUMA, Katsuaki et al.Soldering & surface mount technology. 2007, Vol 19, Num 2, pp 4-11, issn 0954-0911, 8 p.Article