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Results 1 to 25 of 16892

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High-speed microcontact printingHELMUTH, Jo A; SCHMID, Heinz; STUTZ, Richard et al.Journal of the American Chemical Society. 2006, Vol 128, Num 29, pp 9296-9297, issn 0002-7863, 2 p.Article

Recognition-directed orthogonal self-assembly of polymers and nanoparticles on patterned surfacesHAO XU; RUI HONG; TONGXIANG LU et al.Journal of the American Chemical Society. 2006, Vol 128, Num 10, pp 3162-3163, issn 0002-7863, 2 p.Article

Selective etching of n-InP(100) triggered at surface dislocations induced by nanoscratchingGASSILLOUD, R; MICHLER, J; BALLIF, C et al.Electrochimica acta. 2006, Vol 51, Num 11, pp 2182-2187, issn 0013-4686, 6 p.Conference Paper

In situ negative patterning of p-silicon via scanning probe lithography in HF/EtOH liquid bridgesKIM, Younghun; SUNG KOO KANG; CHOI, Inhee et al.Journal of the American Chemical Society. 2005, Vol 127, Num 26, pp 9380-9381, issn 0002-7863, 2 p.Article

Particle arrays with patterned pores by nanomachining with colloidal masksCHOI, Dae-Geun; KIM, Sarah; LEE, Eeunsug et al.Journal of the American Chemical Society. 2005, Vol 127, Num 6, pp 1636-1637, issn 0002-7863, 2 p.Article

Patterning phase separation in polymer films with dip-pen nanolithographyCOFFEY, David C; GINGER, David S.Journal of the American Chemical Society. 2005, Vol 127, Num 13, pp 4564-4565, issn 0002-7863, 2 p.Article

Resist-free patterning of surface architectures in polymer-based microanalytical devicesMCCARLEY, Robin L; VAIDYA, Bikas; SUYING WEI et al.Journal of the American Chemical Society. 2005, Vol 127, Num 3, pp 842-843, issn 0002-7863, 2 p.Article

Chemically patterned flat stamps for microcontact printingSHARPE, Ruben B. A; BURDINSKI, Dirk; HUSKENS, Jurriaan et al.Journal of the American Chemical Society. 2005, Vol 127, Num 29, pp 10344-10349, issn 0002-7863, 6 p.Article

Sub-30 nm lithography with near-field scanning optical microscope combined with femtosecond laserLIN, Y; HONG, M. H; WANG, W. J et al.Applied physics. A, Materials science & processing (Print). 2005, Vol 80, Num 3, pp 461-465, issn 0947-8396, 5 p.Article

Electro pen nanolithographyYUGUANG CAI; OCKO, Benjamin M.Journal of the American Chemical Society. 2005, Vol 127, Num 46, pp 16287-16291, issn 0002-7863, 5 p.Article

Microcontact printing of colloidal crystalsXIN YAN; JIMIN YAO; GUANG LU et al.Journal of the American Chemical Society. 2004, Vol 126, Num 34, pp 10510-10511, issn 0002-7863, 2 p.Article

A benchtop method for the fabrication and patterning of nanoscale structures on polymersHELT, James M; DRAIN, Charles M; BATTEAS, James D et al.Journal of the American Chemical Society. 2004, Vol 126, Num 2, pp 628-634, issn 0002-7863, 7 p.Article

Effect of mechanical properties of PVA brush rollers on frictional forces during post-CMP scrubbingPHILIPOSSIAN, Ara; MUSTAPHA, Lateef.Journal of the Electrochemical Society. 2004, Vol 151, Num 9, pp G632-G637, issn 0013-4651Article

Effect of selected ionic inorganic surface contaminants on thermal oxidation of p-type polished silicon wafersSCOTT, William D. S; STEVENSON, Alan.Journal of the Electrochemical Society. 2004, Vol 151, Num 1, pp G8-G12, issn 0013-4651Article

Effect of slurry flow rate on pad life during interlayer dielectric CMPPHILIPOSSIAN, Ara; OLSEN, Scott.Journal of the Electrochemical Society. 2004, Vol 151, Num 6, pp G436-G439, issn 0013-4651Article

Effect of slurry flow rate on tribological, thermal, and removal rate attributes of copper CMPLI, Z; BORUCKI, L; KOSHIYAMA, I et al.Journal of the Electrochemical Society. 2004, Vol 151, Num 7, pp G482-G487, issn 0013-4651Article

Effects of slurry particles on silicon dioxide CMPWONSEOP CHOI; ABIADE, Jeremiah; LEE, Seung-Mahn et al.Journal of the Electrochemical Society. 2004, Vol 151, Num 8, pp G512-G522, issn 0013-4651Article

Electrochemical behavior of copper in conductive peroxide solutionsEIN-ELI, Y; ABELEV, E; STAROSVETSKY, D et al.Journal of the Electrochemical Society. 2004, Vol 151, Num 4, pp G236-G240, issn 0013-4651Article

Electrochemical patterning of copper using microcontact printingLIM, Jong-Heun; KIM, Nam-Hoon; CHANG, Eui-Goo et al.Journal of the Electrochemical Society. 2004, Vol 151, Num 7, pp C455-C458, issn 0013-4651Article

Influence of chemical pretreatment of epoxy polymers on the adhesion strength of electrochemically deposited Cu for use in electronic interconnectionsSIAU, Sam; VERVAET, Alfons; SCHACHT, Etienne et al.Journal of the Electrochemical Society. 2004, Vol 151, Num 2, pp C133-C141, issn 0013-4651Article

Mechanical removal in CMP of copper using alumina abrasivesLIRONG GUO; SHANKAR SUBRAMANIAN, R.Journal of the Electrochemical Society. 2004, Vol 151, Num 2, pp G104-G108, issn 0013-4651Article

Mechanism of copper removal during CMP in acidic H2O2 slurryDU, T; TAMBOLI, D; DESAI, V et al.Journal of the Electrochemical Society. 2004, Vol 151, Num 4, pp G230-G235, issn 0013-4651Article

Site-specific fabrication of nanoscale heterostructures: Local chemical modification of GaN nanowires using electrochemical dip-pen nanolithographyMAYNOR, Benjamin W; JIANYE LI; CHENGUANG LU et al.Journal of the American Chemical Society. 2004, Vol 126, Num 20, pp 6409-6413, issn 0002-7863, 5 p.Article

The possibility of carbonyl fluoride as a new CVD chamber cleaning gasMITSUI, Yuki; OHIRA, Yutaka; YONEMURA, Taisuke et al.Journal of the Electrochemical Society. 2004, Vol 151, Num 5, pp G297-G301, issn 0013-4651Article

Chemical surface passivation of Ge nanowiresHANRATH, Tobias; KORGEL, Brian A.Journal of the American Chemical Society. 2004, Vol 126, Num 47, pp 15466-15472, issn 0002-7863, 7 p.Article

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