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Anodic bonding of glass and silicon wafers with an intermediate silicon nitride film and its application to batch fabrication of SPM tip arraysHSIEH, Gen-Wen; TSAI, Ching-Hsiang; LIN, Wei-Chih et al.Microelectronics journal. 2005, Vol 36, Num 7, pp 678-682, issn 0959-8324, 5 p.Conference Paper
