Pascal and Francis Bibliographic Databases

Help

Search results

Your search

kw.\*:("Tin addition")

Document Type [dt]

A-Z Z-A Frequency ↓ Frequency ↑
Export in CSV

Publication Year[py]

A-Z Z-A Frequency ↓ Frequency ↑
Export in CSV

Discipline (document) [di]

A-Z Z-A Frequency ↓ Frequency ↑
Export in CSV

Language

A-Z Z-A Frequency ↓ Frequency ↑
Export in CSV

Author Country

A-Z Z-A Frequency ↓ Frequency ↑
Export in CSV

Origin

A-Z Z-A Frequency ↓ Frequency ↑
Export in CSV

Results 1 to 25 of 2045

  • Page / 82
Export

Selection :

  • and

Effect of Substrate Composition on Sn Whisker Growth in Pure Sn FilmsMILLER, Sarah M; SAHAYM, Uttara; NORTON, M. Grant et al.Metallurgical and materials transactions. A, Physical metallurgy and materials science. 2010, Vol 41, Num 13, pp 3386-3395, issn 1073-5623, 10 p.Article

Effect of Sn on the Dehydrogenation Process of TiH2 in Al FoamsAGUIRRE-PERALES, Lydia Y; JUNG, In-Ho; DREW, Robin A. L et al.Metallurgical and materials transactions. A, Physical metallurgy and materials science. 2012, Vol 43, Num 1, pp 1-5, issn 1073-5623, 5 p.Article

Microstructure and corrosion behaviour of aluminium containing a small addition of tin = Microstructure et comportement à la corrosion de l'aluminium contenant une petite addition d'étainERB, V; AUST, K. T.Journal of materials science letters. 1984, Vol 3, Num 7, pp 585-587, issn 0261-8028Article

Effect of Sn addition on the corrosion behavior of Ti-Ta alloyGUO, B; TONG, Y. X; CHEN, F et al.Materials and corrosion (1995). 2012, Vol 63, Num 3, pp 259-263, issn 0947-5117, 5 p.Article

Effect of Sn Additions on the Damage Tolerance of a ZrCuNiAl Bulk Metallic GlassYUAN, C. C; XIA, X. X; JIANG, K. H et al.Metallurgical and materials transactions. A, Physical metallurgy and materials science. 2013, Vol 44, Num 2, pp 819-826, issn 1073-5623, 8 p.Article

Effects of Cu, Sn and W on the rate of nitrogen dissociation on the surface of molten ironONO-NAKAZATO, Hideki; DOHI, Yusuke; YAMADA, Daisuke et al.ISIJ international. 2006, Vol 46, Num 9, pp 1306-1311, issn 0915-1559, 6 p.Article

Effect of Sn on the Characteristic Solidification Temperatures of AlSi6Cu4 Alloy = Auswirkung von Sn auf die charakteristischen Erstarrungstemperaturen einer AlSi6Cu4-LegierungDJURDJEVIC, M; MUCHE, D; STAUDER, B et al.Praktische Metallographie. 2012, Vol 49, Num 6, pp 356-376, issn 0032-678X, 21 p.Article

Influence of Tin Addition on the Microstructure and Mechanical Properties of Al-Si-Cu-Mg and Al-Si-Mg Casting AlloysMOHAMED, A. M. A; SAMUEL, F. H; SAMUEL, A. M et al.Metallurgical and materials transactions. A, Physical metallurgy and materials science. 2008, Vol 39, Num 3, pp 490-501, issn 1073-5623, 12 p.Article

Effects of Sn segregation and precipitates on creep response of Mg-Sn alloysHUANG, Y; DIERINGA, H; KAINER, K. U et al.Fatigue & fracture of engineering materials & structures (Print). 2013, Vol 36, Num 4, pp 308-315, issn 8756-758X, 8 p.Article

Effect of Sn Grain Orientation on the Cu6Sn5 Formation in a Sn-Based Solder Under Current StressingLIN, Chih-Fan; LEE, Shang-Hua; CHEN, Chih-Ming et al.Metallurgical and materials transactions. A, Physical metallurgy and materials science. 2012, Vol 43, Num 8, pp 2571-2573, issn 1073-5623, 3 p.Article

