au.\*:("VERMEERSCH, B")
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A shortcut to inverse Fourier transforms: Approximate reconstruction of transient heating curves from sparse frequency domain dataVERMEERSCH, B; DE MEY, G.International journal of thermal sciences. 2010, Vol 49, Num 8, pp 1319-1332, issn 1290-0729, 14 p.Article
BEM calculation of the complex thermal impedance of microelectronic devicesVERMEERSCH, B; DE MEY, G.Engineering analysis with boundary elements. 2007, Vol 31, Num 4, pp 289-298, issn 0955-7997, 10 p.Article
Anomalous thermal behaviour in small electronic devices : non-uniformity and overshoot in dynamic temperature distributionsVERMEERSCH, B; DE MEY, G.Journal of physics. D, Applied physics (Print). 2007, Vol 40, Num 8, pp 2452-2463, issn 0022-3727, 12 p.Article
Influence of thermal contact resistance on thermal impedance of microelectronic structuresVERMEERSCH, B; DE MEY, G.Microelectronics and reliability. 2007, Vol 47, Num 8, pp 1233-1238, issn 0026-2714, 6 p.Article
Thermal impedance plots of micro-scaled devicesVERMEERSCH, B; DE MEY, G.Microelectronics and reliability. 2006, Vol 46, Num 1, pp 174-177, issn 0026-2714, 4 p.Article
Dynamic electrothermal simulation of integrated resistors at device levelVERMEERSCH, B; DE MEY, G.Microelectronics journal. 2009, Vol 40, Num 9, pp 1411-1416, issn 0959-8324, 6 p.Conference Paper
Dependency of thermal spreading resistance on convective heat transfer coefficientVERMEERSCH, B; DE MEY, G.Microelectronics and reliability. 2008, Vol 48, Num 5, pp 734-738, issn 0026-2714, 5 p.Article
Influence of substrate thickness on thermal impedance of microelectronic structuresVERMEERSCH, B; DE MEY, G.Microelectronics and reliability. 2007, Vol 47, Num 2-3, pp 437-443, issn 0026-2714, 7 p.Article
Thermal impedances of thin platesDE MEY, G; VERMEERSCH, B; BANASZCZYK, J et al.International journal of heat and mass transfer. 2007, Vol 50, Num 21-22, pp 4457-4460, issn 0017-9310, 4 p.Article
Value of endoscopic injection sclerotherapy in the treatment of bleeding varicesDE VOS, M; ELEWAUT, A; DE KEYSER, K et al.Acta endoscopica. 1988, Vol 18, Num 4, pp 273-276, issn 0240-642X, 4 p.Article
Influence of interface materials on the thermal impedance of electronic packagesDE MEY, G; PILARSKI, J; WOJCIK, M et al.International communications in heat and mass transfer. 2009, Vol 36, Num 3, pp 210-212, issn 0735-1933, 3 p.Article
Évaluation de la dépense énergétique de l'ambulation pendulaire unilatérale avec cannes antibrachiales = Evaluation of energy expenditure of pendulous ambulation with antibrachial crutchesVERMEERSCH, B; BOSLE, J.-P; PORTERO, P et al.Annales de kinésithérapie. 1996, Vol 23, Num 6, pp 290-295, issn 0302-427XArticle
Effect of cisapride on relapse of reflux oesophagitis, healed with an antisecretory drugTYTGAT, G. N. J; ANKER HANSEN, O. J; SOLHAUG, O. H et al.Scandinavian journal of gastroenterology. 1992, Vol 27, Num 3, pp 175-183, issn 0036-5521Article
Possibilities and limitations of blue electroluminescence in CaS:Pb2+ thin filmsPOELMAN, D; VAN MEIRHAEGHE, R. L; VERMEERSCH, B. A et al.Journal of physics. D, Applied physics (Print). 1997, Vol 30, Num 3, pp 465-467, issn 0022-3727Article