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International Workshop on Thermal Investigations of ICs and Systems. THERMINIC'04RENCZ, Marta.Microelectronics journal. 2006, Vol 37, Num 11, pp 1148-1185, issn 0959-8324, 37 p.Conference Paper

Development of a process friendly film for high performance thermal management applicationsCOLLINSAND, Andrew; CHENG, Chih-Min.SPIE proceedings series. 2003, pp 523-528, isbn 0-8194-5189-4, 6 p.Conference Paper

On-chip thermal engineeringSHAKOURI, Ali; KANG, Sung-Mo; BAR-COHEN, Avram et al.Proceedings of the IEEE. 2006, Vol 94, Num 8, issn 0018-9219, 168 p.Serial Issue

2005 Workshop on Thermal Investigations of ICs and Systems (THERMINIC)RENCZ, Marta.Microelectronics journal. 2007, Vol 38, Num 2, pp 151-196, issn 0959-8324, 45 p.Conference Paper

Thermal Challenges in Next Generation Electronic Systems (THERMES II 2007)GARIMELLA, Suresh V; FLEISCHER, Amy S.Microelectronics journal. 2008, Vol 39, Num 7, issn 0959-8324, 102 p.Conference Proceedings

Flexible thermal management circuits bonded directly to aluminum heat sinksFRAIVILLIG, Jim.SPIE proceedings series. 2003, pp 797-800, isbn 0-8194-5189-4, 4 p.Conference Paper

Balance of power dynamic thermal management for Internet data centersSHARMA, Ratnesh K; BASH, Cullen E; PATEL, Chandrakant D et al.IEEE internet computing. 2005, Vol 9, Num 1, pp 42-49, issn 1089-7801, 8 p.Article

AlSiC for optoelectronic thermal management and packaging designsOCCHIONERO, Mark A; ADAMS, Richard W; SAUMS, Dave et al.SPIE proceedings series. 2003, pp 495-499, isbn 0-8194-5189-4, 5 p.Conference Paper

Remote heat sink with temperature control using a miniaturized loop heat pipeKHRUSTALEV, Dmitry K.SPIE proceedings series. 2003, pp 529-533, isbn 0-8194-5189-4, 5 p.Conference Paper

Hot-spot self-cooling effects on two-phase flow of R245fa in 85 μm-wide multi-microchannelsCOSTA-PATRY, E; OLIVIET, J; PAREDES, S et al.International workshop on thermal investigations of ICs and systems. 2010, pp 276-281, isbn 978-2-35500-012-6, 1Vol, 6 p.Conference Paper

Multi-Physics Analysis of a Photovoltaic Panel with a Heat Recovery SystemMAFFEZZONI, P; CODECASA, L; D'AMORE, D et al.International workshop on thermal investigation of ICs and systems. 2008, pp 93-96, isbn 978-2-35500-008-9, 1Vol, 4 p.Conference Paper

CICMT 2007Journal of microelectronics and electronic packaging. 2007, Vol 4, Num 4, pp 167-185, issn 1551-4897, 18 p.Conference Paper

Laminar Confined Impinging Slot Jets with Nanofluids on Heated SurfacesDI LORENZO, Giuseppe; MANCA, Oronzio; NARDINI, Sergio et al.International workshop on THERMal INvestigations of ICs and Systems. 2011, pp 183-188, isbn 978-2-355-00018-8, 1Vol, 6 p.Conference Paper

Caloducs plats en silicium pour composants électroniques = Flat silicon heat-pipes for electronic componentsAVENAS, Yvan; GILLOT, Charlotte; SCHAEFFER, Christian et al.Techniques de l'ingénieur. Electronique. 2004, Vol E1, Num RE16, issn 0399-4120, RE16.1-RE16.7Article

Impact of heat spreading lids on flip chip thermal performance; with and without heat sinkWAKIL, Jamil.SPIE proceedings series. 2003, pp 500-504, isbn 0-8194-5189-4, 5 p.Conference Paper

A tenfold reduction in interface thermal resistance for heat sink mountingVAN HEERDEN, D; KNIO, O. M; WEIHS, T. P et al.SPIE proceedings series. 2003, pp 316-321, isbn 0-8194-5189-4, 6 p.Conference Paper

Hybrid approach to thermal management of a FET power amplifierPRYPUTNIEWICZ, Ryszard J; ROSATO, David; FURLONG, Cosme et al.SPIE proceedings series. 2003, pp 841-846, isbn 0-8194-5189-4, 6 p.Conference Paper

LTCC substrates with internal cooling channel and heat exchangerZAMPINO, Marc A; ADLURU, Hari; YANQING LIU et al.SPIE proceedings series. 2003, pp 505-510, isbn 0-8194-5189-4, 6 p.Conference Paper

Manufacturing and evaluation of thermal expansion behavior of discontinuous pitch graphite fiber reinforced copper alloys for CTE matching heat sink applicationsCORNIE, James A; ZHANG, Shiyu.SPIE proceedings series. 2003, pp 310-315, isbn 0-8194-5189-4, 6 p.Conference Paper

Fluxonics and Superconducting Electronics in Europe : Recent progress in superconductive digital electronicsROGALLA, Horst.IEICE transactions on electronics. 2008, Vol 91, Num 3, pp 272-279, issn 0916-8524, 8 p.Article

A passive solution to a difficult data center environmental problemWANG, David.InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems. 2004, isbn 0-7803-8357-5, Vol1, 586-592Conference Paper

An aberration control of projection optics for multi-patterning lithographyOHMURA, Yasuhiro; OGATA, Taro; HIRAYAMA, Toru et al.Proceedings of SPIE, the International Society for Optical Engineering. 2011, Vol 7973, issn 0277-786X, isbn 978-0-8194-8532-8, 79730W.1-79730W.11, 2Conference Paper

Microscale heat transfer techniques for heat sinks and compact heat exchangersBAELMANS, Martine.International workshop on thermal investigations of ICs and systems. 2010, isbn 978-2-35500-012-6, 1Vol, p. 139Conference Paper

Recent Progress of Thermal Interface Material Research - An OverviewLIU, Johan; MICHEL, Bruno; RENCZ, Marta et al.International workshop on thermal investigation of ICs and systems. 2008, pp 156-162, isbn 978-2-35500-008-9, 1Vol, 7 p.Conference Paper

Investigation of increased performance of close series stacked tube axial fans due to inclusion of diffuser elementJILESEN, J; LIEN, F. S; AHN, H et al.Microelectronics and reliability. 2006, Vol 46, Num 5-6, pp 984-993, issn 0026-2714, 10 p.Article

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