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An optimal guarding scheme for thermal conductivity measurement using a guarded cut-bar technique, part 1 experimental studyCHANGHU XING; JENSEN, Colby; FOLSOM, Charles et al.Applied thermal engineering. 2014, Vol 62, Num 2, pp 850-857, issn 1359-4311, 8 p.Article

Reduced thermal conductivity in Pb-alloyed AgSbTe2 thermoelectric materialsWU, Hsin-Jay; CHEN, Sinn-Wen; IKEDA, Teruyuki et al.Acta materialia. 2012, Vol 60, Num 17, pp 6144-6151, issn 1359-6454, 8 p.Article

Particularités de la conductivité thermique du réseau des chalcogénures de plomb PbTe, PbSe, PbSALEKSEEVA, G. T; KRYLOV, E. T.Fizika tverdogo tela. 1983, Vol 25, Num 12, pp 3713-3716, issn 0367-3294Article

A numerical study on the theoretical accuracy of film thermal conductivity using transient plane source methodHU ZHANG; LI, Ming-Jia; FANG, Wen-Zhen et al.Applied thermal engineering. 2014, Vol 72, Num 1, pp 62-69, issn 1359-4311, 8 p.Conference Paper

Fabrication and thermal analysis of a copper/diamond/copper thermal spreading deviceYOUNG, Tai-Fa.Surface & coatings technology. 2007, Vol 202, Num 4-7, pp 1208-1213, issn 0257-8972, 6 p.Conference Paper

Architecting boron nanostructure on the diamond particle surfaceBAI, H; DAI, D; YU, J. H et al.Applied surface science. 2014, Vol 292, pp 790-794, issn 0169-4332, 5 p.Article

Influence of typical defects on thermal conductivity of graphene nanoribbons: An equilibrium molecular dynamics simulationDONG YANG; FEI MA; YUNJIN SUN et al.Applied surface science. 2012, Vol 258, Num 24, pp 9926-9931, issn 0169-4332, 6 p.Article

High-throughput thermal conductivity measurements of nickel solid solutions and the applicability of the Wiedemann-Franz lawZHENG, X; CAHILL, D. G; KRASNOCHTCHEKOV, P et al.Acta materialia. 2007, Vol 55, Num 15, pp 5177-5185, issn 1359-6454, 9 p.Article

Enhanced thermal conductivity of nanofluids: a state-of-the-art reviewÖZERINC, Sezer; KAKAC, Sadik; GÜVENC YAZICIOGLU, Almila et al.Microfluidics and nanofluidics (Print). 2010, Vol 8, Num 2, pp 145-170, issn 1613-4982, 26 p.Article

Lattice thermal conductivity of layered-structure compoundsKUMAR, A; ANSARI, M. A; SRIVASTAVA, B. K et al.Physical review. B, Condensed matter. 1985, Vol 31, Num 8, pp 5509-5512, issn 0163-1829Article

Predicting the effective thermal conductivity of unfrozen, porous foodsCARSON, James K; LOVATT, Simon J; TANNER, David J et al.Journal of food engineering. 2006, Vol 75, Num 3, pp 297-307, issn 0260-8774, 11 p.Article

An application of non-commutative complementary variational principles to the calculation of phonon thermal conductivityMIKHAIL, I. F. I.Journal of physics. C. Solid state physics. 1985, Vol 18, Num 31, pp 5801-5813, issn 0022-3719Article

Recent developments in bulk thermoelectric materialsNOLAS, George S; POON, Joe; KANATZIDIS, Mercouri et al.MRS bulletin. 2006, Vol 31, Num 3, pp 199-205, issn 0883-7694, 7 p.Article

Size dependent thermal conductivity in nano-systemsGYÖRY, Erika; MARKUS, Ferenc.Thin solid films. 2014, Vol 565, pp 89-93, issn 0040-6090, 5 p.Article

Estimation variationnelle des valeurs effectives du tenseur de conductance généralisée d'un milieu à deux phases avec distribution anisotrope des phasesKAZANTSEV, V. P.Inženerno-fizičeskij žurnal. 1983, Vol 45, Num 3, pp 480-487, issn 0021-0285Article

Effects of thermal efficiency in DCMD and the preparation of membranes with low thermal conductivityZHEHAO LI; YUELIAN PENG; YAJUN DONG et al.Applied surface science. 2014, Vol 317, pp 338-349, issn 0169-4332, 12 p.Article

High thermal conductive diamond/Cu-Ti composites fabricated by pressureless sintering techniqueCHUNG, Chih-Yu; LEE, Mu-Tse; TSAI, Min-Yen et al.Applied thermal engineering. 2014, Vol 69, Num 1-2, pp 208-213, issn 1359-4311, 6 p.Article

Glass-like thermal conductivities in (La1―x1Yx1)2(Zr1―x2Yx2)2O7―x2 (x = x1 + x2, 0 ≤ x ≤ 1.0) solid solutionsYANFEI WANG; FAN YANG; PING XIAO et al.Acta materialia. 2012, Vol 60, Num 20, pp 7024-7033, issn 1359-6454, 10 p.Article

Thermal conductivity of electron-doped CaMnO3 perovskites: Local lattice distortions and optical phonon thermal excitationYANG WANG; YU SUI; XIANJIE WANG et al.Acta materialia. 2010, Vol 58, Num 19, pp 6306-6316, issn 1359-6454, 11 p.Article

Thermal conductivity measurements of pitch-bonded graphites at millikelvin temperatures: Finding a replacement for AGOT graphiteWOODCRAFT, Adam L; BARUCCI, Marco; HASTINGS, Peter R et al.Cryogenics (Guildford). 2009, Vol 49, Num 5, pp 159-164, issn 0011-2275, 6 p.Article

Thermal design and performance of the SCUBA-2 instrument 1-K and mK systemsWOODCRAFT, Adam L; HOLLISTER, Matthew I; BINTLEY, Dan et al.Cryogenics (Guildford). 2009, Vol 49, Num 9, pp 504-513, issn 0011-2275, 10 p.Article

Very low temperature thermal conductivity of Kevlar 49VENTURA, G; MARTELLI, V.Cryogenics (Guildford). 2009, Vol 49, Num 7, pp 376-377, issn 0011-2275, 2 p.Article

Thermal conductivity of Kevlar 49 between 7 and 290 KVENTURA, G; MARTELLI, V.Cryogenics (Guildford). 2009, Vol 49, Num 12, pp 735-737, issn 0011-2275, 3 p.Article

CALCULATION OF THE BRT FUNCTION WITH A PROGRAMMABLE POCKET CALCULATORFAGALY RL.1980; CRYOGENICS (SURREY); ISSN 0011-2275; GBR; DA. 1980; VOL. 20; NO 11; PP. 644; BIBL. 9 REF.Article

Electron doping and phonon scattering in Ti1+xS2 thermoelectric compoundsBEAUMALE, M; BARBIER, T; BREARD, Y et al.Acta materialia. 2014, Vol 78, pp 86-92, issn 1359-6454, 7 p.Article

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