Pascal and Francis Bibliographic Databases

Help

Search results

Your search

au.\*:("TOGASAKI, Takashi")

Results 1 to 5 of 5

  • Page / 1
Export

Selection :

  • and

High-density 3-D packaging technology based on the sidewall interconnection method and its application for CCD micro-camera visual inspection systemYAMADA, Hiroshi; TOGASAKI, Takashi; KIMURA, Masanobu et al.IEEE transactions on advanced packaging. 2003, Vol 26, Num 2, pp 113-121, issn 1521-3323, 9 p.Article

Advanced three-dimensional packaging technology for high-density CCD micro-camera system moduleYAMADA, Hiroshi; TOGASAKI, Takashi; TERUI, Takashi et al.SPIE proceedings series. 2000, pp 241-246, isbn 0-930815-62-9Conference Paper

High-density 3-D microsystem-in-package technology and its application for integrated CCD micro-camera visual inspection systemYAMADA, Hiroshi; TOGASAKI, Takashi; SADAMOTO, Atsushi et al.Proceedings - Electrochemical Society. 2004, pp 277-291, issn 0161-6374, isbn 1-56677-417-9, 15 p.Conference Paper

Process integration of fine pitch Cu redistribution wiring and SnCu micro-bumping for power efficient LSI devices with high-bandwidth stacked DRAMEZAWA, Hirokazu; TOGASAKI, Takashi; MIGITA, Tatsuo et al.Microelectronic engineering. 2013, Vol 103, pp 22-32, issn 0167-9317, 11 p.Article

GaAs MMICs using BCB thin film layers for automotive radar and wireless communication applicationISEKI, Yuji; TAKAGI, Eiji; HIGUCHI, Kazuhito et al.The International journal of microcircuits and electronic packaging. 2000, Vol 23, Num 2, pp 203-208, issn 1063-1674Article

  • Page / 1