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Splice testing for LHC quadrupole magnetsBARZI, E; BOSSERT, R; FEHER, S et al.IEEE transactions on applied superconductivity. 2003, Vol 13, Num 2, pp 1301-1304, issn 1051-8223, 4 p., 2Conference Paper

A review and prediction of chip scale solder joint reliabilityGHAFFARIAN, R.SPIE proceedings series. 1997, pp 109-110, isbn 0-930815-50-5Conference Paper

Contrôle non destructif des assemblages brasés et fiabilité = Non destructive testing of brazed and soldered jointsDUBRESSON, J.Journées nationales COFREND. 1985, pp 167-191Conference Paper

Finite-element analysis of a PBGA assembly under isothermal/mechanical twisting loadingYANG, Q. J; SHI, X. Q; WANG, Z. P et al.Finite elements in analysis and design. 2003, Vol 39, Num 9, pp 819-833, issn 0168-874X, 15 p.Article

New wafer level structure for stress free area array solder attachFILLION, R; MEYER, L; DUROCHER, K et al.SPIE proceedings series. 2003, pp 687-692, isbn 0-8194-5189-4, 6 p.Conference Paper

Multiple reflow study of ball grid array (BGA) solder joints on Au/Ni metallizationZHONG, W. H; CHAN, Y. C; WU, B. Y et al.Journal of materials science. 2007, Vol 42, Num 13, pp 5239-5247, issn 0022-2461, 9 p.Article

Corrosion of flat integral microcircuit boards during brazing = Corrosion du socle plan de boîtier de circuits intégrés en brasageBERZINA, A. I; LAPSHOV, YU. K.Automatic Welding. 1982, Vol 35, Num 11, pp 49-59, issn 0005-108XArticle

PRACTICAL ASPECTS OF VACUUM BRAZING = ASPECTS PRATIQUES DU BRASAGE FORT SOUS VIDEBIRCH BJ.1981; METALLURGIA; ISSN 0026-0835; GBR; DA. 1981; VOL. 48; NO 5; PP. 234-236; BIBL. 3 REF.; LOC. ISArticle

LOETKONSHUKTIONEN UND LOETVERBINDUNGEN - IHRE WERKSTUECK- UND WERKSTOFFBEZOGENE BESCHREIBUNG = CONSTRUCTIONS ET ASSEMBLAGES BRASES: DEFINITIONS SE RAPPORTANT SOIT A LA PIECE, SOIT AUX MATERIAUXWITTKE K.1979; Z.I.S. MITT.; ISSN 0044-1465; DDR; DA. 1979; VOL. 21; NO 4; PP. 380-385; BIBL. 8 REF.; LOC. ISArticle

Polarity effect of electromigration on intermetallic compound formation in SnPb solder jointsLU, Yu-Dong; HE, Xiao-Qi; EN, Yun-Fei et al.Acta materialia. 2009, Vol 57, Num 8, pp 2560-2566, issn 1359-6454, 7 p.Article

RELATIONSHIP BETWEEN WETTABILITY, BOND STRENGTH AND MUTUAL SOLUBILITYWATANABE T; OKANE I; SASABE K et al.1979; YOSETSU GAKKAI-SHI; ISSN 0021-4787; JPN; DA. 1979; VOL. 48; NO 8; PP. 611-615; ABS. ENG; BIBL. 5 REF.; LOC. ISArticle

DAS ECHO GIBT AUFSCHLUSS. ZERSTOERUNGSFREIES PRUEFEN VON LOETVERBINDUNGEN MIT HILFE DES ULTRASCHALLS = ECHOES DECIDE. ULTRASONIC TESTING OF BRAZED AND SOLDERED JOINTS = L'ECHO DONNE LA DECISION. CONTROLE PAR ULTRASONS DES ASSEMBLAGES BRASESECHTERHOFF U.1980; MASCHINENMARKT; ISSN 0025-4509; DEU; DA. 1980; VOL. 86; NO 30; PP. 583-585; BIBL. 4 REF.Article

DETERMINATION OF LAP LENGTH OF SPECIMENS FOR SHEAR STRENGTH OF BRAZED JOINTS. = DETERMINATION DE LA LONGUEUR DE RECOUVREMENT DU POINT DE VUE DE LA RESISTANCE AU CISAILLEMENT DES ASSEMBLAGES BRASESCHERNYKH VI; LEBEDEV YU A.1975; WELDG PRODUCT.; G.B.; DA. 1975; VOL. 22; NO 5; PP. 51-52; BIBL. 4 REF.; TRAD. DU RUSSE: SVAROCH. PROIZVOD., S.S.S.R., 1975, NO 5, 39-40Article

