Le fer et la soudure dans une seule main = A compact soldering ironCOLOMBIER, A.Industries et techniques (1960). 1984, Num 529, issn 0150-6617, 71Article

Coupling effect in Pt/Sn/Cu sandwich solder joint structuresWANG, S. J; LIU, C. Y.Acta materialia. 2007, Vol 55, Num 10, pp 3327-3335, issn 1359-6454, 9 p.Article

Prevention of electromigration-induced Cu pad dissolution by using a high electromigration-resistance ternary Cu-Ni-Sn layerHSIAO, Y. H; CHUANG, Y. C; LIU, C. Y et al.Scripta materialia. 2006, Vol 54, Num 4, pp 661-664, issn 1359-6462, 4 p.Article

A flux for soldering with zinc soldersSHCHERBEDINSKAYA, A.V; KLEVTSOVA, E.V; FEDOROV, V.N et al.Welding Production. 1985, Vol 32, Num 5, pp 28-29, issn 0043-230XArticle

INSTALLATIONS DE BRASAGE EN MASSE POUR L'ELECTRONIQUE III: BRASAGE EN PHASE VAPEUR = PRODUCTION SOLDERING EQUIPMENT FOR ELECTRONICS. III VAPOUR PHASE SOLDERINGKARPEL S.1981; ETAIN US.; ISSN 0014-1631; GBR; DA. 1981; NO 130; PP. 1-4; LOC. ISArticle

SOUDOBRASAGE ET BRASAGE. IV = BRAZE WELDING, BRAZING AND SOLDERING. IVGERBEAUX H.1983; SOUDER; ISSN 0038-173X; FRA; DA. 1983; VOL. 5; NO 1; PP. 2-6; LOC. ISArticle

Microstructure of a lead-free composite solder produced by an in-situ processHWANG, Seong-Yong; LEE, Joo-Won; LEE, Zin-Hyoung et al.Journal of electronic materials. 2002, Vol 31, Num 11, pp 1304-1308, issn 0361-5235, 5 p.Conference Paper

Size distribution and morphology of Cu₆Sn₅ scallops in wetting reaction between molten solder and copperSUH, J. O; TU, K. N; LUTSENKO, G. V et al.Acta materialia. 2008, Vol 56, Num 5, pp 1075-1083, issn 1359-6454, 9 p.Article

Multiple reflow study of ball grid array (BGA) solder joints on Au/Ni metallizationZHONG, W. H; CHAN, Y. C; WU, B. Y et al.Journal of materials science. 2007, Vol 42, Num 13, pp 5239-5247, issn 0022-2461, 9 p.Article

DEPENDENCE OF THE CHARACTER OF FAILURE OF NON CAPILLARY SOLDERED JOINTS ON THE TECHNOLOGY OF STEEL SOLDERING WITH A BRASS SOLDERSHAPIRO AE; KARAKOZOV EH S; KUDRIN NA et al.1979; SVAR. PROIZVOD.; ISSN 0491-6441; SUN; DA. 1979; NO 4; PP. 27-29; BIBL. 2 REF.; LOC. ISArticle

Solder balling of lead-free solder pastesARRA, Minna; SHANGGUAN, Dongkai; RISTOLAINEN, Eero et al.Journal of electronic materials. 2002, Vol 31, Num 11, pp 1130-1138, issn 0361-5235, 9 p.Conference Paper

GEFUEGE UND STRUKTUR VON WEICHLOETVERBINDUNGEN IN IHRER ABHAENGIGKEIT VON WERKSTOFF- UND PROZESSPARAMETERN = THE RELATIONHSIP BETWEEN THE MAKE UP AND METALLURGICAL STRUCTURE OF SOLDERED JOINTS AND MATERIAL AND PROCESS PARAMETERS = STRUCTURE ET FORMATION DES ASSEMBLAGES OBTENUS PAR BRASAGE TENDRE EN FONCTION DES CARACTERISTIQUES DES MATERIAUX ET DES PARAMETRES DE BRASAGESCHMITT THOMAS KG; KNOTT UC.1983; SCHWEISSEN+SCHNEIDEN; ISSN 0036-7184; DEU; DA. 1983; VOL. 35; NO 3; PP. 107-111; BIBL. 20 REF.; IDEM ENG; LOC. ISArticle

