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Impact of Illumination on Model -Based SRAF Placement for Contact PatterningSTURTEVANT, John L; JAYARAM, Srividya; EL-SEWEFY, Omar et al.Proceedings of SPIE, the International Society for Optical Engineering. 2010, Vol 7640, issn 0277-786X, isbn 978-0-8194-8054-5 0-8194-8054-1, 764036.1-764036.6, 2Conference Paper
Study of Devices Leakage of 45nm node with Different SRAM Layouts Using an Advanced e-beam Inspection SystemsHONG XIAO; LONG MA; YAN ZHAO et al.Proceedings of SPIE, the International Society for Optical Engineering. 2009, Vol 7272, issn 0277-786X, isbn 978-0-8194-7525-1 0-8194-7525-4, 72721E.1-72721E.10, 2Conference Paper
Advanced microlithography process with chemical shrink technologyKANDA, Takashi; TANAKA, Hatsuyuki; KINOSHITA, Yoshiaki et al.SPIE proceedings series. 2000, pp 881-889, isbn 0-8194-3617-8Conference Paper
TSV constraints related to temperature excursion, pressure during molding, materials used and handling loadsFATAT, Tomasz; FRIEDEL, Kazimierz; MARENCO, Norman et al.Microsystem technologies. 2009, Vol 15, Num 1, pp 181-190, issn 0946-7076, 10 p.Article
Diblock copolymer directed self- assembly for CMOS device fabricationCHANG, Li-Wen; WONG, H.-S. Philip.Proceedings of SPIE, the International Society for Optical Engineering. 2006, pp 615611.1-615611.6, issn 0277-786X, isbn 0-8194-6199-7, 1VolConference Paper
Error factor in bottom CD measurement for contact hole using CD-SEMABE, Hideaki; YAMAZAKI, Yuichiro.Proceedings of SPIE, the International Society for Optical Engineering. 2006, issn 0277-786X, isbn 0-8194-6195-4, 2Vol, vol 2, 61524H.1-61524H.9Conference Paper
Copy result exactly using EB-scope technologyYARAADA, Keizo; USHIKI, Takeo; ITAGAKI, Yousuke et al.SPIE proceedings series. 2003, pp 21-30, isbn 0-8194-4846-X, 10 p.Conference Paper
Reliability evaluation of high Density microvia structuresJOSHI, Jaydutt; MARQUEZ, Ursula; PRIMAVERA, Anthony et al.SPIE proceedings series. 2002, pp 249-254, isbn 0-930815-65-3Conference Paper
A novel Resist material for sub-100nm contact hole patternCHUNG, Jeong-Hee; CHOI, Sang-Jun; YOOL KANG et al.SPIE proceedings series. 2000, pp 305-312, isbn 0-8194-3617-8Conference Paper
The influence of topographical variations on reliable via and contact formationHEALEY, J. T; RUBEL, S.SPIE proceedings series. 1998, pp 131-145, isbn 0-8194-2966-XConference Paper
Micronetworking: reliable communication on 3D integrated circuitsCONTRERAS, A. A; MOON, T. K; DASU, A et al.Electronics letters. 2010, Vol 46, Num 4, pp 291-293, issn 0013-5194, 3 p.Article
Conformal mapping in microlithographyKLATCHKO, Asher; PIROGOVSKY, Peter.SPIE proceedings series. 2004, pp 291-300, isbn 0-8194-5513-X, 2Vol, 10 p.Conference Paper
Frequency behavior of ground plane via interconnections in multilayer LTCC-modulesTHELEMANN, T; THUST, H.SPIE proceedings series. 1997, pp 350-355, isbn 0-930815-50-5Conference Paper
Enhancing productivity and sensitivity in mask production via a Fast Integrated die-to-database T+R InspectionLU, Eric Haodong; WU, David; CHEN, Ellison et al.Proceedings of SPIE, the International Society for Optical Engineering. 2007, pp 673026.1-673026.13, issn 0277-786X, isbn 978-0-8194-6887-1Conference Paper
A proposal for the contact hole assist feature printing checker in IML<TM>SHIEH, Jason; SOCHA, Robert; XUELONG SHI et al.Proceedings of SPIE, the International Society for Optical Engineering. 2006, issn 0277-786X, isbn 0-8194-5853-8, 2Vol, Part 2, 672-677Conference Paper
Advanced multilayer polyimide substrate utilizing UV laser microvia technologyCORBETT, Scott; STROLE, Jeff; ROSS, Ben et al.SPIE proceedings series. 2000, pp 212-216, isbn 0-930815-62-9Conference Paper
Low-pressure etching of nanostructures and via holes using an inductively coupled plasma systemBERG, E. W; PANG, S. W.Journal of the Electrochemical Society. 1999, Vol 146, Num 2, pp 775-779, issn 0013-4651Article
A new gas circulation RIEOHIWA, T; SAKAI, I; OKUMURA, K et al.IEEE international symposium on semiconductor manufacturing conference. 1999, pp 259-262, isbn 0-7803-5403-6Conference Paper
3D features measurement using YieldStar, an angle resolved polarized scatterometerCHARLEY, Anne-Laure; LERAY, Philippe; D'HAVE, Koen et al.Proceedings of SPIE, the International Society for Optical Engineering. 2011, Vol 7971, issn 0277-786X, isbn 978-0-8194-8530-4, 79715E.1-79715E.7, 2Conference Paper
Liquid crystal micro-cells: collective fabrication of individual micro-cellsCASTANY, Olivier; DUPONT, Laurent.Journal of micromechanics and microengineering (Print). 2010, Vol 20, Num 6, issn 0960-1317, 065019.1-065019.4Article
60nm half pitch contact layer printing : exploring the limits at 1.35NA lithographyBEKAERT, Joost; HENDRICKX, Eric; VANDENBERGHE, Geert et al.Proceedings of SPIE, the International Society for Optical Engineering. 2008, pp 69243A.1-69243A.12, issn 0277-786X, isbn 978-0-8194-7109-3Conference Paper
Passive multiplexer test structure for fast and accurate contact and via fail-rate evaluationHESS, Christopher; STINE, Brian E; WEILAND, Larg H et al.IEEE transactions on semiconductor manufacturing. 2003, Vol 16, Num 2, pp 259-265, issn 0894-6507, 7 p.Conference Paper
Modeling complex via hole structuresLAERMANS, Eric; DE GEEST, Jan; DE ZUTTER, Daniël et al.IEEE transactions on advanced packaging. 2002, Vol 25, Num 2, pp 206-214, issn 1521-3323, 9 p.Conference Paper
Role of temperature gradients in blanket tungsten for microelectronic contactsDEEPAK; GAUR, Anshu.Semiconductor science and technology. 2001, Vol 16, Num 8, pp 665-675, issn 0268-1242Article
Effects of Mask bias on the Mask Error Enhancement Factor (MEEF) of contact holesKANG, Doris; ROBERTSON, Stewart; REILLY, Michael et al.SPIE proceedings series. 2001, pp 858-868, isbn 0-8194-4032-9, 2VolConference Paper