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Materials behaviour and intermetallics characteristics in the reaction between SnAgCu and Sn-Pb solder alloysCHANGQING LIU; ZHIHENG HUANG; CONWAY, Paul P et al.Journal of materials science. 2007, Vol 42, Num 11, pp 4076-4086, issn 0022-2461, 11 p.Article

Vibration fracture behavior of Sn-9Zn-xCu lead-free soldersHUNG, Fei-Yi; LUI, Truan-Sheng; CHEN, Li-Hui et al.Journal of materials science. 2007, Vol 42, Num 11, pp 3865-3873, issn 0022-2461, 9 p.Article

Correlation between interfacial microstructure and shear behavior of Sn-Ag-Cu solder ball joined with Sn-Zn-Bi pasteSHIH, Po-Cheng; LIN, Kwang-Lung.Journal of materials science. 2007, Vol 42, Num 8, pp 2574-2581, issn 0022-2461, 8 p.Article

Kinetics of interface reaction and intermetallics growth of Sn-3.5Ag-0.7Cu/Au/Ni/Cu system under isothermal agingSHI, X. Q; KWAN, H. F; NAI, S. M. L et al.Journal of materials science. 2004, Vol 39, Num 3, pp 1095-1099, issn 0022-2461, 5 p.Article

Préparation de perles boratées à partir d'éclats et de limailles métalliques: exemple de la fusion d'un alliage étain plomb = Preparation of borated pearls: example of the fusion of a tin-lead alloyGAGNON, J.-P.Journal de physique. IV. 2002, Vol 97, pp pr6.69-pr6.76, issn 1155-4339Conference Paper

Formation of bulk Cu6Sn5 intermetallic compounds in Sn-Cu lead-free solders during solidificationSHEN, J; LIU, Y. C; GAO, H. X et al.Journal of materials science. 2007, Vol 42, Num 14, pp 5375-5380, issn 0022-2461, 6 p.Article

The effect of alloying element gallium on the polarization characteristics of Pb-free Sn-Zn-Ag-Al-XGa solders in NaCl solutionMOHANTY, Udit S; LIN, Kwang-Lung.Corrosion science. 2006, Vol 48, Num 3, pp 662-678, issn 0010-938X, 17 p.Article

The Measurement of Thermal Conductivity Variation with Temperature for Sn-Based Lead-Free Binary SoldersDEMIR, Mustafa; AKSÖZ, Sezen; ÖZTÜRK, Esra et al.Metallurgical and materials transactions. B, Process metallurgy and materials processing science. 2014, Vol 45, Num 5, pp 1739-1749, issn 1073-5615, 11 p.Article

Dissolution and Interface Reactions between Palladium and Tin (Sn)-Based Solders: Part I. 95.5Sn-3.9Ag-0.6Cu AlloyVIANCO, Paul T; REJENT, Jerome A; ZENDER, Gary L et al.Metallurgical and materials transactions. A, Physical metallurgy and materials science. 2010, Vol 41, Num 12, pp 3042-3052, issn 1073-5623, 11 p.Article

Influence of the Substrate on the Creep of SN Solder JointsLEE, K.-O; MORRIS, J. W; HUA, F et al.Metallurgical and materials transactions. A, Physical metallurgy and materials science. 2010, Vol 41, Num 7, pp 1805-1814, issn 1073-5623, 10 p.Article

Microstructural and mechanical properties of Sn-Ag-Cu lead-free solders with minor addition of Ni and/or CoFANGJIE CHENG; NISHIKAWA, Hiroshi; TAKEMOTO, Tadashi et al.Journal of materials science. 2008, Vol 43, Num 10, pp 3643-3648, issn 0022-2461, 6 p.Article

Modelling of rheological behaviour of semisolid metal slurries. Part 3: Transient state behaviourCHEN, J. Y; FAN, Z.Materials science and technology. 2002, Vol 18, Num 3, pp 250-257, issn 0267-0836Article

