Thick film composition reproducibility and its impact on yieldsWILSON, K. M; RESUTEK, J. L.Solid state technology. 1982, Vol 25, Num 3, pp 115-118, issn 0038-111XArticle

THICK FILM MICROELECTRONIC CIRCUITS1980; NEW ELECTRON.; GBR; DA. 1980; VOL. 13; NO 11; PP. 99-103; (3 P.)Article

FACILITIES, EQUIPMENT, AND MANUFACTURING OPERATIONS FOR CIRCUIT DEPOSITION AND TESTING.COTE RE.1975; SOLID STATE TECHNOL.; U.S.A.; DA. 1975; VOL. 18; NO 1; PP. 49-52Article

Experiences in obtaining cross belt uniformity of ±1°C in a 24 inch wide thick film conveyor furnaceDIMOCK, Fred.SPIE proceedings series. 2002, pp 860-863, isbn 0-930815-66-1, 4 p.Conference Paper

Processing polymer thick film circuitry with radiation curingGREEN, W. J.Journal of radiation curing. 1983, Vol 10, Num 2, pp 4-7, issn 0361-6428Article

Thermal conductivity of thermoelectric thick films prepared by electrodepositionCHIEN, Heng-Chieh; YANG, Chii-Rong; LIAO, Li-Ling et al.Applied thermal engineering. 2013, Vol 51, Num 1-2, pp 75-83, issn 1359-4311, 9 p.Article

LIFE-SAVING RESISTOR TRIMMING.LACOURTE N.1978; SOLID STATE TECHNOL.; U.S.A.; DA. 1978; VOL. 20; NO 10; PP. 76-77 (2P.)Article

HIGH PERFORMANCE THICK FILM SYSTEM.SPROULL JF; BACHER RJ.1977; CIRCUITS MANUF.; U.S.A.; DA. 1977; VOL. 17; NO 11; PP. 14-20 (4P.)Article

A CASE FOR COPPER THICK-FILM PASTE.GRIER JD.1977; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1977; VOL. 17; NO 6; PP. 58-61; BIBL. 1 REF.Article

AN INTEGRATED APPROACH FOR THICK-FILM TECHNOLOGYSARMA GH.1980; J. INSTIT. ELECTRON. TELECOMMUNIC. ENGRS; IND; DA. 1980; VOL. 26; NO 2; PP. 136Article

AN INTRODUCTION TO THE NAVY MANUFACTURING TECHNOLOGY PROGRAM FOR COMPUTERIZED THICK-FILM PRINTINGZARNOW DF.1980; I.E.E.E. TRANS. COMPON. HYBR. MANUFG TECHNOL.; USA; DA. 1980; VOL. 3; NO 3; PP. 315-327; BIBL. 4 REF.Article

THICK FILM PROCESS CONTROL. FACTORIAL ANALYSIS DURING PRODUCTIONJOHNSTON PA.1979; CIRCUITS MANUF.; USA; DA. 1979; VOL. 19; NO 3; PP. 42-44; BIBL. 2 REF.Article

THICK FILM HYBRID MICROCIRCUITS - GENERAL APPLICATIONS.WHITELAW D.1976; MICROELECTRON. AND RELIABIL.; G.B.; DA. 1976; VOL. 15; NO 4; PP. 335-338; (SEMICOND. TECHNOL. 1976. ANNU. SEMINEX TECH. SEMIN. EXHIB.; LONDON; 1976)Conference Paper

COMPARISON OF ENAMELED STEEL SUBSTRATE PROPERTIES FOR THICK FILM USESTEIN SJ; HUANG G; GELB AS et al.1980; ELECTROCOMPON. SCI. TECHNOL.; ISSN 0305-3091; GBR; DA. 1980; VOL. 7; NO 1-3; PP. 55-62; BIBL. 11 REF.Article

PERFORMANCE OF THICK FILM MATERIALS ON 96% ALUMINA SUBSTRATES. IIWOOD DC.1980; INSUL., CIRCUITS; ISSN 0020-4544; USA; DA. 1980; VOL. 26; NO 8; PP. 23-27; BIBL. 6 REF.Article

STENCIL SCREENS FOR FINE-LINE PRINTINGSTALNECKER SG JR.1980; ELECTROCOMPON. SCI. TECHNOL.; ISSN 0305-3091; GBR; DA. 1980; VOL. 7; NO 1-3; PP. 47-53; BIBL. 3 REF.Article

CONSIDERATIONS FOR AUTOMATION IN THICK-FILM SCREENING.ATKINSON RW.1977; CIRCUITS MANUF.; U.S.A.; DA. 1977; VOL. 17; NO 4; PP. 18-26 (6P.)Article

USING THICK FILMS FOR MICROWAVE APPLICATIONS.FOSTER TM.1976; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1976; VOL. 16; NO 7; PP. 156-162 (6P.); BIBL. 2 REF.Article

PRECISION FINENESS OF GRIND MEASUREMENT, TECHNIQUES AND INSTRUMENTATION, FOR THICK FILM PASTESANJARD RP SR.1983; MICROELECTRONICS AND RELIABILITY; ISSN 0026-2714; GBR; DA. 1983; VOL. 23; NO 2; PP. 319-329Article

Development of a dimethyl ether (DME) sensor using platinum nanoparticles and thick-film printingPHOTINON, Kanokorn; WANG, Shih-Han; CHUNG CHIUN LIU et al.Biosensors & bioelectronics. 2006, Vol 22, Num 4, pp 501-505, issn 0956-5663, 5 p.Conference Paper

The characterization of thick-film resistors on dielectric-on-steel substrates for strain gauge applicationsHROVAT, Marko; BELAVIC, Darko; BENCAN, Andreja et al.Sensors and materials. 2003, Vol 15, Num 5, pp 247-257, issn 0914-4935, 11 p.Article

Measurement of film thickness up to several hundreds of nanometers using optical waveguide lightmode spectroscopyPICART, Catherine; GERGELY, Csilla; ARNTZ, Youri et al.Biosensors & bioelectronics. 2004, Vol 20, Num 3, pp 553-561, issn 0956-5663, 9 p.Article

Low-frequency noise in thick-film structures caused by traps in glass barriersMRAK, I; JEVTIC, M; STANIMIROVIC, Z et al.International conference on microelectronic. 1997, pp 413-416, isbn 0-7803-3664-X, 2VolConference Paper

Entwurf und Realiserung eines Dickschichtschaltkreises mit AOW-Optimalfilter = Calcul et réalisation d'un circuit à couche épaisse avec un filtre optimal à ondes acoustiques de surface = Design and realisation of a thick film circuit with SAW optimum filterRÜCKRIEMEN, J; THOMÄ, R; THUST, H et al.Nachrichtentechnik. Elektronik. 1984, Vol 34, Num 1, pp 7-10, issn 0323-4657Article

Anode properties of Ru-coated Si thick film electrodes prepared by gas-depositionUSUI, Hiroyuki; KASHIWA, Yuta; IIDA, Takahisa et al.Journal of power sources (Print). 2010, Vol 195, Num 11, pp 3649-3654, issn 0378-7753, 6 p.Article