Inhibiting the formation of microvoids in Cu₃Sn by additions of Cu to soldersWANG, Y. W; LIN, Y. W; KAO, C. R et al.Journal of alloys and compounds. 2010, Vol 493, Num 1-2, pp 233-239, issn 0925-8388, 7 p.Article

CF₄ fluorination onto Cu surface using atmospheric pressure non-equilibrium plasma for flux-less soldering with lead free solderUESHIMA, Masato; NAKAMURA, Yusuke; HORII, Shingo et al.Surface & coatings technology. 2011, Vol 206, Num 5, pp 934-937, issn 0257-8972, 4 p.Conference Paper

Asymmetrical solder microstructure in Ni/Sn/Cu solder jointWANG, S. J; LIU, C. Y.Scripta materialia. 2006, Vol 55, Num 4, pp 347-350, issn 1359-6462, 4 p.Article

Ultrasonic Soldering of Shape Memory NiTi to Aluminum 2024HAHNLEN, R; FOX, G; DAPINO, M et al.Welding journal. 2012, Vol 91, Num 1, issn 0043-2296, s1-s7Article

Improvement of flux-less, lead-free solder wettability on CF₄-plasma-fluorinated Sn and Ag substrates using 'atmospheric pressure non-equilibrium plasma'UESHIMA, Masato; NAKAMURA, Yusuke; HORII, Shingo et al.Surface & coatings technology. 2010, Vol 205, issn 0257-8972, S426-S430, SUP1Conference Paper

Polarity effect of electromigration on intermetallic compound formation in SnPb solder jointsLU, Yu-Dong; HE, Xiao-Qi; EN, Yun-Fei et al.Acta materialia. 2009, Vol 57, Num 8, pp 2560-2566, issn 1359-6454, 7 p.Article

Variable-Size Solder Droplets by a Molten-Solder Ejection MethodYOKOYAMA, Yoshinori; ENDO, Kazuyo; IWASAKI, Toshihiro et al.Journal of microelectromechanical systems. 2009, Vol 18, Num 2, pp 316-321, issn 1057-7157, 6 p.Article

La soudure en phase vapeur est une nouvelle technique de soudure en masse développée dans l'industrie électronique = Vapor phase soldering: a new mass-soldering system in the electronic industryFRANCHIMONT, E; DE SMET, C.Revue de la soudure (Bruxelles). 1983, Vol 39, Num 3, pp 89-98, issn 0035-127XArticle

Gefügeentwicklung durch Wärmebehandlung an Maonesiumlötverbindungen = Microstructure development by thermal treatment on soldered magnesium jointsWIELAGE, Bernhard; MÜCKLICH, Silke.Praktische Metallographie. 2007, Vol 44, Num 7, pp 307-316, issn 0032-678X, 10 p.Article

Régulation de température pour fer à souder = Temperature control device for soldering ironDURAND, G.1987, Num 106, pp 54-58, issn 0243-4911Article

SPECIAL FEATURES OF THE FILLING OF A HORIZONTAL GAP WITH A SOLDERING ALLOY DURING ISOTHERMAL CONTACT = CARACTERISTIQUES DU REMPLISSAGE D'UN JEU HORIZONTAL AVEC UN METAL D'APPORT DE BRASAGE TENDRE AVEC CONTACT ISOTHERMELASHKO SV; NAGAPETYAN IG.1980; WELDG PRODUCT.; ISSN 0043-230X; GBR; DA. 1980; VOL. 27; NO 8; PP. 32-34; BIBL. 3 REF.; DE RUS; LOC. IS;[SVAR PROIZVOD; SUN; DA. 1980; NO 8; PP. 25-26]Article

The use of a directional solidification technique to investigate the interrelationship of thermal parameters, microstructure and microhardness of Bi-Ag solder alloysSPINELLI, José Eduardo; SILVA, Bismarck Luiz; CHEUNG, Noé et al.Materials characterization. 2014, Vol 96, pp 115-125, issn 1044-5803, 11 p.Article

Soldering of surface mounted devices : new tasks and their solutions = Brasage tendre des composants montés en surface: nouveaux problèmes et leurs solutionsSTRAUSS, R.1986, Num 10, pp 21-23, issn 0263-0060Article