APPROCHE COMPLEXE DU PROJET D'UN SYSTEME DE CONTROLE THERMIQUE DE JOINTS BRASESVAVILOV VP; TANASEJCHUK S YU; UPADYSHEV AB et al.1978; DEFEKTOSKOPIJA; SUN; DA. 1978; NO 10; PP. 63-67; BIBL. 5 REF.Article

PROGRES ET PERSPECTIVES DANS LE DOMAINE DE L'UTILISATION DE COLLES POUR LA FABRICATION DES OUTILS ET EQUIPEMENTSPETROVA AP.1980; VEST. MASHINOSTR.; SUN; DA. 1980; NO 6; PP. 57-60; BIBL. 8 REF.Article

HOEHERE FESTIGKEIT BEI HOETVETBINDUNGEN = INCREASING THE RESISTANCE OF BRAZED JOINTS = AUGMENTATION DE LA RESISTANCE DES ASSEMBLAGES BRASES1980; BLECH, ROHRE, PROFILE; ISSN 0006-4688; DEU; DA. 1980; VOL. 27; NO 2; PP. 344; LOC. ISArticle

BREVET 2.327.318 (A1) (74 08614). - 14 MARS 1974. PROCEDE DE REALISATION ET D'ASSEMBLAGE DE TUYERE DE HAUT FOURNEAU.sdPatent

AN UNDERSTANDING OF THE FUNDAMENTALS AND JOINT REQUIREMENT FOR DIFFUSION BRAZING = PRINCIPES FONDAMENTAUX DU BRASAGE FORT PAR DIFFUSION. CARACTERISTIQUES REQUISES DES ASSEMBLAGESCONNELL LD.1981; HART- UND HOCHTEMPERATURLOETEN UND DIFFUSIONSSCHWEISSEN. VORTRAEGE DES KOLLOQUIUMS/1981/ESSEN; DEU; DUSSELDORF: DVS; DA. 1981; PP. 138-141; LOC. ISConference Paper

DE METALLOGRAFIE EN MICROHARDHEID VAN GESOLDEERDE VERBINDINGEN. = ESSAIS METALLOGRAPHIQUES ET DE MICRODURETE D'ASSEMBLAGES BRASESVAN DER SLUIS HH.1976; LASTECHNIEK; NEDERL.; DA. 1976; VOL. 42; NO 9; PP. 184-191; ABS. ANGL.; BIBL. 14 REF.Article

Reliability of a wafer level packaging method with plastic-core solder bumps: Utilizing Sn-Ag solder at 0.3 mm diameterSUMIKAWA, Masato; MURAYAMA, Rina; OGAWA, Masashi et al.SPIE proceedings series. 2003, pp 693-698, isbn 0-8194-5189-4, 6 p.Conference Paper

Unleading the wayRICHARDS, Brian.Materials world. 2001, Vol 9, Num 1, pp 19-21, issn 0967-8638Article

Bewertung von Schädigungen an Lötverbindungen der oberflächenmontierten Bauelemente bei einem Temperaturschocktest = Evaluation des dommages subis par des brasures de composants montés en surface après des essais de chocs thermiques = Assessment of damages to soldered joints on surface mounted devices by a thermal shock testGABOR, H.Verbindungstechnik in der Elektronik. Internationales kolloquium. 1986, pp 180-183Conference Paper

A novel measurement technique for stencil printed solder pasteDUSEK, Milos; HUNT, Christopher.Soldering & surface mount technology. 2003, Vol 15, Num 2, issn 0954-0911, 5, 35-45 [12 p.]Article

Lead free soldering technology for mobile equipmentTANAKA, Yasunori; TAKAHASHI, Junichi; KAWASHIMA, Kazuyuki et al.SPIE proceedings series. 2000, pp 314-319, isbn 0-930815-62-9Conference Paper

Systemintegration in der Mikroelektronik (Nürnberg, 4-6 Mai 1999) = System integration in micro electronicsReichl, Herbert.Systemintegration in der Mikroelektronik. Kongress. 1999, isbn 3-8007-2456-1, 282 p., isbn 3-8007-2456-1Conference Proceedings

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