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Gold wire bonding on low-K material a new challenge for interconnection technologyBINNER, Ralph; SCHOPPER, Andreas; CASTANEDA, Jimmy et al.IEEE/CPMT/SEMI international electronics manufacturing technology. Symposium. 2004, pp 13-17, isbn 0-7803-8582-9, 1Vol, 5 p.Conference Paper

COPPER WIRE BONDINGMAYER, Michael; LAI, YI-Shao.Microelectronics and reliability. 2011, Vol 51, Num 1, issn 0026-2714, 189 p.Serial Issue

Design of thermal imprinting system with uniform residual thicknessSHIN, Won-Ho.Microelectronic engineering. 2009, Vol 86, Num 11, pp 2222-2227, issn 0167-9317, 6 p.Article

The emergence of high volume copper ball bondingDELEY, Michael.IEEE/CPMT/SEMI international electronics manufacturing technology. Symposium. 2004, pp 186-190, isbn 0-7803-8582-9, 1Vol, 5 p.Conference Paper

Wire bonding of low-k devicesZHONG, Z. W.Microelectronics international. 2008, Vol 25, Num 3, pp 19-25, issn 1356-5362, 7 p.Article

A new bonding-tool solution to improve stitch bondabilityGOH, K. S; ZHONG, Z. W.Microelectronic engineering. 2007, Vol 84, Num 1, pp 173-179, issn 0167-9317, 7 p.Article

Fine and ultra-fine pitch wire bonding: challenges and solutionsZHONG, Z. W.Microelectronics international. 2009, Vol 26, Num 2, pp 10-18, issn 1356-5362, 9 p.Article

Suppression of Microwave Resonances in Wirebond Transitions Between Conductor-Backed Coplanar WaveguidesLIM, Juhwan; KIM, Gyoungbum; HWANG, Sungwoo et al.IEEE microwave and wireless components letters. 2008, Vol 18, Num 1, pp 31-33, issn 1531-1309, 3 p.Article

Wire bonding using copper wireZHONG, Z. W.Microelectronics international. 2009, Vol 26, Num 1, pp 10-16, issn 1356-5362, 7 p.Article

A broadband 8-18GHz 4-input 4-output butler matrixMILNER, Leigh; PARKER, Michael.Proceedings of SPIE, the International Society for Optical Engineering. 2007, pp 641406.1-641406.9, issn 0277-786X, isbn 978-0-8194-6522-1, 1VolConference Paper

Wirebond crosstalk and cavity modes in large chip mounts for superconducting qubitsWENNER, J; NEELEY, M; MARTINIS, John M et al.Superconductor science & technology (Print). 2011, Vol 24, Num 6, issn 0953-2048, 065001.1-065001.7Article

Wire bonding using insulated wire and new challenges in wire bondingZHONG, Z. W.Microelectronics international. 2008, Vol 25, Num 2, pp 9-14, issn 1356-5362, 6 p.Article

Guidelines for improving intermetallic reliabilityLEVINE, Lee; OSBORNE, Matt; KELLER, Rank et al.IEEE/CPMT/SEMI international electronics manufacturing technology. Symposium. 2004, pp 174-176, isbn 0-7803-8582-9, 1Vol, 3 p.Conference Paper

Role of impact ultrasound on bond strength and Al pad splash in Cu wire bondingREZVANI, A; SHAH, A; MAYER, M et al.Microelectronics and reliability. 2013, Vol 53, Num 7, pp 1002-1008, issn 0026-2714, 7 p.Article

Cu wire bond parameter optimization on various bond pad metallization and barrier layer material schemesENGLAND, Luke; SIEW TZE ENG; LIEW, Chris et al.Microelectronics and reliability. 2011, Vol 51, Num 1, pp 81-87, issn 0026-2714, 7 p.Article

Advanced wire bond looping technology for emerging packagesBRUNNER, Jon; QIN, Ivy Wei; CHYLAK, Bob et al.IEEE/CPMT/SEMI international electronics manufacturing technology. Symposium. 2004, pp 85-90, isbn 0-7803-8582-9, 1Vol, 6 p.Conference Paper

Analogously tunable delay line for on-chip measurements with sub-picosecond resolution in 90 nm CMOSSCHIDL, S; SCHWEIGER, K; GABERL, W et al.Electronics letters. 2012, Vol 48, Num 15, pp 910-911, issn 0013-5194, 2 p.Article

Challenges and developments of copper wire bonding technologyPEISHENG LIU; LIANGYU TONG; JINLAN WANG et al.Microelectronics and reliability. 2012, Vol 52, Num 6, pp 1092-1098, issn 0026-2714, 7 p.Article

Optimization of the Cu wire bonding process for IC assembly using Taguchi methodsSU, Chao-Ton; YEH, Cheng-Jung.Microelectronics and reliability. 2011, Vol 51, Num 1, pp 53-59, issn 0026-2714, 7 p.Article

Cu wire bond microstructure analysis and failure mechanismYU, Cheng-Fu; CHAN, Chi-Ming; CHAN, Li-Chun et al.Microelectronics and reliability. 2011, Vol 51, Num 1, pp 119-124, issn 0026-2714, 6 p.Article

An impact force compensation algorithm based on a piezo force sensor for wire bonding processesKIM, Jung-Han; YIM, Chung-Hyuk.Control engineering practice. 2008, Vol 16, Num 6, pp 685-696, issn 0967-0661, 12 p.Article

Automatic Wire Bonder Designed for MEMS PackagingYANJIE LIU; YUETAO LIU; LINING SUN et al.Symposium on design, test, integration and packaging of MEMS-MOEMS. 2008, pp 21-23, isbn 978-2-35500-006-5, 1Vol, 3 p.Conference Paper

3-D packaging : Where all technologies come togetherKARNEZOS, Marcos.IEEE/CPMT/SEMI international electronics manufacturing technology. Symposium. 2004, pp 64-67, isbn 0-7803-8582-9, 1Vol, 4 p.Conference Paper

Wafer sawing process characterization for thin die (75 micron) applicationsPAYDENKAR, Chetan; PODDAR, Anindya; CHANDRA, Haryanto et al.IEEE/CPMT/SEMI international electronics manufacturing technology. Symposium. 2004, pp 74-77, isbn 0-7803-8582-9, 1Vol, 4 p.Conference Paper

A TSV-Based Bio-Signal Package With μ-Probe ArrayCHOU, Lei-Chun; LEE, Shih-Wei; CHEN, Kuo-Hua et al.IEEE electron device letters. 2014, Vol 35, Num 2, pp 256-258, issn 0741-3106, 3 p.Article

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