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Low thermal conductivity superconducting metallized Mylar leadsHAYS, K. M; RUTLEDGE, J. E; SELLERS, G. J et al.Review of scientific instruments. 1984, Vol 55, Num 10, pp 1660-1662, issn 0034-6748Article

Effect of strain rate on fatigue of low-tin lead-base solderVAYNMAN, S.IEEE transactions on components, hybrids, and manufacturing technology. 1989, Vol 12, Num 4, pp 469-472, issn 0148-6411Conference Paper

Phenomena at the interface between positive active material and lead-calcium-in gridsTAKAHASHI, K; HOSHIHARA, N; YASUDA, H et al.Journal of power sources. 1990, Vol 30, Num 1-4, pp 23-31, issn 0378-7753Conference Paper

Superplastic creep of low melting point solder jointsMEI, Z; MORRIS, J. W.Journal of electronic materials. 1992, Vol 21, Num 4, pp 401-407, issn 0361-5235Article

Rheological behaviour and modelling of semi-solid Sn-15 % Pb alloyTURNG, L. S; WANG, K. K.Journal of materials science. 1991, Vol 26, Num 8, pp 2173-2183, issn 0022-2461, 11 p.Article

Frictional properties of a surface covered with soft metal film (interference effect of soft metal film deformation between two protuberances)KATO, S; MARUI, E; TACHI, K et al.Journal of tribology. 1985, Vol 107, Num 4, pp 444-451, issn 0742-4787Article

Composition and microstructure of medieval bells = Zusammensetzung und Gefüge mitellalterlicher GlockenAUDY, J; CECH, J; BENO, J et al.Praktische Metallographie. 1992, Vol 29, Num 2, pp 74-84, issn 0032-678XArticle

Effects of simplified enthalpy relations on the prediction of heat transfer during solidification of a lead-tin alloySCHNEIDER, M. C; BECKERMANN, C.Applied mathematical modelling. 1991, Vol 15, Num 11-12, pp 596-605, issn 0307-904XArticle

Electrolyte pour l'obtention d'un revêtement galvanique brillant en alliage étain-plombGRACHEV, V. N; KADOSOV, B. D.Èlektrohimiâ. 1988, Vol 24, Num 10, pp 1394-1396, issn 0424-8570Article

Pb-Sn solder for die bonding of silicon chipsINOUE, H; HURIHARA, Y; HACHINO, H et al.IEEE transactions on components, hybrids, and manufacturing technology. 1986, Vol 9, Num 2, pp 190-194, issn 0148-6411Article

Effect of temperature on isothermal fatigue of soldersVAYNMAN, S.IEEE transactions on components, hybrids, and manufacturing technology. 1990, Vol 13, Num 4, pp 909-913, issn 0148-6411Conference Paper

Electrical and mechanical properties of lead/tin solders and splices for superconducting cablesFAST, R. W; CRADDOCK, W. W; KOBAYASHI, M et al.Cryogenics (Guildford). 1988, Vol 28, Num 1, pp 7-9, issn 0011-2275Article

Electroplated solder joints for flip-chip applicationsYUNG, E. K; TURLIK, I.IEEE transactions on components, hybrids, and manufacturing technology. 1991, Vol 14, Num 3, pp 549-559, issn 0148-6411Conference Paper

Abrasive wear of bearing materials. A comparison of test methodsBEGELINGER, A; DE GEE, A. W. J.Wear. 1985, Vol 101, Num 2, pp 141-154, issn 0043-1648Article

THE INFLUENCE OF SOLDER-FILLING ON THE AC LOSSES OF PULSED SUPERCONDUCTING CABLESTATEISHI H; ONISHI T; KOMURO K et al.1982; CRYOGENICS (SURREY); ISSN 0011-2275; GBR; DA. 1982; VOL. 22; NO 10; PP. 509-517; BIBL. 15 REF.Article

CRYSTALLOGRAPHIC ORIENTATION RELATIONSHIPS IN THE TIN-LEAD-CADMIUM TERNARY EUTECTICGREGORY LG; DUNNE DP; DELAMORE GW et al.1982; JOURNAL OF MATERIALS SCIENCE; ISSN 0022-2461; GBR; DA. 1982; VOL. 18; NO 1; PP. 51-56; BIBL. 9 REF.Article

THE MELT GROWTH OF SEMICIRCULAR CRYSTALS OF THE PURE PB AND ITS DILUTE ALLOYSHAYASHI S; FUKUI M; KOMATSU H et al.1983; CRYSTAL RESEARCH AND TECHNOLOGY (1979); ISSN 0232-1300; DDR; DA. 1983; VOL. 18; NO 3; PP. K38-K42; BIBL. 4 REF.Article

A three-dimensionally interconnected metal-spring network in a silicone matrix as a resilient and electrically conducting composite materialMINGGUANG ZHU; CHUNG, D. D. L.Composites. 1992, Vol 23, Num 5, pp 355-363, issn 0010-4361Article

Directional soldification of Sn-Pb eutectic : dynamics of local lamellar spacing selectionJUN-MING LIU; ZHI-GUO LIU; ZHUANG-CHUN WU et al.Scripta metallurgica et materialia. 1992, Vol 27, Num 9, pp 1223-1228, issn 0956-716XArticle

Electrodeposition of bright tin-bismuth and tin-lead alloy coatingsPOPOV, A. N; TYUTINA, K. M; KUDRYAVTSEV, V. N et al.Soviet electrochemistry. 1992, Vol 28, Num 8, pp 957-961, issn 0038-5387Article

Untersuchungen zum Notlaufverhalten von Radial-Gleitlagern = Etude du comportement en régime critique d'un palier de glissement radial = Investigations into the antifriction performance of radial sliding bearingsBÖHME, V.Schmierungstechnik. 1985, Vol 16, Num 12, pp 367-369, issn 0036-6226Article

The effect of lubrication on fretting corrosion at dissimilar metal interfaces in socketed IC device applicationsMOTTINE, J. J; REAGOR, B. T.IEEE transactions on components, hybrids, and manufacturing technology. 1985, Vol 8, Num 1, pp 173-181, issn 0148-6411Article

Evaluation of the interelemental effect in X-ray fluorescence analysis by the total addition method : application to binary samples : determination of tin in Sn-Pn alloysREIG, F. B; MARTINEZ, V. P; MOSSI, F. B et al.Fresenius' journal of analytical chemistry. 1992, Vol 342, Num 4-5, pp 295-298, issn 0937-0633Article

Axi-symmetric compression of solid cylinders. I: Slow loading conditionsSINGH, A. P; PADMANAGHAN, K. A.Journal of materials science. 1991, Vol 26, Num 20, pp 5481-5487, issn 0022-2461Article