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A review and prediction of chip scale solder joint reliabilityGHAFFARIAN, R.SPIE proceedings series. 1997, pp 109-110, isbn 0-930815-50-5Conference Paper

Contrôle non destructif des assemblages brasés et fiabilité = Non destructive testing of brazed and soldered jointsDUBRESSON, J.Journées nationales COFREND. 1985, pp 167-191Conference Paper

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Multiple reflow study of ball grid array (BGA) solder joints on Au/Ni metallizationZHONG, W. H; CHAN, Y. C; WU, B. Y et al.Journal of materials science. 2007, Vol 42, Num 13, pp 5239-5247, issn 0022-2461, 9 p.Article

PRACTICAL ASPECTS OF VACUUM BRAZING = ASPECTS PRATIQUES DU BRASAGE FORT SOUS VIDEBIRCH BJ.1981; METALLURGIA; ISSN 0026-0835; GBR; DA. 1981; VOL. 48; NO 5; PP. 234-236; BIBL. 3 REF.; LOC. ISArticle

LOETKONSHUKTIONEN UND LOETVERBINDUNGEN - IHRE WERKSTUECK- UND WERKSTOFFBEZOGENE BESCHREIBUNG = CONSTRUCTIONS ET ASSEMBLAGES BRASES: DEFINITIONS SE RAPPORTANT SOIT A LA PIECE, SOIT AUX MATERIAUXWITTKE K.1979; Z.I.S. MITT.; ISSN 0044-1465; DDR; DA. 1979; VOL. 21; NO 4; PP. 380-385; BIBL. 8 REF.; LOC. ISArticle

Polarity effect of electromigration on intermetallic compound formation in SnPb solder jointsLU, Yu-Dong; HE, Xiao-Qi; EN, Yun-Fei et al.Acta materialia. 2009, Vol 57, Num 8, pp 2560-2566, issn 1359-6454, 7 p.Article

RELATIONSHIP BETWEEN WETTABILITY, BOND STRENGTH AND MUTUAL SOLUBILITYWATANABE T; OKANE I; SASABE K et al.1979; YOSETSU GAKKAI-SHI; ISSN 0021-4787; JPN; DA. 1979; VOL. 48; NO 8; PP. 611-615; ABS. ENG; BIBL. 5 REF.; LOC. ISArticle

DAS ECHO GIBT AUFSCHLUSS. ZERSTOERUNGSFREIES PRUEFEN VON LOETVERBINDUNGEN MIT HILFE DES ULTRASCHALLS = ECHOES DECIDE. ULTRASONIC TESTING OF BRAZED AND SOLDERED JOINTS = L'ECHO DONNE LA DECISION. CONTROLE PAR ULTRASONS DES ASSEMBLAGES BRASESECHTERHOFF U.1980; MASCHINENMARKT; ISSN 0025-4509; DEU; DA. 1980; VOL. 86; NO 30; PP. 583-585; BIBL. 4 REF.Article

DETERMINATION OF LAP LENGTH OF SPECIMENS FOR SHEAR STRENGTH OF BRAZED JOINTS. = DETERMINATION DE LA LONGUEUR DE RECOUVREMENT DU POINT DE VUE DE LA RESISTANCE AU CISAILLEMENT DES ASSEMBLAGES BRASESCHERNYKH VI; LEBEDEV YU A.1975; WELDG PRODUCT.; G.B.; DA. 1975; VOL. 22; NO 5; PP. 51-52; BIBL. 4 REF.; TRAD. DU RUSSE: SVAROCH. PROIZVOD., S.S.S.R., 1975, NO 5, 39-40Article

APPROCHE COMPLEXE DU PROJET D'UN SYSTEME DE CONTROLE THERMIQUE DE JOINTS BRASESVAVILOV VP; TANASEJCHUK S YU; UPADYSHEV AB et al.1978; DEFEKTOSKOPIJA; SUN; DA. 1978; NO 10; PP. 63-67; BIBL. 5 REF.Article

AN UNDERSTANDING OF THE FUNDAMENTALS AND JOINT REQUIREMENT FOR DIFFUSION BRAZING = PRINCIPES FONDAMENTAUX DU BRASAGE FORT PAR DIFFUSION. CARACTERISTIQUES REQUISES DES ASSEMBLAGESCONNELL LD.1981; HART- UND HOCHTEMPERATURLOETEN UND DIFFUSIONSSCHWEISSEN. VORTRAEGE DES KOLLOQUIUMS/1981/ESSEN; DEU; DUSSELDORF: DVS; DA. 1981; PP. 138-141; LOC. ISConference Paper

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Reliability of a wafer level packaging method with plastic-core solder bumps: Utilizing Sn-Ag solder at 0.3 mm diameterSUMIKAWA, Masato; MURAYAMA, Rina; OGAWA, Masashi et al.SPIE proceedings series. 2003, pp 693-698, isbn 0-8194-5189-4, 6 p.Conference Paper

Unleading the wayRICHARDS, Brian.Materials world. 2001, Vol 9, Num 1, pp 19-21, issn 0967-8638Article

Bewertung von Schädigungen an Lötverbindungen der oberflächenmontierten Bauelemente bei einem Temperaturschocktest = Evaluation des dommages subis par des brasures de composants montés en surface après des essais de chocs thermiques = Assessment of damages to soldered joints on surface mounted devices by a thermal shock testGABOR, H.Verbindungstechnik in der Elektronik. Internationales kolloquium. 1986, pp 180-183Conference Paper

A novel measurement technique for stencil printed solder pasteDUSEK, Milos; HUNT, Christopher.Soldering & surface mount technology. 2003, Vol 15, Num 2, issn 0954-0911, 5, 35-45 [12 p.]Article

Lead free soldering technology for mobile equipmentTANAKA, Yasunori; TAKAHASHI, Junichi; KAWASHIMA, Kazuyuki et al.SPIE proceedings series. 2000, pp 314-319, isbn 0-930815-62-9Conference Paper

Systemintegration in der Mikroelektronik (Nürnberg, 4-6 Mai 1999) = System integration in micro electronicsReichl, Herbert.Systemintegration in der Mikroelektronik. Kongress. 1999, isbn 3-8007-2456-1, 282 p., isbn 3-8007-2456-1Conference Proceedings

Soudage et techniques connexes. Assemblages exécutés avec des produits d'apport de brasage tendre et de brasage fort. Méthodes d'essai mécanique = Welding and allied processes. Assemblies made with soft solders and brazing filler metals. Mechanical test methods1985, 12 p.Report

Reflow of AuSn Solder Creates Strong JointsGOLOSKER, Ilya; FLORANDO, Jeffrey.Welding journal. 2013, Vol 92, Num 2, pp 48-59, issn 0043-2296, 12 p.Article

2009 Pb-Free SoldersKANG, Sung K; ANDERSON, Iver; HANDWERKER, Carol et al.Journal of electronic materials. 2009, Vol 38, Num 12, issn 0361-5235, 362 p.Conference Proceedings

No-fault-found and intermittent failures in electronic productsHAIYU QI; GANESAN, Sanka; PECHT, Michael et al.Microelectronics and reliability. 2008, Vol 48, Num 5, pp 663-674, issn 0026-2714, 12 p.Article

Wetting interaction between Pb-free Sn-Zn series solders and Cu, Ag substratesKWANG LUNG LIN; PEI CHI LIU; JENN MING SONG et al.Proceedings - Electronic Components Conference. 2004, issn 0569-5503, isbn 0-7803-8365-6, 2Vol, Vol 2, 1310-1313Conference Paper