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GLOSSARY OF THICK FILM CIRCUIT TERMINOLOGYDRYDEN W.1981; INSUL., CIRCUITS; ISSN 0020-4544; USA; DA. 1981; VOL. 27; NO 3; PP. 31-32Article

THE LAYOUT OF LARGE HYBRIDS TO MAXIMIZE YIELDMYRVAAGNES B.1980; ELECTRON. PACKAG. PROD.; ISSN 0013-4945; USA; DA. 1980; VOL. 20; NO 10; PP. 77-80; 3 P.Article

THICK FILM AND HYBRID CIRCUITSBARNWELL PG.1980; NEW ELECTRON.; GBR; DA. 1980; VOL. 13; NO 11; PP. 90-93; (2 P.)Article

LOW COST SUBSTRATE FOR THICK FILM CIRCUITS USING PORCELAIN.1978; NEW ELECTRON.; G.B.; DA. 1978; PP. 36Article

HYBRID ICS MOVING INTO MASS PRODUCTION1982; JEE. JOURNAL OF ELECTRONIC ENGINEERING; ISSN 0385-4507; JPN; DA. 1982; VOL. 19; NO 190; PP. 44-48Article

PROZESSRECHNEREINSATZ BEI DER QUALITAETSPRUEFUNG VON DICKSCHICHTSCHALTUNGEN = CALCULATEUR DE PROCESSUS POUR LE CONTROLE DES PROCESSUS DE CIRCUITS A COUCHES EPAISSESDERTWINKEL W.1981; MESS. + PRUEF.; ISSN 0026-0339; DEU; DA. 1981; NO 4; PP. 194-200; 3 P.Article

MICRO-ELECTRONIC CIRCUIT DESIGN WITH INTEGRATED COMPONENTSSAHA AR.1980; J. INSTIT. ELECTRON. TELECOMMUNIC. ENGRS; IND; DA. 1980; VOL. 26; NO 2; PP. 129-134; BIBL. 25 REF.Article

KOSTENSENKUNG BEI DICKFILMSCHALTUNGEN = LA REDUCTION DU COUT DANS LES CIRCUITS A FILM EPAISKROENERT R.1978; ELEKTRONIK; DEU; DA. 1978; VOL. 27; NO 8; PP. 64-66; BIBL. 2 REF.Article

UNDERSTANDING THICK AND THIN FILM NETWORKSHART PJ.1980; NEW ELECTRON.; GBR; DA. 1980; VOL. 13; NO 11; PP. 104-106; (3 P.)Article

GE EXTENDS AUTOMATION OF THICK-FILM HYBRID PRODUCTION.GISLER HJ JR.1977; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1977; VOL. 17; NO 11; PP. 105-110 (4P.)Article

CUSTOM DESIGN OF THICK-FILM HYBRID ICS1982; JEE. JOURNAL OF ELECTRONIC ENGINEERING; ISSN 0385-4507; JPN; DA. 1982; VOL. 19; NO 190; PP. 40-43Article

SOME PROBLEMS AND POSSIBLE SOLUTIONS FOR HYBRID MICRO-CIRCUIT RELIABILITYSINNADURA FN; WILSON KJ; BRACE DWJ et al.1980; MICROELECTRON. J.; GBR; DA. 1980; VOL. 11; NO 1; PP. 26-36; BIBL. 12 REF.Article

STENCIL SCREENS FOR FINE-LINE PRINTINGSTALNECKER SG JR.1979; EUROPEAN HYBRID MICROELECTRONICS CONFERENCE. 2/1978/GHENT; NLD; PIJNACKER: DUTCH EFFICIENCY BUREAU; DA. 1979; PP. 507-516; BIBL. 3 REF.Conference Paper

HIGH-SPEED THICK FILM PRINTING ASSESSING THE CRITICAL VARIABLES.POLINSKY PW.1977; CIRCUITS MANUF.; U.S.A.; DA. 1977; VOL. 17; NO 10; PP. 26-30 (3P.)Article

HYBRID INTERCONNECTION OF I.C.'S BY MEANS OF PATTERNS ON FLEXIBLE TAPE.VAN DER DRIFT A; NICKL VAN NIKELSBERG KF.1977; ELECTROCOMPON. SCI. TECHNOL.; G.B.; DA. 1977; VOL. 4; NO 2; PP. 53-56; BIBL. 3 REF.Article

INDUSTRY'S THICK FILM NEEDS.EVANS D.1977; NEW ELECTRON.; G.B.; DA. 1977; VOL. 10; NO 8; PP. 42Article

THICK-FILM FINE PATTERN FORMATION BY A PHOTOLITHOGRAPHIC PROCESSWATANABE Y; ARITOMO A; WATANABE K et al.1979; I.E.E.E. TRANS. COMPON. HYBR. MANUFG TECHNOL.; USA; DA. 1979; VOL. 2; NO 4; PP. 428-433; BIBL. 5 REF.Article

THICK FILM CIRCUIT MODULES FOR C.R.T. DISPLAYSEASTWOOD S.1980; NEW ELECTRON.; GBR; DA. 1980; VOL. 13; NO 11; PP. 118-121; (2 P.)Article

PROCEEDINGS/BEA CON '82, (4TH ANNUAL CONFERENCE, MINNEAPOLIS MN, MARCH 30-31), 19821982; BEA CON '82. ANNUAL CONFERENCE. 4/1982-03-30/MINNEAPOLIS MN; USA; DES PLAINES: BYRON ELLIS ASSOCIATES; DA. 1982; PAG. MULT.; 28 CMConference Proceedings

THICK FILM PROCESSING FOR HIGHER YIELDS. III: LASER TRIMMINGFISHER JM; SCHMIDT HE.1982; INSUL., CIRCUITS; ISSN 0020-4544; USA; DA. 1982; VOL. 28; NO 11; PP. 107-110Article

COMPARISON OF ENAMELED STEEL SUBSTRATE PROPERTIES FOR THICK FILM USESTEIN SJ; HUANG G; GELB AS et al.1980; ELECTROCOMPON. SCI. TECHNOL.; ISSN 0305-3091; GBR; DA. 1980; VOL. 7; NO 1-3; PP. 55-62; BIBL. 11 REF.Article

STENCIL SCREENS FOR FINE-LINE PRINTINGSTALNECKER SG JR.1980; ELECTROCOMPON. SCI. TECHNOL.; ISSN 0305-3091; GBR; DA. 1980; VOL. 7; NO 1-3; PP. 47-53; BIBL. 3 REF.Article

EIN VERFAHREN FUER DEN RECHNERGESTUETZTEN ENTWURF DER TOPOLOGIE VON DICKSCHICHT-HYBRIDSCHALTUNGEN = METHODE D'ETUDE A L'AIDE D'ORDINATEUR POUR LA TOPOLOGIE DE CIRCUITS HYBRIDES EN COUCHE EPAISSEBURCKHARDT W; HENNIG D; HAGER H et al.1980; NACHRICHTENTECH., ELEKTRON.; ISSN 0323-4657; DDR; DA. 1980; VOL. 30; NO 9; PP. 359-360; ABS. RUS/ENG; BIBL. 7 REF.Article

CONSIDERATIONS FOR AUTOMATION IN THICK-FILM SCREENING.ATKINSON RW.1977; CIRCUITS MANUF.; U.S.A.; DA. 1977; VOL. 17; NO 4; PP. 18-26 (6P.)Article

USING THICK FILMS FOR MICROWAVE APPLICATIONS.FOSTER TM.1976; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1976; VOL. 16; NO 7; PP. 156-162 (6P.); BIBL. 2 REF.Article

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