Interfacial reaction between Sn-1Bi-5In-9Zn solder and Cu substrateSEUNG WOOK YOON; WON KYOUNG CHOI; HYUCK MO LEE et al.Scripta materialia. 1999, Vol 40, Num 3, pp 327-332, issn 1359-6462Article

The crystal structure of AuNi2Sn4NEUMANN, A; KJEKSHUS, A; RØMMING, C et al.Journal of solid state chemistry (Print). 1995, Vol 119, Num 1, pp 142-146, issn 0022-4596Article

Indentation creep and mechanical properties of quaternary Sn-Sb based alloysEL-BEDIWI, A; LASHIN, A. R; MOSSA, M et al.Materials science & engineering. A, Structural materials : properties, microstructure and processing. 2011, Vol 528, Num 10-11, pp 3568-3572, issn 0921-5093, 5 p.Article

Risk of whiskers formation on the surface of commercially available tin-rich alloys under thermal shocksSKWAREK, Agata; WITEK, Krzysztof; RATAJCZAK, Jacek et al.Microelectronics and reliability. 2009, Vol 49, Num 6, pp 569-572, issn 0026-2714, 4 p.Article

Rate-dependent indentation behavior of solder alloysWANG, Feng-Jiang; XIN MA; QIAN, Yi-Yu et al.Journal of materials science. 2005, Vol 40, Num 8, pp 1923-1928, issn 0022-2461, 6 p.Article

Evaluation of a rayleigh-number-based freckle criterion for Pb-Sn alloys and Ni-base superalloysRAMIREZ, J. C; BECKERMANN, C.Metallurgical and materials transactions. A, Physical metallurgy and materials science. 2003, Vol 34, Num 7, pp 1525-1536, issn 1073-5623, 12 p.Article

Heat flow parameters affecting dendrite spacings during unsteady-state solidification of Sn-Pb and Al-Cu alloysROCHA, Otavio L; SIQUEIRA, Claudio A; GARCIA, Amauri et al.Metallurgical and materials transactions. A, Physical metallurgy and materials science. 2003, Vol 34, Num 4, pp 995-1006, issn 1073-5623, 12 p.Article

Solidification behavior of the remnant liquid in the sheared semisolid slurry of Sn-15 wt.%Pb alloyJI, S; DAS, A; FAN, Z et al.Scripta materialia. 2002, Vol 46, Num 3, pp 205-210, issn 1359-6462, 6 p.Article

Corrosion Behavior of Sn-3.0Ag-0.5Cu Lead-Free Solder in Potassium Hydroxide ElectrolyteMUI CHEE LIEW; AHMAD, Ibrahym; LIU MEI LEE et al.Metallurgical and materials transactions. A, Physical metallurgy and materials science. 2012, Vol 43, Num 10, pp 3742-3747, issn 1073-5623, 6 p.Article

Modeling of the in-flight solidification of droplets produced by the uniform-droplet spray processSURESH KUMAR PILLAI; ANDO, Teiichi.International journal of thermal sciences. 2009, Vol 48, Num 8, pp 1494-1500, issn 1290-0729, 7 p.Article

Temperature dependence of anelastic properties in Sn-Ag-Cu system and Sn-3.5Ag alloys of lead-free soldersNAKAMURA, Y; ONO, T.Journal of materials science. 2005, Vol 40, Num 12, pp 3267-3269, issn 0022-2461, 3 p.Article

Propriétés des alliages. Etain et alliages d'étain = Alloys properties. Tin anad tin alloysDELWASSE, André.Techniques de l'ingénieur. Matériaux métalliques. 1983, Vol MB5, Num M520, pp M520.1-M520.14, issn 1762-8733Article

Depressing effect of 0.1 wt.% Cr addition into Sn-9Zn solder alloy on the intermetallic growth with Cu substrate during isothermal agingJIN HU; ANMIN HU; MING LI et al.Materials characterization. 2010, Vol 61, Num 3, pp 355-361, issn 1044-5803, 7 p.Article

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