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HERSTELLUNG DURCHKONTAKTIERTER LEITERPLATTEN FUER DEN ENTWICKLUNGSBEDARF. II. = FABRICATION DES CIRCUITS IMPRIMES A INTERCONNEXIONS POUR LES BESOINS DU DEVELOPPEMENTSCHUTT J.1978; FEINGERAETETECHNIK; DEU; DA. 1978; VOL. 27; NO 1; PP. 25-27; ABS. ENG/FRE/GER/RUSArticle

HERSTELLUNG DURCHKONTAKTIERTER LEITERPLATTEN FUER DEN ENTWICKLUNGSBEDARF. = FABRICATION DE CIRCUITS IMPRIMES A TROUS METALLISES POUR REPONDRE A L'ACCROISSEMENT DE LA DEMANDESCHUTT J.1977; FEINGERAETETECHNIK; DTSCH.; DA. 1977; VOL. 26; NO 12; PP. 541-544; ABS. ANGL. FR.; BIBL. 5 REF.Article

THIN COPPER/TIN PTH TECHNOLOGY: ALTERNATIVE PROCESS REDUCES COST, IMPROVES QUALITYKING TE.1979; CIRCUITS MANUF.; USA; DA. 1979; VOL. 19; NO 1; PP. 28-30; (2 P.)Article

THE CASE FOR UNFILLED PTHS.KELLER JD; WASZCZAK JL.1973; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1973; VOL. 13; NO 10; PP. 144-149; BIBL. 2 REF.Article

UNSOLDERING P.C.B.S. WITHOUT DAMAGESCARLETT JA.1980; ELECTRON. + POWER; ISSN 0013-5127; GBR; DA. 1980; VOL. 26; NO 9; PP. 715-718; BIBL. 4 REF.Article

PLATED THROUGH HOLE STRENGTH AS RELATED TO ANNULAR RINGSFROUSER JR; KALMUS CE.1979; INSULAT. CIRCUITS; USA; DA. 1979; VOL. 25; NO 8; PP. 46-47Article

LE CIRCUIT IMPRIME A TROUS METALLISESAUBRY M; BARBIER J.1973; TOUTE ELECTRON.; FR.; DA. 1973; NO 375; PP. 29-32Serial Issue

RECOGNIZING PTH FAILURE MODESGRABBE DG.1972; ELEKTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1972; VOL. 12; NO 10; PP. 160-166 (5 P.)Serial Issue

HOLE WALL PULLAWAY: A STUDYRAU TA.1978; PLATING IN THE ELECTRONICS INDUSTRY SYMPOSIUM. 7/1979/SAN FRANCISCO CA; USA; WINTER PARK: AMERICAN ELECTROPLATERS' SOCIETY; DA. 1978; PP. 1-3Conference Paper

THE DEVELOPMENT OF ADDITIVE PROCESSING TECHNIQUES TO RESOLVE END USER AND IN PLANT PROBLEMS.HIBBS TJ.1976; IN: INT. ELECTRON. PACKAG. PROD. CONF. PROC. TECH. PROGRAMME; BRIGHTON, ENGL.; 1976; SURBITON; KIVER COMMUNICATIONS; DA. 1976; PP. 4-10Conference Paper

PLATING.1978; CIRCUITS MANUF.; U.S.A.; DA. 1978; VOL. 18; NO 1; PP. 6-17 (8P.)Article

REDUCING WATER AND CHEMICAL CONSUMPTION IN PC ELECTROPLATINGBEYER GH.1982; INSUL., CIRCUITS; ISSN 0020-4544; USA; DA. 1982; VOL. 28; NO 3; PP. 29-31Article

VAPOR PHASE REFLOW SOLDERING OF BACKPLANES AND MOTHER BOARDS WITH WIRE-WRAPPED PINS AND CONNECTORS1981; INSUL., CIRCUITS; ISSN 0020-4544; USA; DA. 1981; VOL. 27; NO 1; PP. 48-49Article

THIN COPPER TECHNOLOGY FOR PLATED THROUGH HOLE MANUFACTUREKING TE.1979; INSULAT. CIRCUITS; USA; DA. 1979; VOL. 25; NO 6; PP. 39-40Article

RELIABILITY OF COPPER-PLATED-THROUGH-HOLE PRINTED WIRING BOARD.KOBUNA H; SATO T; NOGUSHI S et al.1976; N.E.C. RES. DEVELOP.; JAP.; DA. 1976; NO 41; PP. 38-49; BIBL. 12 REF.Article

EVALUATION OF DIE PERFORATED HOLES FOR SINGLE AND DOUBLE-SIDED PCB'S.GOLONSBE EE.1976; INSULAT. CIRCUITS; U.S.A.; DA. 1976; VOL. 22; NO 13; PP. 13-14Article

MICROSECTION EVALUATION OF PLATED THROUGH-HOLE BOARDSSTROHMER J.1982; INSUL., CIRCUITS; ISSN 0020-4544; USA; DA. 1982; VOL. 28; NO 10; PP. 39Article

SWAGING OF TERMINALS AND INTERCONNECTING PINS ON WIRING BOARDSMANSOORI N.1979; INSULAT. CIRCUITS; USA; DA. 1979; VOL. 25; NO 2; PP. 25-27; BIBL. 1 REF.Article

UNE NOUVELLE TECHNIQUE DE MONTAGE ET D'INTERCONNEXION DE COMPOSANTS: CIRCUITERIE DOUBLE FACE SUR FILM POLYIMIDEMONNIER M.1978; ACTA ELECTRON.; FRA; DA. 1978 PUBL. 1979; VOL. 21; NO 4; PP. 333-341; ABS. ENG/GER; BIBL. 17 REF.Article

AN ECONOMIC AND FUNCTIONAL COMPARISON OF RIGID, DOUBLE-SIDED PCB'S.SARNOWSKI TJ; DENNIS BROWNE JF.1977; INSULAT. CIRCUITS; U.S.A.; DA. 1977; VOL. 23; NO 13; PP. 15-20Article

MICRORESISTANCE MEASUREMENTS PROVIDE ACCURATE EVALUATION OF PLATED-THROUGH HOLE QUALITY.WEINSTOCK JJ.1976; INSULAT. CIRCUITS; U.S.A.; DA. 1976; VOL. 22; NO 12; PP. 37-40Article

IMPURITIES IN SOLDER: HOW THEY INFLUENCE SOLDERABILITY AND STRENGTH OF PCB PLATED THROUGH-HOLESBECKER G.1982; INSUL., CIRCUITS; ISSN 0020-4544; USA; DA. 1982; VOL. 28; NO 3; PP. 49-52Article

THE TOPSIDE PTH SOLDER FILLETGADZINSKI E.1979; CIRCUITS MANUF.; USA; DA. 1979; VOL. 19; NO 11; PP. 68-116; (2 P.)Article

MEASURING PCB PLATING THICKNESSBUSH G.1980; CIRCUITS MANUF.; USA; DA. 1980; VOL. 20; NO 3; PP. 76-82; (4 P.)Article

FLUXLESS FUSION OF TIN-LEAD PLATED PRINTED CIRCUIT BOARDS VIA VAPOR PHASE PROCESS1981; INSUL., CIRCUITS; ISSN 0020-4544; USA; DA. 1981; VOL. 27; NO 5; PP. 19-20Article

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