kw.\*:("Ta-W-N")
Results 1 to 1 of 1
Selection :
Diffusion barrier performance of reactively sputtered Ta-W-N between Cu and SiYUZHANG LIU; SHUANGXI SONG; DALI MAO et al.Microelectronic engineering. 2004, Vol 75, Num 3, pp 309-315, issn 0167-9317, 7 p.Article
