NOTIZ UEBER DIE PHOSPHOR-SELENID-JODIDE P₂SE₂J₄, P₂SEJ₄ UND PSEJ₃ = SUR LES SELENOIODURES DE PHOSPHORE P₂SE₂I₄, P₂SEI₄ ET PSEI₃BAUDLER M; VOLLAND B; VALPERTZ HW et al.1973; CHEM. BER.; DTSCH.; DA. 1973; VOL. 106; NO 3; PP. 1049-1051; BIBL. 13 REF.Serial Issue

The effects of income inequality on BMI and obesity : Evidence from the BRFSS = Les effets de l'inégalité du revenu sur l'indice de masse corporelle et l'obésité : résultats issus du BRFSS (Behavioral Risk Factor Surveillance System)VOLLAND, B.2012, 25 p.Report

Aspect ratio dependent plasma polymer deposition of fluorocarbonsVOLLAND, B. E; RANGELOW, I. W.Microelectronic engineering. 2006, Vol 83, Num 4-9, pp 1174-1177, issn 0167-9317, 4 p.Conference Paper

Electrostatically driven microgripperVOLLAND, B. E; HEERLEIN, H; RANGELOW, I. W et al.Microelectronic engineering. 2002, Vol 61-62, pp 1015-1023, issn 0167-9317Conference Paper

New method for the precise flux calculation of neutrals for arbitrary surfaces in profile etch simulationsHAUGUTH, M; DANZ, T; VOLLAND, B. E et al.Microelectronic engineering. 2008, Vol 85, Num 5-6, pp 982-984, issn 0167-9317, 3 p.Conference Paper

Characterization of an electro-thermal micro gripper and tip sharpening using FIB techniqueDEUTSCHINGER, A; SCHMID, U; SCHNEIDER, M et al.Microsystem technologies. 2010, Vol 16, Num 11, pp 1901-1908, issn 0946-7076, 8 p.Article

Noncontacting laser-based techniques for the determination of elastic constants of thin silicon membranesWEISS, B; KLEIN, M; SOSSNA, E et al.Microelectronic engineering. 2001, Vol 57-58, pp 475-479, issn 0167-9317Conference Paper

The application of secondary effects in high aspect ratio dry etching for the fabrication of MEMSVOLLAND, B. E; HEERLEIN, H; KOSTIC, I et al.Microelectronic engineering. 2001, Vol 57-58, pp 641-650, issn 0167-9317Conference Paper

Determination of residual stress and elastic constants of silicon open stencil masks for Ion Projection LithographyDEGEN, A; SHI, F; SOSSNA, E et al.SPIE proceedings series. 1999, pp 113-122, isbn 0-8194-3139-7Conference Paper

Integrated plasma processing simulation framework, linking tool scale plasma models with 2D feature scale etch simulatorHAUGUTH, M; VOLLAND, B. E; ISHCHUK, V et al.Microelectronic engineering. 2009, Vol 86, Num 4-6, pp 976-978, issn 0167-9317, 3 p.Conference Paper

Duo-action electro thermal micro gripperVOLLAND, B. E; IVANOVA, K; IVANOV, Tzv et al.Microelectronic engineering. 2007, Vol 84, Num 5-8, pp 1329-1332, issn 0167-9317, 4 p.Conference Paper