TEM and ESCA observations of copper deposits containing tin impuritiesYOKOTA, T; KANEKO, H; HANZAWA, N et al.Hyomen gijutsu. 1998, Vol 49, Num 5, pp 519-524, issn 0915-1869Article

Effects of rotational stirring on Zn-0.05% Sn alloy castingsHOSHINO, K; NAGADOME, Y; SAKAI, T et al.Imono. 1996, Vol 68, Num 2, pp 124-129, issn 0021-4396Article

Sintering of lead bronze containing tinKUMAR, S; UPADHYAYA, G. S; VAIDYA, M. L et al.Journal of materials engineering. 1991, Vol 13, Num 3, pp 237-242, issn 0931-7058Article

Lokalizace koncentrac = The determination of the concentration distribution of admixtures in the sample by using X-ray spectrometric analysisHABRMAN, P.Sborník vědeckých prací Vysoké školy báňské v Ostravě. Řada hornicko-geologická. 1984, Vol 30, Num 2, pp 135-146, issn 0474-8476Article

Measurement of kinetics of surface segregation via the linear heating method : an experimental evaluationDU PLESSIS, J; VILJOEN, E. C.Surface science. 1996, Vol 357-58, pp 905-909, issn 0039-6028Conference Paper

Undercooling, crystal growth and grain structure of levitation melted pure Ge and Ge-Sn alloysLI, D; ECKLER, K; HERLACH, D. M et al.Acta materialia. 1996, Vol 44, Num 6, pp 2437-2443, issn 1359-6454Article

Effect of tin addition on primary silicon recovery in Si―Al melt during solidification refining of siliconJIAYAN LI; YAO LIU; YI TAN et al.Journal of crystal growth. 2013, Vol 371, pp 1-6, issn 0022-0248, 6 p.Article

USE OF MOULD WASHES CONTAINING TIN AND ANTIMONY TO REGULATE THE SURFACE STRUCTURE OF CORED IRON CASTINGSBUTLIN IJ; WARWICK ME.1982; FOUNDRY TRADE J.; GBR; DA. 1982-02-11; VOL. 152; NO 3231; PP. 166, 168-169, 171; BIBL. 13 REF.Article

Influence of antimony doping on structure and conductivity of tin oxide whiskersZHUKOVA, A. A; RUMYANTSEVA, M. N; ABAKUMOV, A. M et al.Thin solid films. 2010, Vol 518, Num 4, pp 1359-1362, issn 0040-6090, 4 p.Conference Paper

Anomalous temperature dependence of the conductivity of nanoporous ITO filmsRYZHIKOV, I. A; PUKHOV, A. A; IL'IN, A. S et al.Microelectronic engineering. 2003, Vol 69, Num 2-4, pp 270-273, issn 0167-9317, 4 p.Conference Paper

Photorefractive properties of CdTe :SnSHCHERBIN, K; VOLKOV, V; RUDENKO, V et al.Physica status solidi. A. Applied research. 2001, Vol 183, Num 2, pp 337-343, issn 0031-8965Article

Sn segregation to the low index surfaces of a copper single crystalDU PLESSIS, J; VILJOEN, E. C.Applied surface science. 1996, Vol 100-01, pp 222-225, issn 0169-4332Conference Paper

Effect of small tin additions on the structure of hypereutectic siluminBRODOVA, I. G; BASHLYKOV, D. V; POLENTS, I. V et al.Physics of metals and metallography. 1995, Vol 79, Num 4, pp 425-429, issn 0031-918XArticle

Localized vibrational modes in perfect crystalsSIEVERS, A. J; KISELEV, S. A; BICKHAM, S. R et al.Journal of luminescence. 1994, Vol 58, Num 1-6, pp 37-42, issn 0022-2313Conference Paper

Bulk-to-surface diffusion measurements in a (111)Cu(0.1 at.%)Sn single crystal using a linear programmed heating methodVILJOEN, E. C; DU PLESSIS, J.Surface and interface analysis. 1994, Vol 22, Num 1-12, pp 598-601, issn 0142-2421Conference Paper

  • Page / 82