au.\*:("TANIDA, Kazumasa")
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High-performance vertical interconnection for high-density 3D chip stacking packageUMEMOTO, Mitsuo; TANIDA, Kazumasa; NEMOTO, Yoshihiko et al.Proceedings - Electronic Components Conference. 2004, issn 0569-5503, isbn 0-7803-8365-6, 2Vol, Vol 1, 616-623Conference Paper
Ultra-high-density interconnection technology of 3-dimensional packagingTAKAHASHI, Kenji; UMEMOTO, Mitsuo; TANIDA, Kazumasa et al.SPIE proceedings series. 2002, pp 354-359, isbn 0-930815-66-1, 6 p.Conference Paper